SG11201909992QA - Device and method for bonding substrates - Google Patents
Device and method for bonding substratesInfo
- Publication number
- SG11201909992QA SG11201909992QA SG11201909992QA SG11201909992QA SG 11201909992Q A SG11201909992Q A SG 11201909992QA SG 11201909992Q A SG11201909992Q A SG 11201909992QA SG 11201909992Q A SG11201909992Q A SG 11201909992QA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- chuck
- bonding
- bonding substrates
- plate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 9
Classifications
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2017/073930 WO2019057286A1 (de) | 2017-09-21 | 2017-09-21 | Vorrichtung und verfahren zum bonden von substraten |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201909992QA true SG11201909992QA (en) | 2019-11-28 |
Family
ID=60083251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201909992Q SG11201909992QA (en) | 2017-09-21 | 2017-09-21 | Device and method for bonding substrates |
Country Status (8)
Country | Link |
---|---|
US (2) | US11315901B2 (ja) |
EP (2) | EP3640975A1 (ja) |
JP (3) | JP7123123B2 (ja) |
KR (7) | KR20240052074A (ja) |
CN (7) | CN118099000A (ja) |
SG (1) | SG11201909992QA (ja) |
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EP4070365A1 (de) * | 2019-12-02 | 2022-10-12 | EV Group E. Thallner GmbH | Vorrichtung und verfahren zum heizen eines substrates |
WO2021115574A1 (de) | 2019-12-10 | 2021-06-17 | Ev Group E. Thallner Gmbh | Verfahren und vorrichtung zur ausrichtung von substraten |
JP7368263B2 (ja) * | 2020-02-14 | 2023-10-24 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
WO2022002345A1 (de) | 2020-06-29 | 2022-01-06 | Ev Group E. Thallner Gmbh | Substrathalter und verfahren zum fixieren und bonden eines substrats |
US11587795B2 (en) * | 2020-09-28 | 2023-02-21 | Canon Kabushiki Kaisha | Planarization apparatus including superstrate chuck with bendable periphery |
CN116457916A (zh) | 2021-02-01 | 2023-07-18 | Ev 集团 E·索尔纳有限责任公司 | 基底支架以及制造用于接合的基底支架的方法 |
TWI802956B (zh) * | 2021-08-11 | 2023-05-21 | 日商雅馬哈智能機器控股股份有限公司 | 部材間接合裝置以及接合部材製造方法 |
JP2023048850A (ja) * | 2021-09-28 | 2023-04-07 | キヤノン株式会社 | インプリント方法、インプリント装置、および物品の製造方法 |
KR20240095170A (ko) * | 2021-11-08 | 2024-06-25 | 에베 그룹 에. 탈너 게엠베하 | 기판 본딩용 장치 및 방법 |
WO2024046577A1 (de) | 2022-09-02 | 2024-03-07 | Ev Group E. Thallner Gmbh | Verfahren und vorrichtung zum beeinflussen einer bondwelle beim bonden |
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