SG139691A1 - Coating and developing system, coating and developing method and storage medium - Google Patents

Coating and developing system, coating and developing method and storage medium

Info

Publication number
SG139691A1
SG139691A1 SG200705453-9A SG2007054539A SG139691A1 SG 139691 A1 SG139691 A1 SG 139691A1 SG 2007054539 A SG2007054539 A SG 2007054539A SG 139691 A1 SG139691 A1 SG 139691A1
Authority
SG
Singapore
Prior art keywords
unit
coating
lot
heating unit
lhp3
Prior art date
Application number
SG200705453-9A
Other languages
English (en)
Inventor
Yasushi Hayashida
Yoshitaka Hara
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG139691A1 publication Critical patent/SG139691A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31428—Production management for lot production and for individual components of lot
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32097—Recipe programming for flexible batch
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Automation & Control Theory (AREA)
  • Chemical & Material Sciences (AREA)
  • Quality & Reliability (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Coating Apparatus (AREA)
SG200705453-9A 2006-07-31 2007-07-26 Coating and developing system, coating and developing method and storage medium SG139691A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006208806A JP2008034746A (ja) 2006-07-31 2006-07-31 塗布、現像装置、その方法及び記憶媒体

Publications (1)

Publication Number Publication Date
SG139691A1 true SG139691A1 (en) 2008-02-29

Family

ID=38986651

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200705453-9A SG139691A1 (en) 2006-07-31 2007-07-26 Coating and developing system, coating and developing method and storage medium

Country Status (6)

Country Link
US (1) US8025023B2 (ja)
JP (1) JP2008034746A (ja)
KR (1) KR101010779B1 (ja)
CN (1) CN101118839B (ja)
SG (1) SG139691A1 (ja)
TW (1) TWI332234B (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5160204B2 (ja) * 2007-11-30 2013-03-13 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5318403B2 (ja) * 2007-11-30 2013-10-16 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) * 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) * 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP2009212295A (ja) * 2008-03-04 2009-09-17 Tokyo Electron Ltd 薬液の塗布固化装置及び塗布固化方法
JP4640469B2 (ja) 2008-08-11 2011-03-02 東京エレクトロン株式会社 塗布、現像装置、その方法及び記憶媒体
JP4702446B2 (ja) * 2008-12-22 2011-06-15 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5275058B2 (ja) * 2009-01-23 2013-08-28 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP2010192623A (ja) * 2009-02-17 2010-09-02 Renesas Electronics Corp 半導体装置の製造装置、その制御方法、及びその制御プログラム
JP5099054B2 (ja) * 2009-03-13 2012-12-12 東京エレクトロン株式会社 基板処理装置、基板処理方法、塗布、現像装置、塗布、現像方法及び記憶媒体
JP4853537B2 (ja) * 2009-03-13 2012-01-11 東京エレクトロン株式会社 現像装置、現像方法及び記憶媒体
JP5424201B2 (ja) 2009-08-27 2014-02-26 アユミ工業株式会社 加熱溶融処理装置および加熱溶融処理方法
CN103199031B (zh) * 2012-01-04 2015-10-14 沈阳芯源微电子设备有限公司 全自动胶膜涂覆、显影装置
JP5977728B2 (ja) * 2013-11-14 2016-08-24 東京エレクトロン株式会社 基板処理システム
JP7220975B2 (ja) * 2017-04-24 2023-02-13 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN108970944B (zh) * 2018-08-01 2021-06-08 重庆大学 铝电解工业中玻璃防氟化氢腐蚀的方法
CN111489986B (zh) * 2019-01-28 2024-03-22 东京毅力科创株式会社 基片处理装置和基片处理方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6402401B1 (en) * 1999-10-19 2002-06-11 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP4170943B2 (ja) * 1999-10-19 2008-10-22 東京エレクトロン株式会社 基板処理装置
KR100348938B1 (ko) * 1999-12-06 2002-08-14 한국디엔에스 주식회사 포토리소그라피 공정을 위한 반도체 제조장치
US7988398B2 (en) * 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
JP4087328B2 (ja) * 2002-11-28 2008-05-21 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法
WO2004049408A1 (ja) * 2002-11-28 2004-06-10 Tokyo Electron Limited 基板処理システム、塗布現像装置及び基板処理装置
JP4233908B2 (ja) * 2003-04-02 2009-03-04 東京エレクトロン株式会社 基板処理システム
JP4378114B2 (ja) * 2003-06-18 2009-12-02 東京エレクトロン株式会社 処理システム
JP4279102B2 (ja) * 2003-09-22 2009-06-17 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法
WO2006055984A2 (en) * 2004-11-22 2006-05-26 Applied Materials, Inc. Substrate processing apparatus using a batch processing chamber
JP4393976B2 (ja) * 2004-12-06 2010-01-06 大日本スクリーン製造株式会社 基板処理装置

Also Published As

Publication number Publication date
JP2008034746A (ja) 2008-02-14
CN101118839B (zh) 2010-09-08
KR20080012187A (ko) 2008-02-11
US8025023B2 (en) 2011-09-27
KR101010779B1 (ko) 2011-01-25
TWI332234B (en) 2010-10-21
CN101118839A (zh) 2008-02-06
US20080026153A1 (en) 2008-01-31
TW200807501A (en) 2008-02-01

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