SG110194A1 - Anisotropic conductive film, production method thereof and method of use thereof - Google Patents
Anisotropic conductive film, production method thereof and method of use thereofInfo
- Publication number
- SG110194A1 SG110194A1 SG200405710A SG200405710A SG110194A1 SG 110194 A1 SG110194 A1 SG 110194A1 SG 200405710 A SG200405710 A SG 200405710A SG 200405710 A SG200405710 A SG 200405710A SG 110194 A1 SG110194 A1 SG 110194A1
- Authority
- SG
- Singapore
- Prior art keywords
- conductive paths
- anisotropic conductive
- film substrate
- film
- conductive film
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 229920000800 acrylic rubber Polymers 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 125000001624 naphthyl group Chemical group 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
- 229920000058 polyacrylate Polymers 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/811—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector the bump connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/81101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector the bump connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a bump connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01018—Argon [Ar]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01073—Tantalum [Ta]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003317453A JP2005085634A (ja) | 2003-09-09 | 2003-09-09 | 異方導電性フィルムおよびその製造方法 |
JP2003326810A JP4256237B2 (ja) | 2003-09-18 | 2003-09-18 | 電子部品検査用の異方導電性フィルムおよびそれを用いた電子部品の検査方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG110194A1 true SG110194A1 (en) | 2005-04-28 |
Family
ID=34138016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200405710A SG110194A1 (en) | 2003-09-09 | 2004-09-09 | Anisotropic conductive film, production method thereof and method of use thereof |
Country Status (7)
Country | Link |
---|---|
US (1) | US7156669B2 (de) |
EP (1) | EP1515399B1 (de) |
KR (1) | KR20050026683A (de) |
AT (1) | ATE419661T1 (de) |
DE (1) | DE602004018720D1 (de) |
SG (1) | SG110194A1 (de) |
TW (1) | TW200515644A (de) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
US7133991B2 (en) * | 2003-08-20 | 2006-11-07 | Micron Technology, Inc. | Method and system for capturing and bypassing memory transactions in a hub-based memory system |
TWI255466B (en) * | 2004-10-08 | 2006-05-21 | Ind Tech Res Inst | Polymer-matrix conductive film and method for fabricating the same |
NL1027450C2 (nl) * | 2004-11-09 | 2006-05-10 | Shin Etsu Polymer Europ B V | Doorverbindingsconnector, frame omvattende een dergelijke connector, elektrische meet- en testinrichting en contacteringswerkwijze met behulp van een dergelijke connector. |
JP2006330130A (ja) * | 2005-05-24 | 2006-12-07 | Mitsubishi Electric Corp | 液晶表示装置およびその製造方法 |
US7235978B2 (en) * | 2005-09-07 | 2007-06-26 | Matsushita Electric Industrial Co., Ltd. | Device for measuring impedance of electronic component |
KR100721587B1 (ko) * | 2006-03-09 | 2007-05-23 | 주식회사 아이에스시테크놀러지 | 전자부품의 검사를 위한 콘택터 |
US7331797B1 (en) * | 2006-07-26 | 2008-02-19 | Lotes Co., Ltd. | Electrical connector and a manufacturing method thereof |
