SG11201801292PA - Polishing method and polishing apparatus - Google Patents
Polishing method and polishing apparatusInfo
- Publication number
- SG11201801292PA SG11201801292PA SG11201801292PA SG11201801292PA SG11201801292PA SG 11201801292P A SG11201801292P A SG 11201801292PA SG 11201801292P A SG11201801292P A SG 11201801292PA SG 11201801292P A SG11201801292P A SG 11201801292PA SG 11201801292P A SG11201801292P A SG 11201801292PA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- polishing apparatus
- polishing method
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015173929A JP6376085B2 (en) | 2015-09-03 | 2015-09-03 | Polishing method and polishing apparatus |
PCT/JP2016/003745 WO2017038032A1 (en) | 2015-09-03 | 2016-08-16 | Polishing method and polishing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201801292PA true SG11201801292PA (en) | 2018-03-28 |
Family
ID=58186949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201801292PA SG11201801292PA (en) | 2015-09-03 | 2016-08-16 | Polishing method and polishing apparatus |
Country Status (8)
Country | Link |
---|---|
US (1) | US10537972B2 (en) |
JP (1) | JP6376085B2 (en) |
KR (1) | KR102545528B1 (en) |
CN (1) | CN107921606B (en) |
DE (1) | DE112016003359T5 (en) |
SG (1) | SG11201801292PA (en) |
TW (1) | TWI694893B (en) |
WO (1) | WO2017038032A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6883475B2 (en) | 2017-06-06 | 2021-06-09 | 株式会社荏原製作所 | Polishing table and polishing equipment equipped with it |
EP4182119A1 (en) * | 2020-07-14 | 2023-05-24 | Applied Materials, Inc. | Methods of detecting non-conforming substrate processing events during chemical mechanical polishing |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4313284A (en) * | 1980-03-27 | 1982-02-02 | Monsanto Company | Apparatus for improving flatness of polished wafers |
US4450652A (en) * | 1981-09-04 | 1984-05-29 | Monsanto Company | Temperature control for wafer polishing |
JPH0699350A (en) * | 1992-09-18 | 1994-04-12 | Toshiba Mach Co Ltd | Temperature control method for surface plate |
US5700180A (en) * | 1993-08-25 | 1997-12-23 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
JP2850803B2 (en) * | 1995-08-01 | 1999-01-27 | 信越半導体株式会社 | Wafer polishing method |
JP2862073B2 (en) | 1995-12-08 | 1999-02-24 | 日本電気株式会社 | Wafer polishing method |
JP3672685B2 (en) * | 1996-11-29 | 2005-07-20 | 松下電器産業株式会社 | Polishing method and polishing apparatus |
US6121144A (en) * | 1997-12-29 | 2000-09-19 | Intel Corporation | Low temperature chemical mechanical polishing of dielectric materials |
JP2000202765A (en) * | 1999-01-12 | 2000-07-25 | Ebara Corp | Washing device for abrasive material flowmeter of polishing device, washing method and polishing device |
US6224461B1 (en) * | 1999-03-29 | 2001-05-01 | Lam Research Corporation | Method and apparatus for stabilizing the process temperature during chemical mechanical polishing |
JP2000301440A (en) * | 1999-04-22 | 2000-10-31 | Toshiba Ceramics Co Ltd | Surface grinder and semiconductor wafer grinding method using it |
US6358119B1 (en) * | 1999-06-21 | 2002-03-19 | Taiwan Semiconductor Manufacturing Company | Way to remove CU line damage after CU CMP |
TW458849B (en) * | 1999-07-23 | 2001-10-11 | Applied Materials Inc | Temperature control device for chemical mechanical polishing |
US6299516B1 (en) * | 1999-09-28 | 2001-10-09 | Applied Materials, Inc. | Substrate polishing article |
WO2001056742A1 (en) * | 2000-01-31 | 2001-08-09 | Shin-Etsu Handotai Co., Ltd. | Polishing device and method |
EP1175964A3 (en) * | 2000-07-27 | 2003-07-23 | Agere Systems Guardian Corporation | Polishing surface temperature conditioning system for a chemical mechanical planarization process |
US6485359B1 (en) * | 2000-09-15 | 2002-11-26 | Applied Materials, Inc. | Platen arrangement for a chemical-mechanical planarization apparatus |
TW542049U (en) * | 2001-07-18 | 2003-07-11 | Taiwan Semiconductor Mfg | Apparatus for preventing CMP polishing slurry from scraping wafer |
JP4186692B2 (en) * | 2003-05-08 | 2008-11-26 | ソニー株式会社 | Polishing equipment |
US20040266192A1 (en) * | 2003-06-30 | 2004-12-30 | Lam Research Corporation | Application of heated slurry for CMP |
JP2006239808A (en) * | 2005-03-03 | 2006-09-14 | Nec Electronics Corp | Polishing device |
JP4757580B2 (en) * | 2005-09-16 | 2011-08-24 | 株式会社荏原製作所 | Polishing method, polishing apparatus, and program for controlling polishing apparatus |
KR100755011B1 (en) * | 2005-12-14 | 2007-09-06 | 주식회사 실트론 | Polishing plate, and polishing apparatus, polishing method using thereof |
JP4902433B2 (en) * | 2007-06-13 | 2012-03-21 | 株式会社荏原製作所 | Polishing surface heating and cooling device for polishing equipment |
DE102007063232B4 (en) * | 2007-12-31 | 2023-06-22 | Advanced Micro Devices, Inc. | Process for polishing a substrate |
US8172641B2 (en) * | 2008-07-17 | 2012-05-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | CMP by controlling polish temperature |
JP5632132B2 (en) * | 2009-02-27 | 2014-11-26 | 株式会社荏原製作所 | Substrate processing method |
TWI613037B (en) * | 2011-07-19 | 2018-02-01 | 荏原製作所股份有限公司 | Polishing method |
JP2013099814A (en) * | 2011-11-08 | 2013-05-23 | Toshiba Corp | Polishing method and polishing apparatus |
US9005999B2 (en) * | 2012-06-30 | 2015-04-14 | Applied Materials, Inc. | Temperature control of chemical mechanical polishing |
TWI540624B (en) * | 2012-07-25 | 2016-07-01 | 應用材料股份有限公司 | Temperature control of chemical mechanical polishing |
CN103753380B (en) * | 2013-12-18 | 2016-04-20 | 河南科技学院 | Based on the chemically mechanical polishing interface temperature detecting and controlling system of wireless transmission |
-
2015
- 2015-09-03 JP JP2015173929A patent/JP6376085B2/en active Active
-
2016
- 2016-08-16 WO PCT/JP2016/003745 patent/WO2017038032A1/en active Application Filing
- 2016-08-16 SG SG11201801292PA patent/SG11201801292PA/en unknown
- 2016-08-16 DE DE112016003359.1T patent/DE112016003359T5/en active Pending
- 2016-08-16 US US15/751,990 patent/US10537972B2/en active Active
- 2016-08-16 CN CN201680048100.9A patent/CN107921606B/en active Active
- 2016-08-16 KR KR1020187006099A patent/KR102545528B1/en active IP Right Grant
- 2016-08-19 TW TW105126477A patent/TWI694893B/en active
Also Published As
Publication number | Publication date |
---|---|
US10537972B2 (en) | 2020-01-21 |
TWI694893B (en) | 2020-06-01 |
KR102545528B1 (en) | 2023-06-20 |
KR20180048668A (en) | 2018-05-10 |
WO2017038032A1 (en) | 2017-03-09 |
US20180229344A1 (en) | 2018-08-16 |
CN107921606A (en) | 2018-04-17 |
JP6376085B2 (en) | 2018-08-22 |
JP2017047513A (en) | 2017-03-09 |
CN107921606B (en) | 2019-07-09 |
DE112016003359T5 (en) | 2018-04-05 |
TW201711806A (en) | 2017-04-01 |
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