AU2003285800A1 - Polishing pad having multi-windows - Google Patents
Polishing pad having multi-windowsInfo
- Publication number
- AU2003285800A1 AU2003285800A1 AU2003285800A AU2003285800A AU2003285800A1 AU 2003285800 A1 AU2003285800 A1 AU 2003285800A1 AU 2003285800 A AU2003285800 A AU 2003285800A AU 2003285800 A AU2003285800 A AU 2003285800A AU 2003285800 A1 AU2003285800 A1 AU 2003285800A1
- Authority
- AU
- Australia
- Prior art keywords
- windows
- polishing pad
- polishing
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0085856 | 2002-12-28 | ||
KR20020085856 | 2002-12-28 | ||
PCT/KR2003/002831 WO2004058453A1 (en) | 2002-12-28 | 2003-12-24 | Polishing pad having multi-windows |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003285800A1 true AU2003285800A1 (en) | 2004-07-22 |
Family
ID=32677806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003285800A Abandoned AU2003285800A1 (en) | 2002-12-28 | 2003-12-24 | Polishing pad having multi-windows |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR100577470B1 (en) |
AU (1) | AU2003285800A1 (en) |
MY (1) | MY137723A (en) |
WO (1) | WO2004058453A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8535115B2 (en) * | 2011-01-28 | 2013-09-17 | Applied Materials, Inc. | Gathering spectra from multiple optical heads |
US10071461B2 (en) | 2014-04-03 | 2018-09-11 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5964643A (en) * | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
JP2000223451A (en) * | 1999-02-01 | 2000-08-11 | Nikon Corp | Polishing state measuring method |
JP2001009699A (en) * | 1999-07-05 | 2001-01-16 | Nichiden Mach Ltd | Plane surface grinding device |
KR100729229B1 (en) * | 2000-09-20 | 2007-06-15 | 삼성전자주식회사 | End point detector of polishing in semiconductor processing |
-
2003
- 2003-12-24 AU AU2003285800A patent/AU2003285800A1/en not_active Abandoned
- 2003-12-24 WO PCT/KR2003/002831 patent/WO2004058453A1/en not_active Application Discontinuation
- 2003-12-24 KR KR1020030095954A patent/KR100577470B1/en active IP Right Grant
- 2003-12-29 MY MYPI20035023A patent/MY137723A/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20040060755A (en) | 2004-07-06 |
MY137723A (en) | 2009-03-31 |
WO2004058453A1 (en) | 2004-07-15 |
KR100577470B1 (en) | 2006-05-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |