SG143208A1 - Image sensor module - Google Patents
Image sensor moduleInfo
- Publication number
- SG143208A1 SG143208A1 SG200718102-7A SG2007181027A SG143208A1 SG 143208 A1 SG143208 A1 SG 143208A1 SG 2007181027 A SG2007181027 A SG 2007181027A SG 143208 A1 SG143208 A1 SG 143208A1
- Authority
- SG
- Singapore
- Prior art keywords
- image sensor
- sensor module
- lens
- die
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/608,254 US7566854B2 (en) | 2006-12-08 | 2006-12-08 | Image sensor module |
Publications (1)
Publication Number | Publication Date |
---|---|
SG143208A1 true SG143208A1 (en) | 2008-06-27 |
Family
ID=39363394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200718102-7A SG143208A1 (en) | 2006-12-08 | 2007-11-27 | Image sensor module |
Country Status (7)
Country | Link |
---|---|
US (1) | US7566854B2 (ko) |
JP (1) | JP2008167426A (ko) |
KR (1) | KR20080053202A (ko) |
CN (1) | CN101197359A (ko) |
DE (1) | DE102007058190A1 (ko) |
SG (1) | SG143208A1 (ko) |
TW (1) | TW200834907A (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8975599B2 (en) * | 2007-05-03 | 2015-03-10 | Asml Netherlands B.V. | Image sensor, lithographic apparatus comprising an image sensor and use of an image sensor in a lithographic apparatus |
JP2009182104A (ja) * | 2008-01-30 | 2009-08-13 | Toshiba Corp | 半導体パッケージ |
JP5375219B2 (ja) * | 2009-03-11 | 2013-12-25 | 富士通セミコンダクター株式会社 | 撮像装置 |
DE102011005629A1 (de) * | 2011-03-16 | 2012-09-20 | Robert Bosch Gmbh | Bildsensor-Modul und Verfahren zum Herstellen eines solchen |
CN103780847A (zh) | 2012-10-24 | 2014-05-07 | 霍尼韦尔国际公司 | 基于板上芯片的高度集成的成像器 |
US9231124B2 (en) * | 2013-09-25 | 2016-01-05 | Delphi Technologies, Inc. | Ball grid array packaged camera device soldered to a substrate |
US9665757B2 (en) | 2014-03-07 | 2017-05-30 | Hand Held Products, Inc. | Indicia reader for size-limited applications |
KR102256719B1 (ko) | 2014-05-12 | 2021-05-28 | 삼성전자주식회사 | 반도체 패키지 및 그 제조 방법 |
DE102014114066A1 (de) * | 2014-09-29 | 2016-03-31 | Pilz Gmbh & Co. Kg | Kameraeinheit zum Überwachen eines Raumbereichs |
JP6230520B2 (ja) * | 2014-10-29 | 2017-11-15 | キヤノン株式会社 | プリント回路板及び電子機器 |
US10049246B2 (en) | 2014-12-23 | 2018-08-14 | Hand Held Products, Inc. | Mini-barcode reading module with flash memory management |
CN116579354A (zh) * | 2016-09-14 | 2023-08-11 | 手持产品公司 | 堆叠式pcb可回流焊解码器模块 |
CN106534655B (zh) * | 2017-01-11 | 2019-04-16 | Oppo广东移动通信有限公司 | 摄像头模组及移动终端 |
KR102473650B1 (ko) * | 2018-04-13 | 2022-12-02 | 엘지이노텍 주식회사 | 카메라 모듈 및 그의 깊이 정보 추출 방법 |
US11515347B2 (en) | 2020-01-20 | 2022-11-29 | Omnivision Technologies, Inc. | Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making same |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69320113T2 (de) * | 1992-05-22 | 1999-03-11 | Matsushita Electronics Corp., Kadoma, Osaka | Festkörper-Bildsensor und Verfahren zu seiner Herstellung |
US6483101B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Molded image sensor package having lens holder |
US20030042587A1 (en) * | 2001-08-31 | 2003-03-06 | Tsung-Jen Lee | IC packaging and manufacturing methods |
JP4198072B2 (ja) * | 2004-01-23 | 2008-12-17 | シャープ株式会社 | 半導体装置、光学装置用モジュール及び半導体装置の製造方法 |
US7061106B2 (en) * | 2004-04-28 | 2006-06-13 | Advanced Chip Engineering Technology Inc. | Structure of image sensor module and a method for manufacturing of wafer level package |
JP2006148710A (ja) * | 2004-11-22 | 2006-06-08 | Sharp Corp | 撮像モジュール及び撮像モジュールの製造方法 |
US7279782B2 (en) * | 2005-01-05 | 2007-10-09 | Advanced Chip Engineering Technology Inc. | FBGA and COB package structure for image sensor |
US20070210246A1 (en) * | 2005-04-14 | 2007-09-13 | Amkor Technology, Inc. | Stacked image sensor optical module and fabrication method |
US7268335B2 (en) * | 2006-01-27 | 2007-09-11 | Omnivision Technologies, Inc. | Image sensing devices, image sensor modules, and associated methods |
-
2006
- 2006-12-08 US US11/608,254 patent/US7566854B2/en active Active
-
2007
- 2007-11-27 SG SG200718102-7A patent/SG143208A1/en unknown
- 2007-12-04 DE DE102007058190A patent/DE102007058190A1/de not_active Withdrawn
- 2007-12-05 TW TW096146349A patent/TW200834907A/zh unknown
- 2007-12-06 KR KR1020070126107A patent/KR20080053202A/ko not_active Application Discontinuation
- 2007-12-07 JP JP2007316699A patent/JP2008167426A/ja not_active Withdrawn
- 2007-12-07 CN CNA2007101969934A patent/CN101197359A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
TW200834907A (en) | 2008-08-16 |
KR20080053202A (ko) | 2008-06-12 |
DE102007058190A1 (de) | 2008-06-12 |
US20080135728A1 (en) | 2008-06-12 |
CN101197359A (zh) | 2008-06-11 |
JP2008167426A (ja) | 2008-07-17 |
US7566854B2 (en) | 2009-07-28 |
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