SG139691A1 - Coating and developing system, coating and developing method and storage medium - Google Patents
Coating and developing system, coating and developing method and storage mediumInfo
- Publication number
- SG139691A1 SG139691A1 SG200705453-9A SG2007054539A SG139691A1 SG 139691 A1 SG139691 A1 SG 139691A1 SG 2007054539 A SG2007054539 A SG 2007054539A SG 139691 A1 SG139691 A1 SG 139691A1
- Authority
- SG
- Singapore
- Prior art keywords
- unit
- coating
- lot
- heating unit
- lhp3
- Prior art date
Links
- 239000011248 coating agent Substances 0.000 title abstract 7
- 238000000576 coating method Methods 0.000 title abstract 7
- 238000000034 method Methods 0.000 title abstract 4
- 238000010438 heat treatment Methods 0.000 abstract 8
- 235000012431 wafers Nutrition 0.000 abstract 6
- 239000000758 substrate Substances 0.000 abstract 3
- 101100221836 Arabidopsis thaliana CPL3 gene Proteins 0.000 abstract 2
- 101100065702 Arabidopsis thaliana ETC3 gene Proteins 0.000 abstract 2
- 101100221835 Arabidopsis thaliana CPL2 gene Proteins 0.000 abstract 1
- 230000003750 conditioning effect Effects 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31428—Production management for lot production and for individual components of lot
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32097—Recipe programming for flexible batch
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Automation & Control Theory (AREA)
- Chemical & Material Sciences (AREA)
- Quality & Reliability (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006208806A JP2008034746A (ja) | 2006-07-31 | 2006-07-31 | 塗布、現像装置、その方法及び記憶媒体 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG139691A1 true SG139691A1 (en) | 2008-02-29 |
Family
ID=38986651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200705453-9A SG139691A1 (en) | 2006-07-31 | 2007-07-26 | Coating and developing system, coating and developing method and storage medium |
Country Status (6)
Country | Link |
---|---|
US (1) | US8025023B2 (ja) |
JP (1) | JP2008034746A (ja) |
KR (1) | KR101010779B1 (ja) |
CN (1) | CN101118839B (ja) |
SG (1) | SG139691A1 (ja) |
TW (1) | TWI332234B (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
JP5160204B2 (ja) * | 2007-11-30 | 2013-03-13 | 株式会社Sokudo | 基板処理装置 |
JP5318403B2 (ja) * | 2007-11-30 | 2013-10-16 | 株式会社Sokudo | 基板処理装置 |
JP5128918B2 (ja) | 2007-11-30 | 2013-01-23 | 株式会社Sokudo | 基板処理装置 |
JP5179170B2 (ja) * | 2007-12-28 | 2013-04-10 | 株式会社Sokudo | 基板処理装置 |
JP5001828B2 (ja) * | 2007-12-28 | 2012-08-15 | 株式会社Sokudo | 基板処理装置 |
JP2009212295A (ja) * | 2008-03-04 | 2009-09-17 | Tokyo Electron Ltd | 薬液の塗布固化装置及び塗布固化方法 |
JP4640469B2 (ja) | 2008-08-11 | 2011-03-02 | 東京エレクトロン株式会社 | 塗布、現像装置、その方法及び記憶媒体 |
JP4702446B2 (ja) * | 2008-12-22 | 2011-06-15 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
JP5275058B2 (ja) * | 2009-01-23 | 2013-08-28 | 株式会社Sokudo | 基板処理装置 |
JP2010192623A (ja) * | 2009-02-17 | 2010-09-02 | Renesas Electronics Corp | 半導体装置の製造装置、その制御方法、及びその制御プログラム |
JP5099054B2 (ja) * | 2009-03-13 | 2012-12-12 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法、塗布、現像装置、塗布、現像方法及び記憶媒体 |
JP4853537B2 (ja) * | 2009-03-13 | 2012-01-11 | 東京エレクトロン株式会社 | 現像装置、現像方法及び記憶媒体 |
JP5424201B2 (ja) | 2009-08-27 | 2014-02-26 | アユミ工業株式会社 | 加熱溶融処理装置および加熱溶融処理方法 |
CN103199031B (zh) * | 2012-01-04 | 2015-10-14 | 沈阳芯源微电子设备有限公司 | 全自动胶膜涂覆、显影装置 |
JP5977728B2 (ja) * | 2013-11-14 | 2016-08-24 | 東京エレクトロン株式会社 | 基板処理システム |
JP7220975B2 (ja) * | 2017-04-24 | 2023-02-13 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
CN108970944B (zh) * | 2018-08-01 | 2021-06-08 | 重庆大学 | 铝电解工业中玻璃防氟化氢腐蚀的方法 |
CN111489986B (zh) * | 2019-01-28 | 2024-03-22 | 东京毅力科创株式会社 | 基片处理装置和基片处理方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6402401B1 (en) * | 1999-10-19 | 2002-06-11 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
JP4170943B2 (ja) * | 1999-10-19 | 2008-10-22 | 東京エレクトロン株式会社 | 基板処理装置 |
KR100348938B1 (ko) * | 1999-12-06 | 2002-08-14 | 한국디엔에스 주식회사 | 포토리소그라피 공정을 위한 반도체 제조장치 |
US7988398B2 (en) * | 2002-07-22 | 2011-08-02 | Brooks Automation, Inc. | Linear substrate transport apparatus |
JP4087328B2 (ja) * | 2002-11-28 | 2008-05-21 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像装置の運転方法 |
WO2004049408A1 (ja) * | 2002-11-28 | 2004-06-10 | Tokyo Electron Limited | 基板処理システム、塗布現像装置及び基板処理装置 |
JP4233908B2 (ja) * | 2003-04-02 | 2009-03-04 | 東京エレクトロン株式会社 | 基板処理システム |
JP4378114B2 (ja) * | 2003-06-18 | 2009-12-02 | 東京エレクトロン株式会社 | 処理システム |
JP4279102B2 (ja) * | 2003-09-22 | 2009-06-17 | 大日本スクリーン製造株式会社 | 基板処理装置及び基板処理方法 |
WO2006055984A2 (en) * | 2004-11-22 | 2006-05-26 | Applied Materials, Inc. | Substrate processing apparatus using a batch processing chamber |
JP4393976B2 (ja) * | 2004-12-06 | 2010-01-06 | 大日本スクリーン製造株式会社 | 基板処理装置 |
-
2006
- 2006-07-31 JP JP2006208806A patent/JP2008034746A/ja not_active Withdrawn
-
2007
- 2007-04-20 TW TW096114027A patent/TWI332234B/zh active
- 2007-07-04 CN CN2007101269918A patent/CN101118839B/zh active Active
- 2007-07-16 US US11/826,438 patent/US8025023B2/en active Active
- 2007-07-26 SG SG200705453-9A patent/SG139691A1/en unknown
- 2007-07-30 KR KR1020070076214A patent/KR101010779B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2008034746A (ja) | 2008-02-14 |
CN101118839B (zh) | 2010-09-08 |
KR20080012187A (ko) | 2008-02-11 |
US8025023B2 (en) | 2011-09-27 |
KR101010779B1 (ko) | 2011-01-25 |
TWI332234B (en) | 2010-10-21 |
CN101118839A (zh) | 2008-02-06 |
US20080026153A1 (en) | 2008-01-31 |
TW200807501A (en) | 2008-02-01 |
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