PH12019501778A1 - Pressure-sensitive adhesive tape for semiconductor substrate fabrication and method for manufacturing semiconductor device - Google Patents
Pressure-sensitive adhesive tape for semiconductor substrate fabrication and method for manufacturing semiconductor deviceInfo
- Publication number
- PH12019501778A1 PH12019501778A1 PH12019501778A PH12019501778A PH12019501778A1 PH 12019501778 A1 PH12019501778 A1 PH 12019501778A1 PH 12019501778 A PH12019501778 A PH 12019501778A PH 12019501778 A PH12019501778 A PH 12019501778A PH 12019501778 A1 PH12019501778 A1 PH 12019501778A1
- Authority
- PH
- Philippines
- Prior art keywords
- semiconductor
- adhesive tape
- semiconductor substrate
- adhesive layer
- substrate
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 11
- 239000000758 substrate Substances 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000012790 adhesive layer Substances 0.000 abstract 4
- 238000007789 sealing Methods 0.000 abstract 4
- 239000002390 adhesive tape Substances 0.000 abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 125000003700 epoxy group Chemical group 0.000 abstract 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 1
- 229910052731 fluorine Inorganic materials 0.000 abstract 1
- 239000011737 fluorine Substances 0.000 abstract 1
- 239000003566 sealing material Substances 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Abstract
According to the present invention, an adhesive tape for use in the processing of a semiconductor substrate is provided, which comprises a base member and an adhesive layer laminated on one surface of the base member, and which can be used in such a manner that a sealed semiconductor connected body comprising a substrate, multiple semiconductor elements arranged on the substrate and a sealing part for sealing the multiple semiconductor elements is temporarily fixed onto the base member with the adhesive layer interposed therebetween when the sealed semiconductor connected body is cut in the thickness direction to produce multiple semiconductor sealed bodies. The adhesive tape for use in the processing of a semiconductor substrate is characterized in that the adhesive layer contains a release agent for reducing the adhesion of the adhesive layer to the sealing part upon the removal of the semiconductor sealed bodies from the adhesive tape for use in the processing of a semiconductor substrate, the sealing part is made from a sealing material containing an epoxy-group-containing compound, the epoxy-group-containing compound has a double bond in the molecular structure thereof, and the release agent is a silicone-type oil or a fluorine-containing surfactant.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017036945 | 2017-02-28 | ||
| PCT/JP2018/006282 WO2018159418A1 (en) | 2017-02-28 | 2018-02-21 | Adhesive tape of use in processing of semiconductor substrate, and method for manufacturing semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PH12019501778B1 PH12019501778B1 (en) | 2020-06-29 |
| PH12019501778A1 true PH12019501778A1 (en) | 2020-06-29 |
Family
ID=63370318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH12019501778A PH12019501778A1 (en) | 2017-02-28 | 2019-07-30 | Pressure-sensitive adhesive tape for semiconductor substrate fabrication and method for manufacturing semiconductor device |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6443590B1 (en) |
| CN (1) | CN110352472B (en) |
| MY (1) | MY176699A (en) |
| PH (1) | PH12019501778A1 (en) |
| SG (1) | SG11201907801PA (en) |
| TW (1) | TWI717587B (en) |
| WO (1) | WO2018159418A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11435257B2 (en) * | 2018-07-27 | 2022-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for monitoring vacuum valve closing condition in vacuum processing system |
| JP6639712B1 (en) * | 2019-02-15 | 2020-02-05 | 桜宮化学株式会社 | Thermosetting release coating and thermosetting release coating kit |
| JP2020164787A (en) * | 2019-03-27 | 2020-10-08 | 住友ベークライト株式会社 | Pressure-sensitive adhesive tape |
| JP6733803B1 (en) * | 2019-05-10 | 2020-08-05 | 住友ベークライト株式会社 | Adhesive tape for sticking substrates and base material for adhesive tape |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4816835B2 (en) * | 1999-07-19 | 2011-11-16 | 日立化成工業株式会社 | Non-conductive resin paste composition and semiconductor device using the same |
| JP4319892B2 (en) * | 2003-11-07 | 2009-08-26 | 株式会社巴川製紙所 | Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device |
| TWI478997B (en) * | 2009-07-16 | 2015-04-01 | Sekisui Chemical Co Ltd | Adhesive tape, laminated body and image display device |
| JP5992692B2 (en) * | 2012-02-20 | 2016-09-14 | 株式会社イーテック | Adhesive composition and adhesive sheet using the same |
| JP2017188539A (en) * | 2016-04-04 | 2017-10-12 | 住友ベークライト株式会社 | Semiconductor element, semiconductor element manufacturing method and semiconductor device |
-
2018
- 2018-02-21 MY MYPI2019004818A patent/MY176699A/en unknown
- 2018-02-21 WO PCT/JP2018/006282 patent/WO2018159418A1/en active Application Filing
- 2018-02-21 SG SG11201907801PA patent/SG11201907801PA/en unknown
- 2018-02-21 CN CN201880014576.XA patent/CN110352472B/en active Active
- 2018-02-21 JP JP2018527813A patent/JP6443590B1/en active Active
- 2018-02-26 TW TW107106272A patent/TWI717587B/en active
-
2019
- 2019-07-30 PH PH12019501778A patent/PH12019501778A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| MY176699A (en) | 2020-08-19 |
| TW201842114A (en) | 2018-12-01 |
| JP6443590B1 (en) | 2018-12-26 |
| CN110352472B (en) | 2020-09-29 |
| PH12019501778B1 (en) | 2020-06-29 |
| WO2018159418A1 (en) | 2018-09-07 |
| JPWO2018159418A1 (en) | 2019-03-14 |
| TWI717587B (en) | 2021-02-01 |
| CN110352472A (en) | 2019-10-18 |
| SG11201907801PA (en) | 2019-09-27 |
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