SG10201802086UA - Pressure sensitive adhesive sheet for work processing and method of manufacturing the same - Google Patents

Pressure sensitive adhesive sheet for work processing and method of manufacturing the same

Info

Publication number
SG10201802086UA
SG10201802086UA SG10201802086UA SG10201802086UA SG10201802086UA SG 10201802086U A SG10201802086U A SG 10201802086UA SG 10201802086U A SG10201802086U A SG 10201802086UA SG 10201802086U A SG10201802086U A SG 10201802086UA SG 10201802086U A SG10201802086U A SG 10201802086UA
Authority
SG
Singapore
Prior art keywords
sensitive adhesive
pressure sensitive
work processing
adhesive sheet
manufacturing
Prior art date
Application number
SG10201802086UA
Inventor
Takafumi OGASAWARA
Naoya Saiki
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG10201802086UA publication Critical patent/SG10201802086UA/en

Links

Landscapes

  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PRESSURE SENSITIVE ADHESIVE SHEET FOR WORK PROCESSING AND METHOD OF MANUFACTURING THE SAME [Name of Document] [Abstract] 5 [Problems] s include providing a pressure sensitive adhesive sheet for work processing which includes a conductive layer and a pressure sensitive adhesive layer composed of an energy ray-curable pressure sensitive adhesive but which is nevertheless suppressed in the 10 adhesive residue on a workpiece having recesses on its surface and providing a method of manufacturing the pressure sensitive adhesive sheet for work processing. [Solution] A pressure sensitive adhesive sheet for work processing (1) is provided which comprises a base material 15 (11), a conductive layer (12) laminated at one side of the base material (11), and a pressure sensitive adhesive layer (13) laminated on a surface of the conductive layer (12) opposite to the base material. The pressure sensitive adhesive layer (13) is composed of an energy ray-curable 20 pressure sensitive adhesive. The pressure sensitive adhesive sheet for work processing (1) has an interlaminar strength of 17 N/25 mm or more. The interlaminar strength is measured as a peel strength when, after a surface of the pressure sensitive adhesive sheet for work processing (1) 25 at the pressure sensitive adhesive layer (13) side is fixed to a support and the pressure sensitive adhesive layer (13) is irradiated with energy rays, a laminate of the base material (11) and the conductive layer (12) is peeled off from the pressure sensitive adhesive layer (13) at a 30 peeling speed of 300 mm/min and at 180°. [Selected Figure] FIG. 1
SG10201802086UA 2017-03-17 2018-03-14 Pressure sensitive adhesive sheet for work processing and method of manufacturing the same SG10201802086UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017052610A JP6831725B2 (en) 2017-03-17 2017-03-17 Adhesive sheet for workpiece processing and its manufacturing method

Publications (1)

Publication Number Publication Date
SG10201802086UA true SG10201802086UA (en) 2018-10-30

Family

ID=63717828

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201802086UA SG10201802086UA (en) 2017-03-17 2018-03-14 Pressure sensitive adhesive sheet for work processing and method of manufacturing the same

Country Status (2)

Country Link
JP (1) JP6831725B2 (en)
SG (1) SG10201802086UA (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102561868B1 (en) * 2017-07-25 2023-07-31 세키스이가가쿠 고교가부시키가이샤 Adhesive tape for protecting semiconductors and methods for processing semiconductors
WO2019188819A1 (en) * 2018-03-26 2019-10-03 リンテック株式会社 Adhesive agent composition, adhesive sheet, and method for producing processed product
CN113286860B (en) * 2019-03-22 2022-09-27 琳得科株式会社 Adhesive sheet for processing workpiece and method for producing same
WO2020195087A1 (en) * 2019-03-22 2020-10-01 リンテック株式会社 Adhesive sheet for work processing and method for producing same
JP2021187116A (en) 2020-06-03 2021-12-13 日東電工株式会社 Film with top coat layer, reinforcing film and image display device
JP7205596B1 (en) 2021-09-30 2023-01-17 住友ベークライト株式会社 Adhesive tape
JP7226501B1 (en) 2021-09-30 2023-02-21 住友ベークライト株式会社 Adhesive tapes and substrates for adhesive tapes

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08272297A (en) * 1995-03-30 1996-10-18 Dainippon Printing Co Ltd Rewritable label sheet and rewritable display medium laminated with the same
JP2006095875A (en) * 2004-09-29 2006-04-13 Mitsubishi Chem Mkv Co Polyolefinic laminated film and pressure-sensitive adhesive film
JP2007161857A (en) * 2005-12-13 2007-06-28 Fujifilm Corp Method for modifying substrate surface
JP5607401B2 (en) * 2010-03-30 2014-10-15 古河電気工業株式会社 Antistatic type semiconductor processing adhesive tape
JP2011248629A (en) * 2010-05-27 2011-12-08 Meihan Shinku Kogyo Kk Transparent electroconductive base material
JP2012176555A (en) * 2011-02-25 2012-09-13 Unitika Ltd Method of manufacturing laminated body
WO2016031788A1 (en) * 2014-08-28 2016-03-03 リンテック株式会社 Conductive adhesive sheet

Also Published As

Publication number Publication date
JP6831725B2 (en) 2021-02-17
JP2018154737A (en) 2018-10-04

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