GB8522166D0 - Encapsulating semiconductor components - Google Patents

Encapsulating semiconductor components

Info

Publication number
GB8522166D0
GB8522166D0 GB858522166A GB8522166A GB8522166D0 GB 8522166 D0 GB8522166 D0 GB 8522166D0 GB 858522166 A GB858522166 A GB 858522166A GB 8522166 A GB8522166 A GB 8522166A GB 8522166 D0 GB8522166 D0 GB 8522166D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor components
encapsulating semiconductor
encapsulating
components
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB858522166A
Other versions
GB2164794B (en
GB2164794A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lohja Oy AB
Original Assignee
Lohja Oy AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lohja Oy AB filed Critical Lohja Oy AB
Publication of GB8522166D0 publication Critical patent/GB8522166D0/en
Publication of GB2164794A publication Critical patent/GB2164794A/en
Application granted granted Critical
Publication of GB2164794B publication Critical patent/GB2164794B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
GB08522166A 1984-09-17 1985-09-06 Method for encapsulating semiconductor components mounted on a carrier tape Expired GB2164794B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI843631A FI76220C (en) 1984-09-17 1984-09-17 FOERFARANDE FOER INKAPSLING AV PAO ETT BAERARBAND ANORDNADE HALVLEDARKOMPONENTER.

Publications (3)

Publication Number Publication Date
GB8522166D0 true GB8522166D0 (en) 1985-10-09
GB2164794A GB2164794A (en) 1986-03-26
GB2164794B GB2164794B (en) 1988-03-23

Family

ID=8519611

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08522166A Expired GB2164794B (en) 1984-09-17 1985-09-06 Method for encapsulating semiconductor components mounted on a carrier tape

Country Status (8)

Country Link
BE (1) BE903242A (en)
CA (1) CA1232372A (en)
CH (1) CH669477A5 (en)
DE (1) DE3533159A1 (en)
FI (1) FI76220C (en)
FR (1) FR2570544B1 (en)
GB (1) GB2164794B (en)
SE (1) SE8504295L (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3338597A1 (en) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME
GB2202372B (en) * 1984-07-05 1991-02-13 Nat Semiconductor Corp Pre-testable semiconductor die package and fabrication method
FR2598258B1 (en) * 1986-04-30 1988-10-07 Aix Les Bains Composants METHOD OF ENCAPSULATING INTEGRATED CIRCUITS.
DE3623419A1 (en) * 1986-07-11 1988-01-21 Junghans Uhren Gmbh METHOD FOR EQUIPPING A CABINET NETWORK FOR THE CIRCUIT HOLDER OF AN ELECTROMECHANICAL CLOCKWORK AND PARTLY ASSEMBLED CABINET NETWORK OF A CLOCKWORK CIRCUIT BRACKET
JPH02155256A (en) * 1988-12-08 1990-06-14 Mitsubishi Electric Corp Semiconductor device
JP2751450B2 (en) * 1989-08-28 1998-05-18 セイコーエプソン株式会社 Mounting structure of tape carrier and mounting method
US5156983A (en) * 1989-10-26 1992-10-20 Digtial Equipment Corporation Method of manufacturing tape automated bonding semiconductor package
IT1243817B (en) * 1990-10-09 1994-06-28 Sgs Thomson Microelectronics METHOD FOR THE MANUFACTURE OF PLASTIC CONTAINERS, FOR INTEGRATED CIRCUITS, WITH BUILT-IN THERMAL DISSIPATOR
KR930010072B1 (en) * 1990-10-13 1993-10-14 금성일렉트론 주식회사 Ccd package and making method of the same
JP2531382B2 (en) * 1994-05-26 1996-09-04 日本電気株式会社 Ball grid array semiconductor device and manufacturing method thereof
AT402617B (en) * 1995-07-11 1997-07-25 Datacon Schweitzer & Zeindl Gm SYSTEM FOR AUTOMATED, HERMETIC SYSTEM FOR AUTOMATED, HERMETIC LOCKING OF HOUSINGS LOCKING OF HOUSINGS
DE19650318C2 (en) * 1996-09-23 1999-05-06 Tech Gmbh Antriebstechnik Und Sheet metal housing for a circuit of the power electronics
DE10117797C2 (en) * 2001-04-10 2003-04-17 Bosch Gmbh Robert Mounting device and method for building an electronic component
US6692610B2 (en) * 2001-07-26 2004-02-17 Osram Opto Semiconductors Gmbh Oled packaging
DE10151657C1 (en) * 2001-08-02 2003-02-06 Fraunhofer Ges Forschung Process for assembling a chip with contacts on a substrate comprises applying adhesion agent points and an adhesive mark, joining the chip and the substrate, and allowing the adhesives to harden
TW582078B (en) * 2002-11-29 2004-04-01 Chipmos Technologies Bermuda Packaging process for improving effective die-bonding area
FR2919756B1 (en) * 2007-07-31 2009-11-20 Tacchini Ets METHOD FOR PROTECTING AN ELECTRONIC COMPONENT
DE102013016697B4 (en) 2013-08-19 2023-12-21 Oechsler Aktiengesellschaft Surface-mounted component and use thereof
CN113602557B (en) * 2021-08-04 2022-09-09 深圳市辉悦科技有限公司 Chip braider with location secondary correction function

