SG157300A1 - Immersion lithographic apparatus, drying device, immersion metrology apparatus and device manufacturing method - Google Patents

Immersion lithographic apparatus, drying device, immersion metrology apparatus and device manufacturing method

Info

Publication number
SG157300A1
SG157300A1 SG200903192-3A SG2009031923A SG157300A1 SG 157300 A1 SG157300 A1 SG 157300A1 SG 2009031923 A SG2009031923 A SG 2009031923A SG 157300 A1 SG157300 A1 SG 157300A1
Authority
SG
Singapore
Prior art keywords
immersion
lithographic apparatus
drying device
device manufacturing
immersion lithographic
Prior art date
Application number
SG200903192-3A
Other languages
English (en)
Inventor
Michel Riepen
Nicolaas Rudolf Kemper
Johannes Petrus Mart Vermeulen
Daniel Jozef Maria Direcks
Danny Maria Hubertus Philips
Putten Arnold Jan Van
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG157300A1 publication Critical patent/SG157300A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200903192-3A 2008-05-08 2009-05-08 Immersion lithographic apparatus, drying device, immersion metrology apparatus and device manufacturing method SG157300A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7162008P 2008-05-08 2008-05-08
US7187608P 2008-05-22 2008-05-22

Publications (1)

Publication Number Publication Date
SG157300A1 true SG157300A1 (en) 2009-12-29

Family

ID=41266591

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200903192-3A SG157300A1 (en) 2008-05-08 2009-05-08 Immersion lithographic apparatus, drying device, immersion metrology apparatus and device manufacturing method

Country Status (8)

Country Link
US (1) US8345218B2 (ja)
EP (1) EP2249205B1 (ja)
JP (1) JP5063641B2 (ja)
KR (2) KR101043017B1 (ja)
CN (1) CN101576718B (ja)
AT (1) ATE548679T1 (ja)
SG (1) SG157300A1 (ja)
TW (1) TWI408512B (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
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EP2131241B1 (en) * 2008-05-08 2019-07-31 ASML Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
NL2005951A (en) * 2010-02-02 2011-08-03 Asml Netherlands Bv Lithographic apparatus and a device manufacturing method.
NL2005974A (en) * 2010-02-12 2011-08-15 Asml Netherlands Bv Lithographic apparatus and a device manufacturing method.
NL2006076A (en) * 2010-03-04 2011-09-06 Asml Netherlands Bv A lithographic apparatus and a method of manufacturing a device using a lithographic apparatus.
NL2007182A (en) * 2010-08-23 2012-02-27 Asml Netherlands Bv Fluid handling structure, module for an immersion lithographic apparatus, lithographic apparatus and device manufacturing method.
US20120162619A1 (en) * 2010-12-27 2012-06-28 Nikon Corporation Liquid immersion member, immersion exposure apparatus, exposing method, device fabricating method, program, and storage medium
NL2008979A (en) 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2008980A (en) * 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009139A (en) 2011-08-05 2013-02-06 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009472A (en) * 2011-10-24 2013-04-25 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
CN104238277B (zh) * 2013-06-19 2016-12-28 上海微电子装备有限公司 一种浸没式光刻机的流场维持方法
US10216095B2 (en) 2013-08-30 2019-02-26 Asml Netherlands B.V. Immersion lithographic apparatus
US10409174B2 (en) * 2014-06-16 2019-09-10 Asml Netherlands B.V. Lithographic apparatus, method of transferring a substrate and device manufacturing method
CN108463775B (zh) 2016-01-13 2021-05-25 Asml荷兰有限公司 流体处理结构及光刻设备
CN110764368A (zh) * 2018-07-27 2020-02-07 上海微电子装备（集团）股份有限公司 物镜防污染装置

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US4509852A (en) 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
JP3977324B2 (ja) 2002-11-12 2007-09-19 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
EP1420300B1 (en) 2002-11-12 2015-07-29 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1420298B1 (en) 2002-11-12 2013-02-20 ASML Netherlands B.V. Lithographic apparatus
CN1723539B (zh) * 2002-12-10 2010-05-26 株式会社尼康 曝光装置和曝光方法以及器件制造方法
JP4604452B2 (ja) * 2003-02-26 2011-01-05 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
JP4582089B2 (ja) 2003-04-11 2010-11-17 株式会社ニコン 液浸リソグラフィ用の液体噴射回収システム
TWI616932B (zh) * 2003-05-23 2018-03-01 Nikon Corp Exposure device and component manufacturing method
JP3862678B2 (ja) * 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
SG195534A1 (en) * 2003-08-26 2013-12-30 Nikon Corp Optical element and exposure device
EP1670042A4 (en) * 2003-09-29 2008-01-30 Nikon Corp LIQUID IMMERSION TYPE LENS SYSTEM, PROJECTION ALIGNER, AND PRODUCTION METHOD OF THE DEVICE
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US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4954444B2 (ja) * 2003-12-26 2012-06-13 株式会社ニコン 流路形成部材、露光装置及びデバイス製造方法
JP4797984B2 (ja) 2004-02-19 2011-10-19 株式会社ニコン 露光装置及びデバイス製造方法
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EP3203321A1 (en) * 2004-06-10 2017-08-09 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
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US7397533B2 (en) 2004-12-07 2008-07-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060147821A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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WO2006101120A1 (ja) 2005-03-23 2006-09-28 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
US7924416B2 (en) 2005-06-22 2011-04-12 Nikon Corporation Measurement apparatus, exposure apparatus, and device manufacturing method
KR20080017299A (ko) 2005-06-22 2008-02-26 가부시키가이샤 니콘 계측 장치 및 노광 장치 및 디바이스 제조 방법
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411658B2 (en) * 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7839483B2 (en) 2005-12-28 2010-11-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a control system
US8144305B2 (en) 2006-05-18 2012-03-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7675201B2 (en) * 2006-07-25 2010-03-09 Asml Netherlands B.V. Lithographic apparatus with planar motor driven support
US8634053B2 (en) * 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8421993B2 (en) * 2008-05-08 2013-04-16 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
US20110134400A1 (en) * 2009-12-04 2011-06-09 Nikon Corporation Exposure apparatus, liquid immersion member, and device manufacturing method

Also Published As

Publication number Publication date
TW200951642A (en) 2009-12-16
JP2009272636A (ja) 2009-11-19
EP2249205A1 (en) 2010-11-10
JP5063641B2 (ja) 2012-10-31
EP2249205B1 (en) 2012-03-07
KR101527502B1 (ko) 2015-06-09
KR20110055499A (ko) 2011-05-25
KR20090117664A (ko) 2009-11-12
CN101576718A (zh) 2009-11-11
ATE548679T1 (de) 2012-03-15
CN101576718B (zh) 2013-11-06
TWI408512B (zh) 2013-09-11
US8345218B2 (en) 2013-01-01
KR101043017B1 (ko) 2011-06-21
US20090279063A1 (en) 2009-11-12

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