SG121967A1 - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method

Info

Publication number
SG121967A1
SG121967A1 SG200506521A SG200506521A SG121967A1 SG 121967 A1 SG121967 A1 SG 121967A1 SG 200506521 A SG200506521 A SG 200506521A SG 200506521 A SG200506521 A SG 200506521A SG 121967 A1 SG121967 A1 SG 121967A1
Authority
SG
Singapore
Prior art keywords
device manufacturing
lithographic apparatus
lithographic
manufacturing
Prior art date
Application number
SG200506521A
Other languages
English (en)
Inventor
Kars Zeger Troost
Arno Jan Bleeker
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG121967A1 publication Critical patent/SG121967A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
SG200506521A 2004-10-18 2005-10-13 Lithographic apparatus and device manufacturing method SG121967A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/966,147 US7177012B2 (en) 2004-10-18 2004-10-18 Lithographic apparatus and device manufacturing method

Publications (1)

Publication Number Publication Date
SG121967A1 true SG121967A1 (en) 2006-05-26

Family

ID=35432125

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200506521A SG121967A1 (en) 2004-10-18 2005-10-13 Lithographic apparatus and device manufacturing method

Country Status (8)

Country Link
US (2) US7177012B2 (zh)
EP (2) EP1647864B1 (zh)
JP (1) JP4430601B2 (zh)
KR (1) KR100732223B1 (zh)
CN (1) CN100593132C (zh)
DE (1) DE602005011220D1 (zh)
SG (1) SG121967A1 (zh)
TW (3) TWI331677B (zh)

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WO2007094431A1 (ja) * 2006-02-16 2007-08-23 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
US8259285B2 (en) * 2006-12-14 2012-09-04 Asml Holding N.V. Lithographic system, device manufacturing method, setpoint data optimization method, and apparatus for producing optimized setpoint data
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
EP2048543B1 (en) * 2007-10-09 2013-12-04 ASML Netherlands B.V. An optical focus sensor, an inspection apparatus and a lithographic apparatus
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
CN101681125B (zh) * 2007-10-16 2013-08-21 株式会社尼康 照明光学***、曝光装置以及元件制造方法
EP2179330A1 (en) * 2007-10-16 2010-04-28 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) * 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
NL1036322A1 (nl) * 2007-12-21 2009-06-23 Asml Holding Nv Systems and methods for lithographic illuminator beam deviation measurement and calibration using grating sensors.
CN103034075B (zh) * 2007-12-21 2015-07-08 卡尔蔡司Smt有限责任公司 微光刻投射曝光设备的照明***
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KR101695034B1 (ko) * 2008-05-28 2017-01-10 가부시키가이샤 니콘 공간 광 변조기의 검사 장치, 조명 광학계, 노광 장치, 검사 방법, 조명 광학계의 조정 방법, 조명 방법, 노광 방법, 및 디바이스 제조 방법
US8488107B2 (en) 2009-03-13 2013-07-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a level sensor having multiple projection units and detection units
US8675210B2 (en) 2009-03-13 2014-03-18 Asml Netherlands B.V. Level sensor, lithographic apparatus, and substrate surface positioning method
US20100231881A1 (en) * 2009-03-13 2010-09-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2228685B1 (en) * 2009-03-13 2018-06-27 ASML Netherlands B.V. Level sensor arrangement for lithographic apparatus and device manufacturing method
JP5451238B2 (ja) * 2009-08-03 2014-03-26 浜松ホトニクス株式会社 レーザ加工方法
WO2011040745A2 (ko) * 2009-09-30 2011-04-07 서울대학교 산학협력단 영상 처리 기반 리소그래피 시스템 및 표적물 코팅 방법
NL2006129A (en) 2010-03-12 2011-09-13 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2006004A (en) * 2010-03-25 2011-09-27 Asml Netherlands Bv Imprint lithography.
NL2006556A (en) * 2010-05-13 2011-11-15 Asml Holding Nv Optical system, inspection system and manufacturing method.
JP5518612B2 (ja) * 2010-07-20 2014-06-11 株式会社ディスコ 光学装置およびこれを備えるレーザー加工装置
US8957394B2 (en) 2011-11-29 2015-02-17 Kla-Tencor Corporation Compact high-voltage electron gun
JP5801737B2 (ja) * 2012-03-16 2015-10-28 株式会社Ｓｃｒｅｅｎホールディングス 検査装置、露光装置及び検査方法
CN108646526A (zh) * 2018-05-10 2018-10-12 山东临沂新华印刷物流集团有限责任公司 印刷制版方法、***和装置
EP3582008A1 (en) * 2018-06-15 2019-12-18 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Exposure arrangement for an additive manufacturing system, additive manufacturing system and method of manufacturing an object
CN114174890A (zh) * 2019-08-09 2022-03-11 Asml荷兰有限公司 量测装置及其相位调制器设备

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US6696008B2 (en) * 2000-05-25 2004-02-24 Westar Photonics Inc. Maskless laser beam patterning ablation of multilayered structures with continuous monitoring of ablation
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JP3563384B2 (ja) * 2001-11-08 2004-09-08 大日本スクリーン製造株式会社 画像記録装置
JP4290553B2 (ja) 2001-11-27 2009-07-08 エーエスエムエル ネザーランズ ビー．ブイ． 画像化装置
US6618185B2 (en) * 2001-11-28 2003-09-09 Micronic Laser Systems Ab Defective pixel compensation method
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EP1482373A1 (en) * 2003-05-30 2004-12-01 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7177012B2 (en) * 2004-10-18 2007-02-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
EP1647864A1 (en) 2006-04-19
US7965380B2 (en) 2011-06-21
CN100593132C (zh) 2010-03-03
KR20060054049A (ko) 2006-05-22
US7177012B2 (en) 2007-02-13
EP1647864B1 (en) 2008-11-26
TWI331677B (en) 2010-10-11
KR100732223B1 (ko) 2007-06-27
US20060082752A1 (en) 2006-04-20
TW200921083A (en) 2009-05-16
JP4430601B2 (ja) 2010-03-10
JP2006135312A (ja) 2006-05-25
CN1763635A (zh) 2006-04-26
TW200912561A (en) 2009-03-16
DE602005011220D1 (de) 2009-01-08
EP1986051A3 (en) 2009-03-11
US20070252967A1 (en) 2007-11-01
EP1986051A2 (en) 2008-10-29
TWI334926B (en) 2010-12-21
TWI435184B (zh) 2014-04-21
TW200628777A (en) 2006-08-16

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