US20080284042A1 (en) * | 2007-03-27 | 2008-11-20 | Fujifilm Corporation | Anisotropically conductive member and method of manufacture |
JP5104034B2 (ja) * | 2007-05-23 | 2012-12-19 | 日立化成工業株式会社 | 異方導電接続用フィルム及びリール体 |
KR100920228B1 (ko) * | 2007-11-21 | 2009-10-05 | 삼성전기주식회사 | 열가소성 수지를 이용한 프로브 카드 |
JP2009132974A (ja) * | 2007-11-30 | 2009-06-18 | Fujifilm Corp | 微細構造体 |
JP5145110B2 (ja) * | 2007-12-10 | 2013-02-13 | 富士フイルム株式会社 | 異方導電性接合パッケージの製造方法 |
JP2009283431A (ja) * | 2007-12-27 | 2009-12-03 | Fujifilm Corp | 微細構造体およびその製造方法 |
TWI377624B (en) * | 2008-05-13 | 2012-11-21 | Ind Tech Res Inst | Conducting film structure, fabrication method thereof, and conducting film type probe device for ic |
JP5143045B2 (ja) * | 2008-07-09 | 2013-02-13 | 富士フイルム株式会社 | 微細構造体およびその製造方法 |
TWI399812B (zh) * | 2008-12-29 | 2013-06-21 | Ind Tech Res Inst | 導電膜結構及其製法與導電膜式積體電路針測裝置 |
JP5164878B2 (ja) | 2009-02-17 | 2013-03-21 | 富士フイルム株式会社 | 異方導電性部材およびその製造方法 |
WO2010101125A1 (ja) * | 2009-03-05 | 2010-09-10 | ポリマテック株式会社 | 弾性コネクタ及び弾性コネクタの製造方法並びに導通接続具 |
CN102484327B (zh) * | 2009-09-02 | 2015-07-29 | 保力马科技(日本)株式会社 | 各向异性导电体及各向异性导电体的制造方法、以及各向异性导电体阵列片 |
KR101127449B1 (ko) * | 2009-10-07 | 2012-03-26 | 이성규 | 이방성 도전필름의 제조방법 및 그에 의해 제조되는 이방성 도전필름 |
JP2011090865A (ja) * | 2009-10-22 | 2011-05-06 | Shinko Electric Ind Co Ltd | 導電フィルムおよびその製造方法、並びに半導体装置およびその製造方法 |
US8507804B2 (en) * | 2010-02-22 | 2013-08-13 | Tyco Electronics Corporation | Electrical connector with solder columns |
US8574964B2 (en) * | 2010-04-14 | 2013-11-05 | Stats Chippac, Ltd. | Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape |
CN106063041B (zh) * | 2014-01-27 | 2019-01-08 | 富士胶片株式会社 | 微细结构体、多层配线基板、半导体封装及微细结构体的制造方法 |
JP2015207433A (ja) * | 2014-04-18 | 2015-11-19 | 矢崎総業株式会社 | 導電性弾性部材及びコネクタ |
CN106489195A (zh) * | 2014-07-11 | 2017-03-08 | 富士胶片株式会社 | 各向异性导电构件及多层配线基板 |
CN105305126A (zh) * | 2015-11-20 | 2016-02-03 | 华为技术有限公司 | 电连接器及通信设备 |
US10330874B2 (en) * | 2016-02-02 | 2019-06-25 | Georgia Tech Research Corporation | Mixed-signal substrate with integrated through-substrate vias |
WO2017191772A1 (ja) * | 2016-05-05 | 2017-11-09 | デクセリアルズ株式会社 | フィラー配置フィルム |
JP2018067483A (ja) * | 2016-10-20 | 2018-04-26 | ヤマハ株式会社 | 異方導電性シート、電気検査ヘッド、電気検査装置及び異方導電性シートの製造方法 |
CN110582895B (zh) * | 2017-05-18 | 2022-01-14 | 信越聚合物株式会社 | 电连接器及其制造方法 |
CN107492724B (zh) * | 2017-07-05 | 2019-11-05 | 华为技术有限公司 | 一种连接器及其制备方法、通信设备 |
KR20190023028A (ko) * | 2017-08-25 | 2019-03-07 | 삼성디스플레이 주식회사 | 접속 부재, 이를 포함하는 표시 장치, 및 표시 장치의 제조방법 |
CN108447589B (zh) * | 2018-04-18 | 2024-05-24 | 江苏金奕达铜业股份有限公司 | 一种可拼接铜排 |
KR102280651B1 (ko) * | 2018-12-26 | 2021-07-23 | 주식회사 아이에스시 | 전기접속용 커넥터 및 그 제조 방법 |
KR102110150B1 (ko) * | 2019-01-08 | 2020-06-08 | (주)티에스이 | 신호 전송 커넥터용 도전부 보호부재 및 그 제조방법과, 이를 갖는 신호 전송 커넥터 및 그 제조방법 |
TWI672711B (zh) * | 2019-01-10 | 2019-09-21 | 健策精密工業股份有限公司 | 絕緣金屬基板及其製造方法 |
US11139262B2 (en) * | 2019-02-07 | 2021-10-05 | Micron Technology, Inc. | Use of pre-channeled materials for anisotropic conductors |
CN109796903B (zh) * | 2019-03-08 | 2024-06-21 | 深圳市润沃自动化工程有限公司 | 一种异向性导电胶结构及其生产方法 |
CN110996494B (zh) * | 2019-12-19 | 2024-06-04 | 北京比特大陆科技有限公司 | 电路板和具有其的服务器 |
TWI742642B (zh) * | 2020-05-05 | 2021-10-11 | 泰可廣科技股份有限公司 | 具有斜向導線式導電膠片的電連接組件 |
