SG11201802518XA - Wafer inspection device and wafer inspection method - Google Patents

Wafer inspection device and wafer inspection method

Info

Publication number
SG11201802518XA
SG11201802518XA SG11201802518XA SG11201802518XA SG11201802518XA SG 11201802518X A SG11201802518X A SG 11201802518XA SG 11201802518X A SG11201802518X A SG 11201802518XA SG 11201802518X A SG11201802518X A SG 11201802518XA SG 11201802518X A SG11201802518X A SG 11201802518XA
Authority
SG
Singapore
Prior art keywords
wafer inspection
inspection device
inspection method
wafer
inspection
Prior art date
Application number
SG11201802518XA
Other languages
English (en)
Inventor
Hiroshi Yamada
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG11201802518XA publication Critical patent/SG11201802518XA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201802518XA 2015-09-30 2016-07-14 Wafer inspection device and wafer inspection method SG11201802518XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015194389A JP6652361B2 (ja) 2015-09-30 2015-09-30 ウエハ検査装置及びウエハ検査方法
PCT/JP2016/071464 WO2017056654A1 (ja) 2015-09-30 2016-07-14 ウエハ検査装置及びウエハ検査方法

Publications (1)

Publication Number Publication Date
SG11201802518XA true SG11201802518XA (en) 2018-04-27

Family

ID=58423507

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201802518XA SG11201802518XA (en) 2015-09-30 2016-07-14 Wafer inspection device and wafer inspection method

Country Status (7)

Country Link
US (1) US10557868B2 (ja)
JP (1) JP6652361B2 (ja)
KR (1) KR102013085B1 (ja)
CN (1) CN108140591B (ja)
SG (1) SG11201802518XA (ja)
TW (1) TWI703655B (ja)
WO (1) WO2017056654A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10840121B2 (en) * 2016-10-31 2020-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for unpacking semiconductor wafer container
JP6783185B2 (ja) * 2017-05-15 2020-11-11 東京エレクトロン株式会社 検査装置
JP6861580B2 (ja) 2017-06-05 2021-04-21 東京エレクトロン株式会社 検査装置および検査システム
JP6887332B2 (ja) * 2017-07-19 2021-06-16 東京エレクトロン株式会社 検査システム
JP2020009978A (ja) * 2018-07-12 2020-01-16 東京エレクトロン株式会社 回路装置、テスタ、検査装置及び回路基板の反り調整方法
TWI666454B (zh) * 2018-07-13 2019-07-21 中華精測科技股份有限公司 高頻探針卡裝置
JP2020047860A (ja) * 2018-09-20 2020-03-26 東京エレクトロン株式会社 検査装置及び検査方法
JP7217636B2 (ja) * 2019-01-16 2023-02-03 東京エレクトロン株式会社 チャックトップ、検査装置、およびチャックトップの回収方法
CN109633220B (zh) * 2019-01-29 2021-08-24 江阴佳泰电子科技有限公司 一种预吹洗式晶圆探针台
CN112309889A (zh) * 2019-08-02 2021-02-02 合肥晶合集成电路股份有限公司 一种基板检测装置及其检测方法
JP7458161B2 (ja) * 2019-09-24 2024-03-29 東京エレクトロン株式会社 検査装置の制御方法および検査装置
JP7437991B2 (ja) * 2020-03-25 2024-02-26 東京エレクトロン株式会社 検査装置、及び、チャックトップの位置調整方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3401801B2 (ja) 1992-06-17 2003-04-28 株式会社日立製作所 イオンビーム装置
JPH0621166A (ja) * 1992-06-30 1994-01-28 Mitsubishi Electric Corp ウエハプローバ
JP3313085B2 (ja) * 1998-06-02 2002-08-12 日本電産リード株式会社 基板検査装置及び基板検査装置における基板と検査ヘッドとの相対位置調整方法
JP4134289B2 (ja) * 2002-05-29 2008-08-20 東京エレクトロン株式会社 プローブカード搬送装置及びアダプタ
JP4300003B2 (ja) * 2002-08-07 2009-07-22 東京エレクトロン株式会社 載置台の駆動装置及びプローブ方法
CN101019473A (zh) * 2004-05-20 2007-08-15 纳米纳克斯公司 具有快速制作周期的高密度互连***
JP2006186130A (ja) 2004-12-28 2006-07-13 Matsushita Electric Ind Co Ltd 半導体検査装置
JP4685559B2 (ja) * 2005-09-09 2011-05-18 東京エレクトロン株式会社 プローブカードと載置台との平行度調整方法及び検査用プログラム記憶媒体並びに検査装置
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
JP5295588B2 (ja) * 2008-02-28 2013-09-18 東京エレクトロン株式会社 プローブカードの傾き調整方法、プローブカードの傾き検出方法及びプローブカードの傾き検出方法を記録したプログラム記録媒体
JP4491513B1 (ja) * 2009-02-12 2010-06-30 株式会社アドバンテスト 半導体ウェハ試験装置
TWI402932B (zh) * 2009-05-27 2013-07-21 Star Techn Inc 具有多軸載台之半導體元件測試裝置
JP5889581B2 (ja) * 2010-09-13 2016-03-22 東京エレクトロン株式会社 ウエハ検査装置
JP6099347B2 (ja) 2012-10-03 2017-03-22 東京エレクトロン株式会社 ウエハ取り付け方法及びウエハ検査装置

Also Published As

Publication number Publication date
US20180299487A1 (en) 2018-10-18
CN108140591B (zh) 2022-04-22
US10557868B2 (en) 2020-02-11
JP2017069427A (ja) 2017-04-06
JP6652361B2 (ja) 2020-02-19
KR102013085B1 (ko) 2019-08-21
TW201731000A (zh) 2017-09-01
TWI703655B (zh) 2020-09-01
KR20180043815A (ko) 2018-04-30
CN108140591A (zh) 2018-06-08
WO2017056654A1 (ja) 2017-04-06

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