SE8504295L - WAY TO ENCOURAGE A WIREBAND ASSEMBLED SEMICONDUCTOR COMPONENTS - Google Patents
WAY TO ENCOURAGE A WIREBAND ASSEMBLED SEMICONDUCTOR COMPONENTSInfo
- Publication number
- SE8504295L SE8504295L SE8504295A SE8504295A SE8504295L SE 8504295 L SE8504295 L SE 8504295L SE 8504295 A SE8504295 A SE 8504295A SE 8504295 A SE8504295 A SE 8504295A SE 8504295 L SE8504295 L SE 8504295L
- Authority
- SE
- Sweden
- Prior art keywords
- layer
- hole
- wireband
- encourage
- component
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000010410 layer Substances 0.000 abstract 6
- 238000000465 moulding Methods 0.000 abstract 4
- 239000004568 cement Substances 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- 239000011241 protective layer Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01052—Tellurium [Te]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
A method is described for encapsulating components (1) supported by their leads in a hole in a carrier tape (2). A film coated with a cement layer is formed into a cup shaped structure (9,10) with the cement layer located on the inner side of the structure. The bottom (10) of the structure is covered with a molding layer (15), preferably a polymer, and it is placed in the hole so that its rims (9) extend over the edges of the hole, and the component (1) is brought into contact with the molding layer (15). The other side of the component (1) is covered with a protective layer, preferably a polymer, which extends over the edges of the component (1), contacting the molding layer (15), and the cup-shaped structure (9, 10) is bonded at its rims to the carrier tape by pressing and heating. Finally, the molding layer (15) and the protective layer are subjected to heat treatment for curing. <IMAGE>
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI843631A FI76220C (en) | 1984-09-17 | 1984-09-17 | FOERFARANDE FOER INKAPSLING AV PAO ETT BAERARBAND ANORDNADE HALVLEDARKOMPONENTER. |
Publications (2)
Publication Number | Publication Date |
---|---|
SE8504295D0 SE8504295D0 (en) | 1985-09-16 |
SE8504295L true SE8504295L (en) | 1986-03-18 |
Family
ID=8519611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8504295A SE8504295L (en) | 1984-09-17 | 1985-09-16 | WAY TO ENCOURAGE A WIREBAND ASSEMBLED SEMICONDUCTOR COMPONENTS |
Country Status (8)
Country | Link |
---|---|
BE (1) | BE903242A (en) |
CA (1) | CA1232372A (en) |
CH (1) | CH669477A5 (en) |
DE (1) | DE3533159A1 (en) |
FI (1) | FI76220C (en) |
FR (1) | FR2570544B1 (en) |
GB (1) | GB2164794B (en) |
SE (1) | SE8504295L (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3338597A1 (en) * | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME |
GB2202372B (en) * | 1984-07-05 | 1991-02-13 | Nat Semiconductor Corp | Pre-testable semiconductor die package and fabrication method |
FR2598258B1 (en) * | 1986-04-30 | 1988-10-07 | Aix Les Bains Composants | METHOD OF ENCAPSULATING INTEGRATED CIRCUITS. |
DE3623419A1 (en) * | 1986-07-11 | 1988-01-21 | Junghans Uhren Gmbh | METHOD FOR EQUIPPING A CABINET NETWORK FOR THE CIRCUIT HOLDER OF AN ELECTROMECHANICAL CLOCKWORK AND PARTLY ASSEMBLED CABINET NETWORK OF A CLOCKWORK CIRCUIT BRACKET |
JPH02155256A (en) * | 1988-12-08 | 1990-06-14 | Mitsubishi Electric Corp | Semiconductor device |
JP2751450B2 (en) * | 1989-08-28 | 1998-05-18 | セイコーエプソン株式会社 | Mounting structure of tape carrier and mounting method |
US5156983A (en) * | 1989-10-26 | 1992-10-20 | Digtial Equipment Corporation | Method of manufacturing tape automated bonding semiconductor package |
