SG11201801519PA - Ic test system - Google Patents
Ic test systemInfo
- Publication number
- SG11201801519PA SG11201801519PA SG11201801519PA SG11201801519PA SG11201801519PA SG 11201801519P A SG11201801519P A SG 11201801519PA SG 11201801519P A SG11201801519P A SG 11201801519PA SG 11201801519P A SG11201801519P A SG 11201801519PA SG 11201801519P A SG11201801519P A SG 11201801519PA
- Authority
- SG
- Singapore
- Prior art keywords
- test system
- test
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
- G01R31/287—Procedures; Software aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/074755 WO2017037844A1 (en) | 2015-08-31 | 2015-08-31 | Ic test system |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201801519PA true SG11201801519PA (en) | 2018-03-28 |
Family
ID=58188789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201801519PA SG11201801519PA (en) | 2015-08-31 | 2015-08-31 | Ic test system |
Country Status (7)
Country | Link |
---|---|
US (1) | US10527669B2 (en) |
EP (1) | EP3346280B8 (en) |
JP (1) | JP6789221B2 (en) |
KR (1) | KR20180035856A (en) |
CN (1) | CN108450015B (en) |
SG (1) | SG11201801519PA (en) |
WO (1) | WO2017037844A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106950490B (en) * | 2017-05-05 | 2019-05-10 | 福州派利德电子科技有限公司 | Press-down type IC chip testing agency |
TWI676031B (en) * | 2018-09-06 | 2019-11-01 | 致茂電子股份有限公司 | Sliding test device for electronic component |
KR20200121188A (en) * | 2019-04-15 | 2020-10-23 | 주식회사 아테코 | Electronic device test handler with hand teaching and hand teaching method of using that |
JP7362507B2 (en) * | 2020-02-25 | 2023-10-17 | 株式会社Nsテクノロジーズ | Electronic component transport device, electronic component inspection device, and pocket position detection method |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0658986A (en) | 1992-08-07 | 1994-03-04 | Fujitsu Miyagi Electron:Kk | Semiconductor test system |
JPH0974128A (en) * | 1995-09-05 | 1997-03-18 | Hitachi Electron Eng Co Ltd | Vacuum suction hand for ic package |
JPH1068759A (en) * | 1996-05-31 | 1998-03-10 | Advantest Corp | Attracted matter detecting device attracted mater detecting method using the same, dislocation detecting method using the device and cleaning method using the device |
KR100351052B1 (en) * | 2000-03-30 | 2002-09-05 | 삼성전자 주식회사 | Loader for semiconductor package processing having a guider and method for using the same |
JP4327335B2 (en) * | 2000-06-23 | 2009-09-09 | 株式会社アドバンテスト | Contact arm and electronic component testing apparatus using the same |
JP2003344483A (en) * | 2002-05-31 | 2003-12-03 | Fujitsu Ltd | Handling device and testing device using the same |
CN1319215C (en) * | 2003-07-18 | 2007-05-30 | 威盛电子股份有限公司 | Moving limiting unit of electron element testing socket |
KR100861006B1 (en) * | 2007-02-28 | 2008-09-30 | (주)테크윙 | Transfering apparatus for test handler |
JP2008243861A (en) * | 2007-03-23 | 2008-10-09 | Tokyo Electron Ltd | Inspection apparatus and method |
KR100857603B1 (en) * | 2007-03-29 | 2008-09-09 | 삼성전자주식회사 | Testing system of electronic parts and method thereof |
TWI342950B (en) * | 2007-08-17 | 2011-06-01 | Hon Tech Inc | Testing means for use in loading fixture of elements |
JP2009145153A (en) | 2007-12-13 | 2009-07-02 | Yamaha Motor Co Ltd | Electronic component testing apparatus and electronic component testing method |
CN101567327B (en) * | 2008-04-23 | 2010-09-08 | 中茂电子(深圳)有限公司 | Buffer sorting device for bare wafer testing machine platform and machine platform |
US8542029B1 (en) * | 2009-02-10 | 2013-09-24 | Xilinx, Inc. | Methods and apparatus for testing of integrated circuits |
DE112010000775B4 (en) * | 2009-02-12 | 2016-03-17 | Kyoto University | INDUSTRIAL ROBOT SYSTEM |
CN201820770U (en) * | 2010-06-08 | 2011-05-04 | 致茂电子(苏州)有限公司 | Buffering and conveying detector for solar silicon chip detection platform |
JP5212520B2 (en) * | 2011-06-23 | 2013-06-19 | セイコーエプソン株式会社 | Electronic component handler and handler |
JP2013053991A (en) | 2011-09-06 | 2013-03-21 | Seiko Epson Corp | Handler and component inspection device |
CN203546850U (en) * | 2013-09-25 | 2014-04-16 | 李飞宇 | Automatic protection device for inlet and drain valve failure and toilet clogging |
TWI494576B (en) | 2013-12-03 | 2015-08-01 | Tohoku Seiki Ind Co Ltd | IC processor |
KR102122325B1 (en) * | 2013-12-03 | 2020-06-12 | 해피재팬, 인크. | IC Handler |
-
2015
- 2015-08-31 KR KR1020187005783A patent/KR20180035856A/en not_active Application Discontinuation
- 2015-08-31 US US15/756,435 patent/US10527669B2/en active Active
- 2015-08-31 SG SG11201801519PA patent/SG11201801519PA/en unknown
- 2015-08-31 JP JP2017537106A patent/JP6789221B2/en active Active
- 2015-08-31 CN CN201580082746.4A patent/CN108450015B/en active Active
- 2015-08-31 EP EP15902966.9A patent/EP3346280B8/en active Active
- 2015-08-31 WO PCT/JP2015/074755 patent/WO2017037844A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN108450015B (en) | 2021-07-02 |
EP3346280A1 (en) | 2018-07-11 |
WO2017037844A1 (en) | 2017-03-09 |
CN108450015A (en) | 2018-08-24 |
US10527669B2 (en) | 2020-01-07 |
JPWO2017037844A1 (en) | 2018-06-14 |
EP3346280A4 (en) | 2019-05-08 |
JP6789221B2 (en) | 2020-11-25 |
EP3346280B8 (en) | 2021-12-29 |
KR20180035856A (en) | 2018-04-06 |
EP3346280B1 (en) | 2021-08-18 |
US20180267097A1 (en) | 2018-09-20 |
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