SG10201708893XA - Sheet, tape, and semiconductor device manufacturing method - Google Patents
Sheet, tape, and semiconductor device manufacturing methodInfo
- Publication number
- SG10201708893XA SG10201708893XA SG10201708893XA SG10201708893XA SG10201708893XA SG 10201708893X A SG10201708893X A SG 10201708893XA SG 10201708893X A SG10201708893X A SG 10201708893XA SG 10201708893X A SG10201708893X A SG 10201708893XA SG 10201708893X A SG10201708893X A SG 10201708893XA
- Authority
- SG
- Singapore
- Prior art keywords
- sheet
- tape
- semiconductor device
- device manufacturing
- accordance
- Prior art date
Links
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016221443A JP6812213B2 (ja) | 2016-11-14 | 2016-11-14 | シート、テープおよび半導体装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201708893XA true SG10201708893XA (en) | 2018-06-28 |
Family
ID=62172120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201708893XA SG10201708893XA (en) | 2016-11-14 | 2017-10-30 | Sheet, tape, and semiconductor device manufacturing method |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6812213B2 (ja) |
KR (1) | KR20180054461A (ja) |
CN (1) | CN108084912A (ja) |
SG (1) | SG10201708893XA (ja) |
TW (1) | TWI733931B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111524848A (zh) * | 2019-02-01 | 2020-08-11 | 相丰科技股份有限公司 | 拉伸膜扩张方法及膜扩张机 |
JP2020145392A (ja) * | 2019-03-08 | 2020-09-10 | 日東電工株式会社 | ダイシングテープ、及び接着フィルム付きダイシングテープ |
WO2020194613A1 (ja) * | 2019-03-27 | 2020-10-01 | 日立化成株式会社 | 半導体装置の製造方法、ダイボンディングフィルム、及びダイシング・ダイボンディング一体型接着シート |
JP7411381B2 (ja) * | 2019-10-28 | 2024-01-11 | 藤森工業株式会社 | ダイシングテープ、及び半導体部品の製造方法 |
CN111349403A (zh) * | 2020-03-27 | 2020-06-30 | 深圳市伟业鑫精密科技有限公司 | 用于电子设备的复合片材以及制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010074136A (ja) * | 2008-08-20 | 2010-04-02 | Hitachi Chem Co Ltd | 半導体装置の製造方法 |
WO2011132647A1 (ja) * | 2010-04-19 | 2011-10-27 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム |
CN104508069B (zh) * | 2012-08-02 | 2017-03-29 | 琳得科株式会社 | 膜状粘接剂、半导体接合用粘接片、和半导体装置的制造方法 |
JP6211771B2 (ja) * | 2013-02-08 | 2017-10-11 | 日東電工株式会社 | 粘着テープ |
JP6091954B2 (ja) * | 2013-03-26 | 2017-03-08 | リンテック株式会社 | 粘着シート、保護膜形成用フィルム、保護膜形成用複合シート、およびマーキング方法 |
WO2015145807A1 (ja) * | 2014-03-24 | 2015-10-01 | リンテック株式会社 | 保護膜形成フィルム、保護膜形成用シートおよび加工物の製造方法 |
JP6334223B2 (ja) * | 2014-03-26 | 2018-05-30 | リンテック株式会社 | 粘着シート |
JP6295135B2 (ja) * | 2014-04-24 | 2018-03-14 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
-
2016
- 2016-11-14 JP JP2016221443A patent/JP6812213B2/ja active Active
-
2017
- 2017-10-30 SG SG10201708893XA patent/SG10201708893XA/en unknown
- 2017-10-30 TW TW106137376A patent/TWI733931B/zh active
- 2017-11-09 KR KR1020170148639A patent/KR20180054461A/ko unknown
- 2017-11-13 CN CN201711114552.5A patent/CN108084912A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN108084912A (zh) | 2018-05-29 |
TWI733931B (zh) | 2021-07-21 |
JP6812213B2 (ja) | 2021-01-13 |
KR20180054461A (ko) | 2018-05-24 |
TW201833271A (zh) | 2018-09-16 |
JP2018081954A (ja) | 2018-05-24 |
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