SG11201801519PA - Ic test system - Google Patents

Ic test system

Info

Publication number
SG11201801519PA
SG11201801519PA SG11201801519PA SG11201801519PA SG11201801519PA SG 11201801519P A SG11201801519P A SG 11201801519PA SG 11201801519P A SG11201801519P A SG 11201801519PA SG 11201801519P A SG11201801519P A SG 11201801519PA SG 11201801519P A SG11201801519P A SG 11201801519PA
Authority
SG
Singapore
Prior art keywords
test system
test
Prior art date
Application number
SG11201801519PA
Other languages
English (en)
Inventor
Shouhei Matsumoto
Shinichi Hasebe
Mitsuo Koizumi
Yoshinori Arai
Masayoshi Yokoo
Keitaro Harada
Original Assignee
Happyjapan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Happyjapan Inc filed Critical Happyjapan Inc
Publication of SG11201801519PA publication Critical patent/SG11201801519PA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG11201801519PA 2015-08-31 2015-08-31 Ic test system SG11201801519PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/074755 WO2017037844A1 (ja) 2015-08-31 2015-08-31 Ｉｃ試験システム

Publications (1)

Publication Number Publication Date
SG11201801519PA true SG11201801519PA (en) 2018-03-28

Family

ID=58188789

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201801519PA SG11201801519PA (en) 2015-08-31 2015-08-31 Ic test system

Country Status (7)

Country Link
US (1) US10527669B2 (ja)
EP (1) EP3346280B8 (ja)
JP (1) JP6789221B2 (ja)
KR (1) KR20180035856A (ja)
CN (1) CN108450015B (ja)
SG (1) SG11201801519PA (ja)
WO (1) WO2017037844A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106950490B (zh) * 2017-05-05 2019-05-10 福州派利德电子科技有限公司 下压式ic芯片检测机构
TWI676031B (zh) * 2018-09-06 2019-11-01 致茂電子股份有限公司 滑移式電子元件測試裝置
KR20200121188A (ko) * 2019-04-15 2020-10-23 주식회사 아테코 핸드 티칭 기능이 구비된 전자부품 테스트 핸들러 및 이를 이용한 핸드 티칭 방법
JP7362507B2 (ja) * 2020-02-25 2023-10-17 株式会社Ｎｓテクノロジーズ 電子部品搬送装置、電子部品検査装置およびポケット位置検出方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0658986A (ja) 1992-08-07 1994-03-04 Fujitsu Miyagi Electron:Kk 半導体試験装置
JPH0974128A (ja) * 1995-09-05 1997-03-18 Hitachi Electron Eng Co Ltd Ｉｃパッケージの真空吸着ハンド
JPH1068759A (ja) * 1996-05-31 1998-03-10 Advantest Corp 吸着物検知装置、該装置を用いた吸着物検知方法、該装置を用いた位置ずれ検知方法、および該装置を用いた清掃方法
KR100351052B1 (ko) * 2000-03-30 2002-09-05 삼성전자 주식회사 패키지 가이더가 있는 반도체 패키지 가공용 로더 및 그사용방법
JP4327335B2 (ja) * 2000-06-23 2009-09-09 株式会社アドバンテスト コンタクトアームおよびこれを用いた電子部品試験装置
JP2003344483A (ja) * 2002-05-31 2003-12-03 Fujitsu Ltd ハンドリング装置およびこれを使用した試験装置
CN1319215C (zh) * 2003-07-18 2007-05-30 威盛电子股份有限公司 电子元件测试插置座的移动限位件
KR100861006B1 (ko) * 2007-02-28 2008-09-30 (주)테크윙 테스트핸들러용 테스트트레이 이송장치
JP2008243861A (ja) * 2007-03-23 2008-10-09 Tokyo Electron Ltd 検査装置及び検査方法
KR100857603B1 (ko) * 2007-03-29 2008-09-09 삼성전자주식회사 전자부품 검사 시스템 및 그 제어방법
TWI342950B (en) * 2007-08-17 2011-06-01 Hon Tech Inc Testing means for use in loading fixture of elements
JP2009145153A (ja) 2007-12-13 2009-07-02 Yamaha Motor Co Ltd 電子部品試験装置および電子部品試験方法
CN101567327B (zh) * 2008-04-23 2010-09-08 中茂电子(深圳)有限公司 裸晶测试机台用缓冲分类装置及该机台
US8542029B1 (en) * 2009-02-10 2013-09-24 Xilinx, Inc. Methods and apparatus for testing of integrated circuits
DE112010000775B4 (de) * 2009-02-12 2016-03-17 Kyoto University Industrierobotersystem
CN201820770U (zh) * 2010-06-08 2011-05-04 致茂电子(苏州)有限公司 一种用于太阳能硅芯片检测机台的缓冲输送检测装置
JP5212520B2 (ja) * 2011-06-23 2013-06-19 セイコーエプソン株式会社 電子部品ハンドラ及びハンドラ
JP2013053991A (ja) 2011-09-06 2013-03-21 Seiko Epson Corp ハンドラー及び部品検査装置
CN203546850U (zh) * 2013-09-25 2014-04-16 李飞宇 一种进水阀、排水阀失效和马桶堵塞的自动保护装置
TWI494576B (zh) 2013-12-03 2015-08-01 Tohoku Seiki Ind Co Ltd IC processor
KR102122325B1 (ko) * 2013-12-03 2020-06-12 해피재팬, 인크. Ic 핸들러

Also Published As

Publication number Publication date
CN108450015B (zh) 2021-07-02
EP3346280A1 (en) 2018-07-11
WO2017037844A1 (ja) 2017-03-09
CN108450015A (zh) 2018-08-24
US10527669B2 (en) 2020-01-07
JPWO2017037844A1 (ja) 2018-06-14
EP3346280A4 (en) 2019-05-08
JP6789221B2 (ja) 2020-11-25
EP3346280B8 (en) 2021-12-29
KR20180035856A (ko) 2018-04-06
EP3346280B1 (en) 2021-08-18
US20180267097A1 (en) 2018-09-20

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