SG10201802086UA - Pressure sensitive adhesive sheet for work processing and method of manufacturing the same - Google Patents
Pressure sensitive adhesive sheet for work processing and method of manufacturing the sameInfo
- Publication number
- SG10201802086UA SG10201802086UA SG10201802086UA SG10201802086UA SG10201802086UA SG 10201802086U A SG10201802086U A SG 10201802086UA SG 10201802086U A SG10201802086U A SG 10201802086UA SG 10201802086U A SG10201802086U A SG 10201802086UA SG 10201802086U A SG10201802086U A SG 10201802086UA
- Authority
- SG
- Singapore
- Prior art keywords
- sensitive adhesive
- pressure sensitive
- work processing
- adhesive sheet
- manufacturing
- Prior art date
Links
Landscapes
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PRESSURE SENSITIVE ADHESIVE SHEET FOR WORK PROCESSING AND METHOD OF MANUFACTURING THE SAME [Name of Document] [Abstract] 5 [Problems] s include providing a pressure sensitive adhesive sheet for work processing which includes a conductive layer and a pressure sensitive adhesive layer composed of an energy ray-curable pressure sensitive adhesive but which is nevertheless suppressed in the 10 adhesive residue on a workpiece having recesses on its surface and providing a method of manufacturing the pressure sensitive adhesive sheet for work processing. [Solution] A pressure sensitive adhesive sheet for work processing (1) is provided which comprises a base material 15 (11), a conductive layer (12) laminated at one side of the base material (11), and a pressure sensitive adhesive layer (13) laminated on a surface of the conductive layer (12) opposite to the base material. The pressure sensitive adhesive layer (13) is composed of an energy ray-curable 20 pressure sensitive adhesive. The pressure sensitive adhesive sheet for work processing (1) has an interlaminar strength of 17 N/25 mm or more. The interlaminar strength is measured as a peel strength when, after a surface of the pressure sensitive adhesive sheet for work processing (1) 25 at the pressure sensitive adhesive layer (13) side is fixed to a support and the pressure sensitive adhesive layer (13) is irradiated with energy rays, a laminate of the base material (11) and the conductive layer (12) is peeled off from the pressure sensitive adhesive layer (13) at a 30 peeling speed of 300 mm/min and at 180°. [Selected Figure] FIG. 1
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017052610A JP6831725B2 (en) | 2017-03-17 | 2017-03-17 | Adhesive sheet for workpiece processing and its manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201802086UA true SG10201802086UA (en) | 2018-10-30 |
Family
ID=63717828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201802086UA SG10201802086UA (en) | 2017-03-17 | 2018-03-14 | Pressure sensitive adhesive sheet for work processing and method of manufacturing the same |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6831725B2 (en) |
SG (1) | SG10201802086UA (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102561868B1 (en) * | 2017-07-25 | 2023-07-31 | 세키스이가가쿠 고교가부시키가이샤 | Adhesive tape for protecting semiconductors and methods for processing semiconductors |
WO2019188819A1 (en) * | 2018-03-26 | 2019-10-03 | リンテック株式会社 | Adhesive agent composition, adhesive sheet, and method for producing processed product |
CN113286860B (en) * | 2019-03-22 | 2022-09-27 | 琳得科株式会社 | Adhesive sheet for processing workpiece and method for producing same |
WO2020195087A1 (en) * | 2019-03-22 | 2020-10-01 | リンテック株式会社 | Adhesive sheet for work processing and method for producing same |
JP2021187116A (en) | 2020-06-03 | 2021-12-13 | 日東電工株式会社 | Film with top coat layer, reinforcing film and image display device |
JP7205596B1 (en) | 2021-09-30 | 2023-01-17 | 住友ベークライト株式会社 | Adhesive tape |
JP7226501B1 (en) | 2021-09-30 | 2023-02-21 | 住友ベークライト株式会社 | Adhesive tapes and substrates for adhesive tapes |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08272297A (en) * | 1995-03-30 | 1996-10-18 | Dainippon Printing Co Ltd | Rewritable label sheet and rewritable display medium laminated with the same |
JP2006095875A (en) * | 2004-09-29 | 2006-04-13 | Mitsubishi Chem Mkv Co | Polyolefinic laminated film and pressure-sensitive adhesive film |
JP2007161857A (en) * | 2005-12-13 | 2007-06-28 | Fujifilm Corp | Method for modifying substrate surface |
JP5607401B2 (en) * | 2010-03-30 | 2014-10-15 | 古河電気工業株式会社 | Antistatic type semiconductor processing adhesive tape |
JP2011248629A (en) * | 2010-05-27 | 2011-12-08 | Meihan Shinku Kogyo Kk | Transparent electroconductive base material |
JP2012176555A (en) * | 2011-02-25 | 2012-09-13 | Unitika Ltd | Method of manufacturing laminated body |
WO2016031788A1 (en) * | 2014-08-28 | 2016-03-03 | リンテック株式会社 | Conductive adhesive sheet |
-
2017
- 2017-03-17 JP JP2017052610A patent/JP6831725B2/en active Active
-
2018
- 2018-03-14 SG SG10201802086UA patent/SG10201802086UA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP6831725B2 (en) | 2021-02-17 |
JP2018154737A (en) | 2018-10-04 |
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