IT1243817B (en) * | 1990-10-09 | 1994-06-28 | Sgs Thomson Microelectronics | METHOD FOR THE MANUFACTURE OF PLASTIC CONTAINERS, FOR INTEGRATED CIRCUITS, WITH BUILT-IN THERMAL DISSIPATOR |
KR930010072B1 (en) * | 1990-10-13 | 1993-10-14 | 금성일렉트론 주식회사 | Ccd package and making method of the same |
JP2531382B2 (en) * | 1994-05-26 | 1996-09-04 | 日本電気株式会社 | Ball grid array semiconductor device and manufacturing method thereof |
AT402617B (en) * | 1995-07-11 | 1997-07-25 | Datacon Schweitzer & Zeindl Gm | SYSTEM FOR AUTOMATED, HERMETIC SYSTEM FOR AUTOMATED, HERMETIC LOCKING OF HOUSINGS LOCKING OF HOUSINGS |
DE19650318C2 (en) * | 1996-09-23 | 1999-05-06 | Tech Gmbh Antriebstechnik Und | Sheet metal housing for a circuit of the power electronics |
DE10117797C2 (en) * | 2001-04-10 | 2003-04-17 | Bosch Gmbh Robert | Mounting device and method for building an electronic component |
US6692610B2 (en) * | 2001-07-26 | 2004-02-17 | Osram Opto Semiconductors Gmbh | Oled packaging |
DE10151657C1 (en) * | 2001-08-02 | 2003-02-06 | Fraunhofer Ges Forschung | Process for assembling a chip with contacts on a substrate comprises applying adhesion agent points and an adhesive mark, joining the chip and the substrate, and allowing the adhesives to harden |
TW582078B (en) * | 2002-11-29 | 2004-04-01 | Chipmos Technologies Bermuda | Packaging process for improving effective die-bonding area |
FR2919756B1 (en) * | 2007-07-31 | 2009-11-20 | Tacchini Ets | METHOD FOR PROTECTING AN ELECTRONIC COMPONENT |
DE102013016697B4 (en) | 2013-08-19 | 2023-12-21 | Oechsler Aktiengesellschaft | Surface-mounted component and use thereof |
CN113602557B (en) * | 2021-08-04 | 2022-09-09 | 深圳市辉悦科技有限公司 | Chip braider with location secondary correction function |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3979659A (en) * | 1975-01-30 | 1976-09-07 | Texas Instruments Incorporated | Automotive alternator rectifier bridges |
US4300153A (en) * | 1977-09-22 | 1981-11-10 | Sharp Kabushiki Kaisha | Flat shaped semiconductor encapsulation |
US4330790A (en) * | 1980-03-24 | 1982-05-18 | National Semiconductor Corporation | Tape operated semiconductor device packaging |
FR2520541A1 (en) * | 1982-01-22 | 1983-07-29 | Flonic Sa | Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections |
FI72409C (en) * | 1984-03-09 | 1987-05-11 | Lohja Ab Oy | FOERFARANDE FOER INKAPSLING AV PAO EN BAERREMSA ANORDNADE HALVLEDARKOMPONENTER. |
-
1984
- 1984-09-17 FI FI843631A patent/FI76220C/en not_active IP Right Cessation
-
1985
- 1985-09-06 GB GB08522166A patent/GB2164794B/en not_active Expired
- 1985-09-16 BE BE0/215586A patent/BE903242A/en not_active IP Right Cessation
- 1985-09-16 FR FR858513669A patent/FR2570544B1/en not_active Expired - Fee Related
- 1985-09-16 SE SE8504295A patent/SE8504295L/en not_active Application Discontinuation
- 1985-09-16 CH CH4004/85A patent/CH669477A5/de not_active IP Right Cessation
- 1985-09-17 CA CA000490925A patent/CA1232372A/en not_active Expired
- 1985-09-17 DE DE19853533159 patent/DE3533159A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
SE8504295D0 (en) | 1985-09-16 |
CA1232372A (en) | 1988-02-02 |
GB8522166D0 (en) | 1985-10-09 |
CH669477A5 (en) | 1989-03-15 |
FI843631A0 (en) | 1984-09-17 |
FI76220C (en) | 1988-09-09 |
FR2570544B1 (en) | 1990-01-05 |
DE3533159A1 (en) | 1986-03-27 |
FI76220B (en) | 1988-05-31 |
FI843631L (en) | 1986-03-18 |
GB2164794B (en) | 1988-03-23 |
FR2570544A1 (en) | 1986-03-21 |
GB2164794A (en) | 1986-03-26 |
BE903242A (en) | 1986-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |
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