KR102466241B1 (ko) * | 2020-05-27 | 2022-11-14 | 주식회사 아이에스시 | 전기접속용 커넥터 |
WO2021241654A1 (ja) * | 2020-05-29 | 2021-12-02 | 三井化学株式会社 | 異方導電性シート、異方導電性シートの製造方法、電気検査装置および電気検査方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3541222A (en) * | 1969-01-13 | 1970-11-17 | Bunker Ramo | Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making |
US3620873A (en) * | 1969-03-26 | 1971-11-16 | Ercon Inc | Making metal-plastic gasket materials |
US3971610A (en) * | 1974-05-10 | 1976-07-27 | Technical Wire Products, Inc. | Conductive elastomeric contacts and connectors |
US4008300A (en) * | 1974-10-15 | 1977-02-15 | A & P Products Incorporated | Multi-conductor element and method of making same |
US4209481A (en) * | 1976-04-19 | 1980-06-24 | Toray Industries, Inc. | Process for producing an anisotropically electroconductive sheet |
JPS5555985U (de) * | 1978-10-12 | 1980-04-16 | ||
US4249302A (en) * | 1978-12-28 | 1981-02-10 | Ncr Corporation | Multilayer printed circuit board |
US4988306A (en) * | 1989-05-16 | 1991-01-29 | Labinal Components And Systems, Inc. | Low-loss electrical interconnects |
US4820376A (en) * | 1987-11-05 | 1989-04-11 | American Telephone And Telegraph Company At&T Bell Laboratories | Fabrication of CPI layers |
US5071359A (en) * | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
US5101553A (en) * | 1991-04-29 | 1992-04-07 | Microelectronics And Computer Technology Corporation | Method of making a metal-on-elastomer pressure contact connector |
EP0560072A3 (de) * | 1992-03-13 | 1993-10-06 | Nitto Denko Corporation | Anisotropisch-elektroleitende Klebe-Schicht und diese verwendende Verbindungsstruktur |
US5259110A (en) * | 1992-04-03 | 1993-11-09 | International Business Machines Corporation | Method for forming a multilayer microelectronic wiring module |
US5515604A (en) * | 1992-10-07 | 1996-05-14 | Fujitsu Limited | Methods for making high-density/long-via laminated connectors |
JP2500462B2 (ja) * | 1993-07-22 | 1996-05-29 | 日本電気株式会社 | 検査用コネクタおよびその製造方法 |
EP0645950B1 (de) * | 1993-09-21 | 1998-09-02 | Matsushita Electric Industrial Co., Ltd. | Verbindungsteil eines Schaltungssubstrats und Verfahren zur Herstellung mehrschichtiger Schaltungssubstrate unter Verwendung dieses Teils |
JP3400051B2 (ja) * | 1993-11-10 | 2003-04-28 | ザ ウィタカー コーポレーション | 異方性導電膜、その製造方法及びそれを使用するコネクタ |
US5509815A (en) * | 1994-06-08 | 1996-04-23 | At&T Corp. | Solder medium for circuit interconnection |
US5447264A (en) * | 1994-07-01 | 1995-09-05 | Mcnc | Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon |
US5497938A (en) * | 1994-09-01 | 1996-03-12 | Intel Corporation | Tape with solder forms and methods for transferring solder to chip assemblies |
DE69738298T2 (de) * | 1996-08-08 | 2008-09-18 | Nitto Denko Corp., Ibaraki | Anisotropische, leitende folie und ihr herstellungsverfahren |
JPH10308565A (ja) * | 1997-05-02 | 1998-11-17 | Shinko Electric Ind Co Ltd | 配線基板 |
US6059579A (en) * | 1997-09-24 | 2000-05-09 | International Business Machines Corporation | Semiconductor structure interconnector and assembly |
DE10118816A1 (de) | 2000-04-18 | 2001-10-31 | Nitto Denko Corp | Herstellungsverfahren für eine anisotrope leitfähige Folie und nach diesem Verfahren hergestellte anisotrope leitfähige Folie |
