MY176995A - Dicing sheet - Google Patents

Dicing sheet

Info

Publication number
MY176995A
MY176995A MYPI2016700001A MYPI2016700001A MY176995A MY 176995 A MY176995 A MY 176995A MY PI2016700001 A MYPI2016700001 A MY PI2016700001A MY PI2016700001 A MYPI2016700001 A MY PI2016700001A MY 176995 A MY176995 A MY 176995A
Authority
MY
Malaysia
Prior art keywords
energy ray
pressure sensitive
sensitive adhesive
polymerizable compound
polyfunctional acrylate
Prior art date
Application number
MYPI2016700001A
Inventor
Takuo Nishida
Koma Yosuke
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY176995A publication Critical patent/MY176995A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A dicing sheet (1) comprising a base film (2) and a pressure sensitive adhesive layer (3) laminated at least on one surface of the base film ( 2) , wherein: the pressure sensitive adhesive layer (3) is formed of a pressure sensitive adhesive composition that contains an acrylic-based polymer (A) and a polyfunctional acrylate-based energy ray polymerizable compound (B); the polyfunctional acrylate-based energy ray polymerizable compound (B) has O. 004 to O. 009 moles of a polymerizable functional group in 1 g of the polyfunctional acrylate-based energy ray polymerizable compound (B); a ratio of the polyfunctional acrylate-based energy ray polymerizable compound (B) to a total amount of the acrylic-based polymer (A) and the polyfunctional acrylate-based energy ray polymerizable compound (B) is 20 to 65 mass%; and a thickness of the pressure sensitive adhesive layer (3) is 2 to 20 ?m. When the adherend is a workpiece such as a semiconductor package having a large surface roughness, the dicing sheet (1) has a sufficient adhesive strength before energy ray irradiation and also has a moderate adhesive strength after energy ray irradiation, and pressure sensitive adhesive aggregates are unlikely to be generated in the dicing sheet (1).
MYPI2016700001A 2013-07-05 2014-07-03 Dicing sheet MY176995A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013141816 2013-07-05

Publications (1)

Publication Number Publication Date
MY176995A true MY176995A (en) 2020-08-31

Family

ID=52143839

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016700001A MY176995A (en) 2013-07-05 2014-07-03 Dicing sheet

Country Status (6)

Country Link
JP (1) JP6317744B2 (en)
CN (1) CN105378899B (en)
MY (1) MY176995A (en)
PH (1) PH12016500005A1 (en)
SG (1) SG11201600047XA (en)
WO (1) WO2015002270A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9920227B2 (en) 2014-01-29 2018-03-20 Hitachi Chemical Company, Ltd. Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
TWI669369B (en) 2014-01-29 2019-08-21 日立化成股份有限公司 Adhesive composition, resin hardened material obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
CN105934491B (en) * 2014-01-29 2018-04-24 日立化成株式会社 Adhesive composite, used adhesive composite semiconductor device manufacture method and solid-state imager
JP6209097B2 (en) * 2014-02-07 2017-10-04 株式会社ディスコ Wafer processing method
WO2016144732A1 (en) * 2015-03-06 2016-09-15 Koninklijke Philips N.V. Method for attaching ceramic phosphor plates on light-emitting device (led) dies using a dicing tape, method to form a dicing tape, and dicing tape
CN111032754A (en) * 2017-08-29 2020-04-17 东亚合成株式会社 Resin sheet and curable composition for producing the same
KR20220080092A (en) * 2019-10-04 2022-06-14 린텍 가부시키가이샤 adhesive sheet

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4063614B2 (en) * 2002-08-30 2008-03-19 日東電工株式会社 Water-dispersed acrylic pressure-sensitive adhesive composition for re-peeling and pressure-sensitive adhesive sheet
JP2004186263A (en) * 2002-11-29 2004-07-02 Sekisui Chem Co Ltd Reinforced semiconductor wafer and method for manufacturing ic chip
JP2007238802A (en) * 2006-03-09 2007-09-20 Sekisui Chem Co Ltd Method for processing electronic part
JP5049620B2 (en) * 2007-03-20 2012-10-17 リンテック株式会社 Adhesive sheet
JP5513866B2 (en) * 2009-12-11 2014-06-04 リンテック株式会社 Adhesive sheet for processing electronic parts
JP5743555B2 (en) * 2010-02-02 2015-07-01 リンテック株式会社 Dicing sheet
JP2012180494A (en) * 2011-02-10 2012-09-20 Nitto Denko Corp Spontaneously rolling adhesive sheet, and method of manufacturing cut piece
WO2012111963A2 (en) * 2011-02-14 2012-08-23 (주)Lg화학 Substrate film and method for manufacturing same
JP5975621B2 (en) * 2011-11-02 2016-08-23 リンテック株式会社 Dicing sheet and semiconductor chip manufacturing method
JP6087122B2 (en) * 2012-12-04 2017-03-01 リンテック株式会社 Dicing sheet

Also Published As

Publication number Publication date
CN105378899A (en) 2016-03-02
JPWO2015002270A1 (en) 2017-02-23
CN105378899B (en) 2018-05-11
WO2015002270A1 (en) 2015-01-08
PH12016500005B1 (en) 2016-03-28
JP6317744B2 (en) 2018-04-25
SG11201600047XA (en) 2016-02-26
PH12016500005A1 (en) 2016-03-28

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