SG11201509461XA - Cover For Component Of Polishing Apparatus, Component Of Polishing Apparatus, And Polishing Apparatus - Google Patents

Cover For Component Of Polishing Apparatus, Component Of Polishing Apparatus, And Polishing Apparatus

Info

Publication number
SG11201509461XA
SG11201509461XA SG11201509461XA SG11201509461XA SG11201509461XA SG 11201509461X A SG11201509461X A SG 11201509461XA SG 11201509461X A SG11201509461X A SG 11201509461XA SG 11201509461X A SG11201509461X A SG 11201509461XA SG 11201509461X A SG11201509461X A SG 11201509461XA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
component
cover
polishing
Prior art date
Application number
SG11201509461XA
Inventor
Kenji Shinkai
Tadakazu Sone
Hideo Aizawa
Hiroshi Aono
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201509461XA publication Critical patent/SG11201509461XA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/08Protective coverings for parts of machine tools; Splash guards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06Dust extraction equipment on grinding or polishing machines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG11201509461XA 2014-03-31 2015-03-27 Cover For Component Of Polishing Apparatus, Component Of Polishing Apparatus, And Polishing Apparatus SG11201509461XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014072227A JP6342198B2 (en) 2014-03-31 2014-03-31 Cover for constituent parts of polishing apparatus, constituent parts of polishing apparatus, and polishing apparatus
PCT/JP2015/059631 WO2015152052A1 (en) 2014-03-31 2015-03-27 Cover for structural component of polishing device, structural component of polishing device, and polishing device

Publications (1)

Publication Number Publication Date
SG11201509461XA true SG11201509461XA (en) 2016-01-28

Family

ID=54240378

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201509461XA SG11201509461XA (en) 2014-03-31 2015-03-27 Cover For Component Of Polishing Apparatus, Component Of Polishing Apparatus, And Polishing Apparatus

Country Status (7)

Country Link
US (1) US9724798B2 (en)
JP (2) JP6342198B2 (en)
KR (1) KR102361932B1 (en)
CN (1) CN106132633B (en)
SG (1) SG11201509461XA (en)
TW (2) TWI672194B (en)
WO (1) WO2015152052A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113696094B (en) * 2021-09-03 2022-07-12 山西光兴光电科技有限公司 Grinding water cover mechanism, grinding machine and grinding machine control method

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2973605A (en) * 1959-11-09 1961-03-07 Carman Lab Inc Lapping machine
JPS62165838U (en) * 1986-04-10 1987-10-21
US5785585A (en) * 1995-09-18 1998-07-28 International Business Machines Corporation Polish pad conditioner with radial compensation
US6036583A (en) * 1997-07-11 2000-03-14 Applied Materials, Inc. Conditioner head in a substrate polisher and method
JP3965503B2 (en) * 1998-03-25 2007-08-29 未来工業株式会社 Drilling tool with chip receiving cover
US6200199B1 (en) * 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
US6135855A (en) * 1998-07-30 2000-10-24 Motorola, Inc. Translation mechanism for a chemical mechanical planarization system and method therefor
JP2001300847A (en) 2000-04-24 2001-10-30 Nikon Corp Polishing device and method of manufacturing semiconductor device
JP2002058543A (en) * 2000-08-21 2002-02-26 Nissin Electric Co Ltd Monitor control panel, and wiring cap used therefor
US6315651B1 (en) * 2001-03-22 2001-11-13 Taiwan Semiconductor Manufacturing Company Ltd Easy on/off cover for a pad conditioning assembly
KR100462868B1 (en) * 2001-06-29 2004-12-17 삼성전자주식회사 Pad Conditioner of Semiconductor Polishing apparatus
JP2003136364A (en) * 2001-11-06 2003-05-14 Enshu Ltd Closed device for machine tool
JP2003179021A (en) * 2001-12-11 2003-06-27 Sony Corp Chemical/mechanical polisher
JP2004356517A (en) 2003-05-30 2004-12-16 Ebara Corp Method and device for substrate washing
KR20060124501A (en) * 2005-05-31 2006-12-05 삼성전자주식회사 Pad conditioner of cmp equipment
JP4791813B2 (en) * 2005-12-08 2011-10-12 株式会社ディスコ Cutting equipment
JP2007168039A (en) * 2005-12-22 2007-07-05 Ebara Corp Polishing surface washing mechanism of polishing table and polishing device
JP5096100B2 (en) * 2007-10-05 2012-12-12 株式会社ディスコ Cutting equipment
DE102010012378B3 (en) * 2010-03-22 2011-09-22 Solarlux Aluminium Systeme Gmbh sliding partition
CN202240906U (en) * 2011-09-28 2012-05-30 东北林业大学 On-line dressing device for electric spark formed grinding wheel
JP5844163B2 (en) * 2012-01-12 2016-01-13 株式会社荏原製作所 Polishing equipment
TWM438343U (en) * 2012-05-04 2012-10-01 Warde Tec Taiwan Co Ltd Conditioner cover
CN103639897A (en) * 2013-11-01 2014-03-19 无锡元明机械设备技术有限公司 Correcting device for grinding disc of grinding miller

Also Published As

Publication number Publication date
KR20160140338A (en) 2016-12-07
TW201544251A (en) 2015-12-01
CN106132633B (en) 2018-11-27
TWI725471B (en) 2021-04-21
WO2015152052A1 (en) 2015-10-08
CN106132633A (en) 2016-11-16
US9724798B2 (en) 2017-08-08
KR102361932B1 (en) 2022-02-11
JP2015193055A (en) 2015-11-05
JP2018114614A (en) 2018-07-26
JP6342198B2 (en) 2018-06-13
JP6580178B2 (en) 2019-09-25
TW201945125A (en) 2019-12-01
US20170008144A1 (en) 2017-01-12
TWI672194B (en) 2019-09-21

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