SG171589A1 - Release film for semiconductor resin molds - Google Patents
Release film for semiconductor resin moldsInfo
- Publication number
- SG171589A1 SG171589A1 SG201102825-5A SG2011028255A SG171589A1 SG 171589 A1 SG171589 A1 SG 171589A1 SG 2011028255 A SG2011028255 A SG 2011028255A SG 171589 A1 SG171589 A1 SG 171589A1
- Authority
- SG
- Singapore
- Prior art keywords
- layer
- oxide
- release film
- release
- resin molds
- Prior art date
Links
- 239000011347 resin Substances 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 229910044991 metal oxide Inorganic materials 0.000 abstract 2
- 150000004706 metal oxides Chemical class 0.000 abstract 2
- 230000035699 permeability Effects 0.000 abstract 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract 1
- 239000005977 Ethylene Substances 0.000 abstract 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 abstract 1
- 238000011109 contamination Methods 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 abstract 1
- 239000000395 magnesium oxide Substances 0.000 abstract 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 1
- 239000008096 xylene Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006120573 | 2006-04-25 | ||
| JP2006191872 | 2006-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG171589A1 true SG171589A1 (en) | 2011-06-29 |
Family
ID=38655360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG201102825-5A SG171589A1 (en) | 2006-04-25 | 2007-04-20 | Release film for semiconductor resin molds |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US20090053528A1 (ja) |
| EP (1) | EP2012351A4 (ja) |
| JP (1) | JP5234419B2 (ja) |
| KR (1) | KR20090018032A (ja) |
| CN (1) | CN101427358B (ja) |
| SG (1) | SG171589A1 (ja) |
| TW (1) | TW200804052A (ja) |
| WO (1) | WO2007125834A1 (ja) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010041542A1 (ja) | 2008-10-09 | 2010-04-15 | 旭硝子株式会社 | 暗色系フッ素樹脂フィルムおよび太陽電池モジュール用バックシート |
| CN102246317B (zh) | 2008-12-08 | 2016-03-16 | 旭硝子株式会社 | 氟树脂薄膜及其使用 |
| JP5060517B2 (ja) * | 2009-06-24 | 2012-10-31 | 東京エレクトロン株式会社 | インプリントシステム |
| US9064693B2 (en) * | 2010-03-01 | 2015-06-23 | Kirsteen Mgmt. Group Llc | Deposition of thin film dielectrics and light emitting nano-layer structures |
| JP5636725B2 (ja) * | 2010-04-26 | 2014-12-10 | 大日本印刷株式会社 | モールディング成形用離型フィルム及びその製造方法 |
| US9351348B2 (en) * | 2010-10-27 | 2016-05-24 | Koninklijke Philips N.V. | Laminate support film for fabrication of light emitting devices and method of fabrication |
| DE102011089566A1 (de) * | 2011-12-22 | 2013-06-27 | Tesa Se | Liner zum Schutz von Klebemassen |
| TWI615271B (zh) * | 2012-09-20 | 2018-02-21 | Ｊｘ日鑛日石金屬股份有限公司 | 附載體金屬箔 |
| KR101486052B1 (ko) * | 2013-07-03 | 2015-01-23 | 고병수 | 반도체 패키지 제조용 몰드 이형시트 및 제조방법 |
| DE102013221847A1 (de) * | 2013-08-01 | 2015-02-05 | Tesa Se | Verfahren zum Formen eines Körpers in einer Form |
| MY173073A (en) | 2013-11-07 | 2019-12-24 | Agc Inc | Mold release film and process for producing semiconductor package |
| MY176541A (en) * | 2013-11-07 | 2020-08-14 | Agc Inc | Mold release film and process for producing semiconductor package |
| JPWO2015133630A1 (ja) * | 2014-03-07 | 2017-04-06 | 旭硝子株式会社 | 離型フィルム、その製造方法、および半導体パッケージの製造方法 |
| MY182272A (en) * | 2014-03-07 | 2021-01-18 | Agc Inc | Mold release film and process for producing sealed body |
| CN106062947B (zh) * | 2014-03-07 | 2019-03-05 | Ａｇｃ株式会社 | 半导体元件安装用封装体的制造方法以及脱模膜 |
| DE112015005259T5 (de) | 2014-11-20 | 2017-08-17 | Asahi Glass Company, Limited | Formwerkzeugtrennfilm, Verfahren zu dessen Herstellung und Verfahren zur Herstellung eines Halbleitergehäuses |
| JP2019504783A (ja) * | 2016-02-01 | 2019-02-21 | スリーエム イノベイティブ プロパティズ カンパニー | バリア複合体 |
| KR101682934B1 (ko) | 2016-03-17 | 2016-12-06 | 김광원 | 메모리 반도체 패키지 몰드용 이형필름 |
| JP6928924B2 (ja) * | 2017-04-21 | 2021-09-01 | 三井化学東セロ株式会社 | プロセス用離型フィルム、その用途、及びそれを用いた樹脂封止半導体の製造方法 |
| JP2019149414A (ja) * | 2018-02-26 | 2019-09-05 | Tdk株式会社 | 積層型電子部品の製造方法 |
| JP7088133B2 (ja) * | 2019-07-12 | 2022-06-21 | 味の素株式会社 | プリント配線板の製造方法、及び無機層付き樹脂シート |
| CN110718474B (zh) * | 2019-09-03 | 2022-08-16 | 富联裕展科技(深圳)有限公司 | 封装方法、离型件及其制作方法 |
| KR102207322B1 (ko) * | 2020-06-29 | 2021-01-25 | 양문일 | 인쇄회로기판의 열프레스공정용 성형이형필름 |
| KR102496596B1 (ko) * | 2020-11-25 | 2023-02-06 | 엘지디스플레이 주식회사 | 배리어성이 우수한 알루미늄을 이용한 봉지 접착 필름 및 이를 포함하는 유기발광다이오드 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3081208A (en) * | 1960-02-17 | 1963-03-12 | Du Pont | Hazy polyvinyl fluoride film and process |
| KR940018419A (ko) * | 1993-01-18 | 1994-08-18 | 이마무라 가즈수케 | 발수성을 향상시킨 불소 함유 고분자 성형체 및 이로 부터 제조된 세정용 지그 |
| US5846477A (en) * | 1994-12-08 | 1998-12-08 | Nitto Denko Corporation | Production method for encapsulating a semiconductor device |
| WO2000018555A1 (en) * | 1998-10-01 | 2000-04-06 | Airtech International, Inc. | Method of molding or curing a resin material at high temperatures using a multilayer release film |
| JP3970464B2 (ja) * | 1999-02-26 | 2007-09-05 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
| JP2001168117A (ja) * | 1999-12-06 | 2001-06-22 | Idemitsu Petrochem Co Ltd | 半導体素子の封止用離型フィルム及びそれを用いる半導体素子の封止方法 |
| JP3658258B2 (ja) * | 1999-12-17 | 2005-06-08 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| JP4443715B2 (ja) | 1999-12-27 | 2010-03-31 | 日東電工株式会社 | 半導体の樹脂封止方法及び半導体樹脂封止用離型フィルム |
| JP2001310336A (ja) * | 2000-04-28 | 2001-11-06 | Asahi Glass Co Ltd | 樹脂モールド成形用離型フィルム |
| JP2002110722A (ja) * | 2000-10-03 | 2002-04-12 | Nitto Denko Corp | 半導体チップの樹脂封止方法及び半導体チップ樹脂封止用離型フィルム |
| JP2002361643A (ja) | 2001-06-01 | 2002-12-18 | Hitachi Chem Co Ltd | 半導体モールド用離型シート |
| JP3678361B2 (ja) * | 2001-06-08 | 2005-08-03 | 大日本印刷株式会社 | ガスバリアフィルム |
| JP3791458B2 (ja) * | 2002-05-23 | 2006-06-28 | 旭硝子株式会社 | 離型フィルム |
| JP2004079566A (ja) | 2002-08-09 | 2004-03-11 | Hitachi Chem Co Ltd | 半導体モールド用離型シート |
| DE602005016337D1 (de) * | 2004-06-29 | 2009-10-15 | Asahi Glass Co Ltd | Trennfolie für die Einkapselung von Halbleiterchips |
| JP2006049850A (ja) * | 2004-06-29 | 2006-02-16 | Asahi Glass Co Ltd | 半導体チップ封止用離型フィルム |
| JP2006120573A (ja) | 2004-10-25 | 2006-05-11 | Furukawa Battery Co Ltd:The | 制御弁式鉛蓄電池用負極板および前記負極板を用いた制御弁式鉛蓄電池 |
| JP2006191872A (ja) | 2005-01-14 | 2006-07-27 | Hirose:Kk | ホタルの幼虫育成容器 |
-
2007
- 2007-04-20 SG SG201102825-5A patent/SG171589A1/en unknown
- 2007-04-20 KR KR1020087025892A patent/KR20090018032A/ko not_active Application Discontinuation
- 2007-04-20 CN CN2007800140912A patent/CN101427358B/zh not_active Expired - Fee Related
- 2007-04-20 WO PCT/JP2007/058648 patent/WO2007125834A1/ja active Application Filing
- 2007-04-20 EP EP07742083A patent/EP2012351A4/en not_active Withdrawn
- 2007-04-20 JP JP2008513177A patent/JP5234419B2/ja active Active
- 2007-04-24 TW TW96114475A patent/TW200804052A/zh unknown
-
2008
- 2008-10-27 US US12/258,520 patent/US20090053528A1/en not_active Abandoned
-
2009
- 2009-12-22 US US12/644,855 patent/US8268218B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101427358B (zh) | 2012-07-18 |
| CN101427358A (zh) | 2009-05-06 |
| WO2007125834A1 (ja) | 2007-11-08 |
| US8268218B2 (en) | 2012-09-18 |
| JPWO2007125834A1 (ja) | 2009-09-10 |
| TW200804052A (en) | 2008-01-16 |
| EP2012351A1 (en) | 2009-01-07 |
| JP5234419B2 (ja) | 2013-07-10 |
| KR20090018032A (ko) | 2009-02-19 |
| US20090053528A1 (en) | 2009-02-26 |
| EP2012351A4 (en) | 2010-12-01 |
| US20100096772A1 (en) | 2010-04-22 |
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