US6465084B1 (en) * | 2001-04-12 | 2002-10-15 | International Business Machines Corporation | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
-
2004
- 2004-09-08 AT AT04021330T patent/ATE419661T1/de not_active IP Right Cessation
- 2004-09-08 EP EP04021330A patent/EP1515399B1/de not_active Not-in-force
- 2004-09-08 DE DE602004018720T patent/DE602004018720D1/de active Active
- 2004-09-09 SG SG200405710A patent/SG110194A1/en unknown
- 2004-09-09 US US10/936,946 patent/US7156669B2/en not_active Expired - Fee Related
- 2004-09-09 TW TW093127253A patent/TW200515644A/zh unknown
- 2004-09-09 KR KR1020040072303A patent/KR20050026683A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR20050026683A (ko) | 2005-03-15 |
ATE419661T1 (de) | 2009-01-15 |
DE602004018720D1 (de) | 2009-02-12 |
EP1515399A3 (de) | 2006-08-02 |
EP1515399B1 (de) | 2008-12-31 |
TW200515644A (en) | 2005-05-01 |
US7156669B2 (en) | 2007-01-02 |
US20050077542A1 (en) | 2005-04-14 |
EP1515399A2 (de) | 2005-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG110194A1 (en) | Anisotropic conductive film, production method thereof and method of use thereof | |
US7303403B2 (en) | Electrical connecting member capable of achieving stable connection with a simple structure and connector using the same | |
US7539027B2 (en) | Force distributing spring element | |
KR101359065B1 (ko) | 이방 도전성 커넥터 및 이방 도전성 커넥터 장치 | |
US7341476B2 (en) | Inter-member connection structure, method of manufacturing the same, and electronic apparatus including inter-member connection structure | |
DE60313447D1 (de) | Eingebetteter planarer zirkulator und verfahren zu seiner herstellung | |
WO2007056169A3 (en) | Electrical connector on a flexible carrier | |
FI20020190A0 (fi) | Menetelmõ komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi | |
WO2006023283A3 (en) | Electrical connector with stepped housing | |
CA2680734A1 (en) | Edge-to-edge connector system for electronic devices | |
US20050142900A1 (en) | Three-dimensional flexible interposer | |
TW200733475A (en) | Module with a built-in antenna, card-formed information device and manufacturing methods thereof | |
WO2007110544A3 (fr) | Substrat muni d'un element electroconducteur a fonction d'antenne | |
TW200629998A (en) | Printed circuit board and forming method thereof | |
FI20041525A0 (fi) | Elektroniikka moduuli ja menetelmä sen valmistamiseksi | |
US6778403B2 (en) | Wiring board having terminal | |
TWI267173B (en) | Circuit device and method for manufacturing thereof | |
US7701727B2 (en) | Portable electronic device | |
TW200943518A (en) | Systems and methods for ball grid array (BGA) escape routing | |
TW200640314A (en) | Manufacturing method of double-access flexible circuit board | |
CN102136234A (zh) | 用于测试微间距阵列的探针单元 | |
BRPI0411163A (pt) | processo para montar um componente eletrÈnico em uma base | |
US6595784B2 (en) | Interposer member having apertures for relieving stress and increasing contact compliancy | |
KR100973413B1 (ko) | 반도체 소자 테스트용 콘택터 | |
WO2007131256A3 (de) | Verfahren zum festlegen eines elektronischen bauteils auf einer leiterplatte sowie system bestehend aus einer leiterplatte und wenigstens einem elektronischen bauteil |