SG11201608134YA - Polishing pads and systems and methods of making and using the same - Google Patents
Polishing pads and systems and methods of making and using the sameInfo
- Publication number
- SG11201608134YA SG11201608134YA SG11201608134YA SG11201608134YA SG11201608134YA SG 11201608134Y A SG11201608134Y A SG 11201608134YA SG 11201608134Y A SG11201608134Y A SG 11201608134YA SG 11201608134Y A SG11201608134Y A SG 11201608134YA SG 11201608134Y A SG11201608134Y A SG 11201608134YA
- Authority
- SG
- Singapore
- Prior art keywords
- systems
- making
- methods
- same
- polishing pads
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/241—Methods
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461974848P | 2014-04-03 | 2014-04-03 | |
| US201462052729P | 2014-09-19 | 2014-09-19 | |
| PCT/US2015/023576 WO2015153601A1 (en) | 2014-04-03 | 2015-03-31 | Polishing pads and systems and methods of making and using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201608134YA true SG11201608134YA (en) | 2016-10-28 |
Family
ID=52823890
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201608219WA SG11201608219WA (en) | 2014-04-03 | 2015-03-31 | Polishing pads and systems and methods of making and using the same |
| SG11201608134YA SG11201608134YA (en) | 2014-04-03 | 2015-03-31 | Polishing pads and systems and methods of making and using the same |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201608219WA SG11201608219WA (en) | 2014-04-03 | 2015-03-31 | Polishing pads and systems and methods of making and using the same |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US10071461B2 (en) |
| EP (2) | EP3126092B1 (en) |
| JP (2) | JP6656162B2 (en) |
| KR (2) | KR102347711B1 (en) |
| CN (2) | CN106132630B (en) |
| SG (2) | SG11201608219WA (en) |
| TW (2) | TWI655998B (en) |
| WO (2) | WO2015153601A1 (en) |
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| SG11201602207QA (en) * | 2013-09-25 | 2016-04-28 | 3M Innovative Properties Co | Multi-layered polishing pads |
| CN106132630B (en) * | 2014-04-03 | 2019-11-26 | 3M创新有限公司 | The method of polishing pad and system and manufacture and use such polishing pad and system |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| KR102630261B1 (en) | 2014-10-17 | 2024-01-29 | 어플라이드 머티어리얼스, 인코포레이티드 | Cmp pad construction with composite material properties using additive manufacturing processes |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| TWI769988B (en) * | 2015-10-07 | 2022-07-11 | 美商3M新設資產公司 | Polishing pads and systems and methods of making and using the same |
| JP6940495B2 (en) | 2015-10-30 | 2021-09-29 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Equipment and methods for forming abrasive articles with the desired zeta potential |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
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| TWI626117B (en) * | 2017-01-19 | 2018-06-11 | 智勝科技股份有限公司 | Polishing pad and polishing method |
| TWM573509U (en) * | 2017-01-20 | 2019-01-21 | 美商應用材料股份有限公司 | Thin plastic polishing tools and support elements for CMP applications |
| US20200172780A1 (en) * | 2017-07-11 | 2020-06-04 | 3M Innovative Properties Company | Abrasive articles including conformable coatings and polishing system therefrom |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| CN111032284B (en) * | 2017-08-04 | 2022-11-04 | 3M创新有限公司 | Microreplicated polished surfaces with enhanced coplanarity |
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| CN111032285B (en) * | 2017-08-25 | 2022-07-19 | 3M创新有限公司 | Polishing pad with surface protrusions |
| US11685013B2 (en) * | 2018-01-24 | 2023-06-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad for chemical mechanical planarization |
| US11878388B2 (en) * | 2018-06-15 | 2024-01-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same |
| CN112654655A (en) | 2018-09-04 | 2021-04-13 | 应用材料公司 | Advanced polishing pad formulations |
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| US20120302148A1 (en) * | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
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| CN106132630B (en) * | 2014-04-03 | 2019-11-26 | 3M创新有限公司 | The method of polishing pad and system and manufacture and use such polishing pad and system |
-
2015
- 2015-03-31 CN CN201580017813.4A patent/CN106132630B/en active Active
- 2015-03-31 US US15/300,125 patent/US10071461B2/en active Active
- 2015-03-31 CN CN201580018328.9A patent/CN106163740B/en active Active
- 2015-03-31 SG SG11201608219WA patent/SG11201608219WA/en unknown
- 2015-03-31 KR KR1020167030479A patent/KR102347711B1/en active IP Right Grant
- 2015-03-31 US US15/129,639 patent/US10252396B2/en active Active
- 2015-03-31 KR KR1020167030482A patent/KR102350350B1/en active IP Right Grant
- 2015-03-31 JP JP2016560455A patent/JP6656162B2/en active Active
- 2015-03-31 SG SG11201608134YA patent/SG11201608134YA/en unknown
- 2015-03-31 EP EP15715634.0A patent/EP3126092B1/en active Active
- 2015-03-31 WO PCT/US2015/023576 patent/WO2015153601A1/en active Application Filing
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- 2015-03-31 JP JP2016560383A patent/JP6640106B2/en active Active
- 2015-04-02 TW TW104111030A patent/TWI655998B/en active
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201542316A (en) | 2015-11-16 |
| KR20160140874A (en) | 2016-12-07 |
| CN106163740A (en) | 2016-11-23 |
| EP3126093B1 (en) | 2022-08-17 |
| KR102347711B1 (en) | 2022-01-06 |
| EP3126092A1 (en) | 2017-02-08 |
| KR20160142346A (en) | 2016-12-12 |
| US20170182629A1 (en) | 2017-06-29 |
| TWI655998B (en) | 2019-04-11 |
| US10252396B2 (en) | 2019-04-09 |
| JP2017513722A (en) | 2017-06-01 |
| CN106132630B (en) | 2019-11-26 |
| JP6656162B2 (en) | 2020-03-04 |
| CN106132630A (en) | 2016-11-16 |
| WO2015153597A1 (en) | 2015-10-08 |
| JP6640106B2 (en) | 2020-02-05 |
| WO2015153601A1 (en) | 2015-10-08 |
| JP2017510470A (en) | 2017-04-13 |
| KR102350350B1 (en) | 2022-01-14 |
| CN106163740B (en) | 2019-07-09 |
| SG11201608219WA (en) | 2016-10-28 |
| US20170173758A1 (en) | 2017-06-22 |
| EP3126093A1 (en) | 2017-02-08 |
| US10071461B2 (en) | 2018-09-11 |
| TWI652142B (en) | 2019-03-01 |
| EP3126092B1 (en) | 2022-08-17 |
| TW201542318A (en) | 2015-11-16 |
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