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979659A (en) * 1975-01-30 1976-09-07 Texas Instruments Incorporated Automotive alternator rectifier bridges
US4300153A (en) * 1977-09-22 1981-11-10 Sharp Kabushiki Kaisha Flat shaped semiconductor encapsulation
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging
FR2520541A1 (en) * 1982-01-22 1983-07-29 Flonic Sa Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections
FI72409C (en) * 1984-03-09 1987-05-11 Lohja Ab Oy FOERFARANDE FOER INKAPSLING AV PAO EN BAERREMSA ANORDNADE HALVLEDARKOMPONENTER.

Also Published As

Publication number Publication date
SE8504295D0 (en) 1985-09-16
CA1232372A (en) 1988-02-02
CH669477A5 (en) 1989-03-15
SE8504295L (en) 1986-03-18
FI843631A0 (en) 1984-09-17
FI76220C (en) 1988-09-09
FR2570544B1 (en) 1990-01-05
DE3533159A1 (en) 1986-03-27
FI76220B (en) 1988-05-31
FI843631L (en) 1986-03-18
GB2164794B (en) 1988-03-23
FR2570544A1 (en) 1986-03-21
GB2164794A (en) 1986-03-26
BE903242A (en) 1986-01-16

Similar Documents

Publication Publication Date Title
GB2167229B (en) Semiconductor devices
GB8518801D0 (en) Semiconductor devices
DE3572568D1 (en) Compound semiconductor device
GB8714911D0 (en) Semiconductor integrated circuit
EP0178649A3 (en) Complementary semiconductor device
EP0157905A3 (en) Semiconductor device
EP0159273A3 (en) Semiconductor device
GB2166904B (en) Semiconductor devices
EP0183474A3 (en) Semiconductor device
GB8508932D0 (en) Semiconductor
GB8522166D0 (en) Encapsulating semiconductor components
GB8426023D0 (en) Semiconductor devices
GB8506111D0 (en) Encapsulating semiconductor components
GB8424296D0 (en) Semiconductor devices
GB8423690D0 (en) Semiconductor devices
EP0176226A3 (en) Semiconductor circuit
EP0152805A3 (en) Semiconductor device
GB8531175D0 (en) Semiconductor
GB8412275D0 (en) Manufacturing semiconductor devices
GB2168848B (en) Semiconductor devices
GB2168847B (en) Semiconductor devices
GB8418823D0 (en) Semiconductor devices
GB8426897D0 (en) Fabricating semiconductor devices
GB2171251B (en) Semiconductor devices
GB2166588B (en) Buried-resistance semiconductor devices

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19920906