SG11202001612UA - Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device - Google Patents
Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor deviceInfo
- Publication number
- SG11202001612UA SG11202001612UA SG11202001612UA SG11202001612UA SG11202001612UA SG 11202001612U A SG11202001612U A SG 11202001612UA SG 11202001612U A SG11202001612U A SG 11202001612UA SG 11202001612U A SG11202001612U A SG 11202001612UA SG 11202001612U A SG11202001612U A SG 11202001612UA
- Authority
- SG
- Singapore
- Prior art keywords
- protective film
- temporary protective
- lead frame
- molded body
- semiconductor device
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 title 3
- 239000004065 semiconductor Substances 0.000 title 2
- 238000005538 encapsulation Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000000465 moulding Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/04—Kinds or types
- B65H75/08—Kinds or types of circular or polygonal cross-section
- B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/121—Preparatory processes from unsaturated precursors and polyamines
- C08G73/122—Preparatory processes from unsaturated precursors and polyamines containing chain terminating or branching agents
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- H01L21/568—Temporary substrate used as encapsulation process aid
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/495—Lead-frames or other flat leads
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- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09J2301/00—Additional features of adhesives in the form of films or foils
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
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CN112466957A (zh) * | 2020-10-28 | 2021-03-09 | 杭州士兰微电子股份有限公司 | 光传感器封装体的封装方法及封装结构的封装方法 |
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JPH05129473A (ja) | 1991-11-06 | 1993-05-25 | Sony Corp | 樹脂封止表面実装型半導体装置 |
JPH1012773A (ja) | 1996-06-24 | 1998-01-16 | Matsushita Electron Corp | 樹脂封止型半導体装置およびその製造方法 |
US6700185B1 (en) | 1999-11-10 | 2004-03-02 | Hitachi Chemical Co., Ltd. | Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device |
JP3575480B2 (ja) | 1999-11-10 | 2004-10-13 | 日立化成工業株式会社 | 半導体用接着フィルム |
JP3719234B2 (ja) * | 2001-08-06 | 2005-11-24 | 日立化成工業株式会社 | 半導体用接着フィルム、およびこれを用いた半導体用接着フィルム付きリードフレームならびに半導体装置 |
JP3857953B2 (ja) * | 2002-05-16 | 2006-12-13 | 株式会社巴川製紙所 | 半導体装置製造用接着シート |
JPWO2004075293A1 (ja) * | 2003-02-19 | 2006-06-01 | 日立化成工業株式会社 | 半導体用接着フィルム、これを用いた接着フィルム付金属板、接着フィルム付配線回路及び半導体装置並びに半導体装置の製造方法 |
JP2006318999A (ja) * | 2005-05-10 | 2006-11-24 | Nitto Denko Corp | 半導体装置製造用接着フィルム |
JP2008095063A (ja) | 2006-09-13 | 2008-04-24 | Hitachi Chem Co Ltd | 半導体用接着フィルム、半導体用接着フィルム付きリードフレーム、半導体用接着フィルム付き半導体装置、半導体装置 |
JP2008103700A (ja) * | 2006-09-19 | 2008-05-01 | Hitachi Chem Co Ltd | 多層ダイボンドシート、半導体用接着フィルム付き半導体装置、半導体装置および半導体装置の製造方法 |
JP2008277802A (ja) * | 2007-04-04 | 2008-11-13 | Hitachi Chem Co Ltd | 半導体用接着フィルム、半導体用接着フィルム付きリードフレーム及びこれらを用いた半導体装置 |
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CN107429042B (zh) * | 2015-03-31 | 2020-01-07 | 松下知识产权经营株式会社 | 密封用树脂组合物、使用了该密封用树脂组合物的半导体装置、使用该密封用树脂组合物的半导体装置的制造方法 |
JP2016196322A (ja) | 2015-04-06 | 2016-11-24 | 大日本印刷株式会社 | 電池用包材のフィルムロール梱包体 |
TW201805351A (zh) * | 2016-03-24 | 2018-02-16 | 味之素股份有限公司 | 薄膜捲筒捆包體以及其製造方法 |
KR101763852B1 (ko) * | 2017-03-10 | 2017-08-01 | (주)인랩 | Qfn 반도체 패키지, 이의 제조방법 및 qfn 반도체 패키지 제조용 마스크 시트 |
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- 2019-03-01 JP JP2020506399A patent/JP6785426B2/ja active Active
- 2019-03-01 KR KR1020227008855A patent/KR102664369B1/ko active IP Right Grant
- 2019-03-01 WO PCT/JP2019/008205 patent/WO2019176596A1/ja active Application Filing
- 2019-03-01 KR KR2020197000037U patent/KR20190002363U/ko not_active Application Discontinuation
- 2019-03-01 CN CN201990000192.2U patent/CN210956601U/zh active Active
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- 2019-03-01 WO PCT/JP2019/008214 patent/WO2019176598A1/ja active Application Filing
- 2019-03-01 SG SG11202001612UA patent/SG11202001612UA/en unknown
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- 2019-03-01 CN CN202311257971.XA patent/CN117334646A/zh active Pending
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- 2019-03-12 TW TW108108117A patent/TWI761666B/zh active
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US11251055B2 (en) | 2022-02-15 |
US20210020460A1 (en) | 2021-01-21 |
CN111386594B (zh) | 2023-10-13 |
WO2019176596A1 (ja) | 2019-09-19 |
PH12020551432A1 (en) | 2021-09-01 |
KR20220039835A (ko) | 2022-03-29 |
JP6785426B2 (ja) | 2020-11-18 |
CN210956601U (zh) | 2020-07-07 |
TWI761666B (zh) | 2022-04-21 |
US20220020606A1 (en) | 2022-01-20 |
WO2019176598A1 (ja) | 2019-09-19 |
MY193648A (en) | 2022-10-21 |
MY197208A (en) | 2023-05-31 |
PH22019500012U1 (en) | 2021-05-31 |
JPWO2019176596A1 (ja) | 2020-06-11 |
CN117334646A (zh) | 2024-01-02 |
PH22019500012Y1 (en) | 2021-05-31 |
KR20200002329U (ko) | 2020-10-22 |
CN111386594A (zh) | 2020-07-07 |
KR20190002363U (ko) | 2019-09-24 |
KR20200133202A (ko) | 2020-11-26 |
KR102664369B1 (ko) | 2024-05-10 |
TW201939698A (zh) | 2019-10-01 |
US11682564B2 (en) | 2023-06-20 |
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