FI76220C - FOERFARANDE FOER INKAPSLING AV PAO ETT BAERARBAND ANORDNADE HALVLEDARKOMPONENTER. - Google Patents

FOERFARANDE FOER INKAPSLING AV PAO ETT BAERARBAND ANORDNADE HALVLEDARKOMPONENTER. Download PDF

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Publication number
FI76220C
FI76220C FI843631A FI843631A FI76220C FI 76220 C FI76220 C FI 76220C FI 843631 A FI843631 A FI 843631A FI 843631 A FI843631 A FI 843631A FI 76220 C FI76220 C FI 76220C
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Prior art keywords
component
cup
polymer
layer
edges
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FI843631A
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Finnish (fi)
Swedish (sv)
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FI76220B (en
FI843631A0 (en
FI843631L (en
Inventor
Seppo Pienimaa
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Elkotrade Ag
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Application filed by Elkotrade Ag filed Critical Elkotrade Ag
Publication of FI843631A0 publication Critical patent/FI843631A0/en
Priority to FI843631A priority Critical patent/FI76220C/en
Priority to GB08522166A priority patent/GB2164794B/en
Priority to SE8504295A priority patent/SE8504295L/en
Priority to FR858513669A priority patent/FR2570544B1/en
Priority to BE0/215586A priority patent/BE903242A/en
Priority to CH4004/85A priority patent/CH669477A5/de
Priority to CA000490925A priority patent/CA1232372A/en
Priority to DE19853533159 priority patent/DE3533159A1/en
Publication of FI843631L publication Critical patent/FI843631L/en
Publication of FI76220B publication Critical patent/FI76220B/en
Application granted granted Critical
Publication of FI76220C publication Critical patent/FI76220C/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Description

7622076220

Menetelmä kantonauhalla olevien puolijohdekomponenttien kapseloimiseksi Tämän keksinnön kohteena on patenttivaatimuksen 1 johdannon mukainen menetelmä kantonauhalla olevien puolijohdekomponenttien kapseloimiseksi.The present invention relates to a method for encapsulating semiconductor components on a carrier according to the preamble of claim 1.

Automaattisissa komponenttien ladonta- ja käsittelymenetelmissä käytetään kantonauhalla olevia puolijohdekomponentteja. Suojaamattomat komponentit ovat alttita ympäristötekijöille ja mekaanisille vaurioille komponenttien tai komponentteja sisältävän tuotteen käsittelyvaiheissa. Tästä syystä on tarpeellista kapseloida puolijohdekomponentit nauhalla siten, että nauhaa ja komponentteja voidaan käyttää automaattisissa koneissa, kuten kapseloimattomia komponenttejakin. Puolijohdekomponenttien suojauksessa käytetyin menetelmä on ns. "transfer moulding", jossa polymeeriä siirretään paineella puolijohdekomponentin sisältävään valumuottiin. Tällä tekniikalla kapseloitaessa polymeerin paine kohdistuu johtimiin.Automated component stacking and handling methods use semiconductor components on a carrier tape. Unprotected components are susceptible to environmental factors and mechanical damage during the handling steps of the components or the product containing the components. For this reason, it is necessary to encapsulate semiconductor components with tape so that the tape and components can be used in automatic machines, as can unencapsulated components. The most commonly used method for the protection of semiconductor components is the so-called "transfer molding", in which a polymer is transferred under pressure to a mold containing a semiconductor component. When encapsulating with this technique, the pressure of the polymer is applied to the conductors.

FI-patenttihakemuksessa 840981 on esitetty menetelmä, jonka mukaan kunkin komponentin tukirenkaaseen painetaan kantonau-han molemmilta puolilta polymeerikalvo, ja näin käsitelty kantonauha saatetaan lämminilmapuhalluksen alaiseksi. Kanto-nauhan toiseen puoleen yhdistetään sitten polymeerillä kostutettu ja lämminilmakäsittelyn läpikäynyt kapselointinauha, ja näin saatu yhdistelmänauha lämmitetään esilämmitysuunis-sa. Tämän jälkeen komponentin pinnalle ja siten sen ILB-alueelle levitetään kapselointipolymeeria annostus- ja levi-tyslaitteen avulla, ja näin käsitelty yhdistelmänauha lämmitetään uunivyöhykkeessä polymeerin kovettamiseksi. Lopuksi kapselointinauha irroitetaan kapseloidut komponentit nyt sisältävästä kantonauhasta.FI patent application 840981 discloses a method according to which a polymer film is pressed into the support ring of each component on both sides of the carrier tape, and the carrier tape thus treated is subjected to hot air blowing. The other side of the carrier strip is then joined with a polymer-moistened and air-treated encapsulation strip, and the composite strip thus obtained is heated in a preheating furnace. The encapsulation polymer is then applied to the surface of the component and thus to its ILB region by means of a dosing and application device, and the composite strip thus treated is heated in a furnace zone to cure the polymer. Finally, the encapsulation tape is detached from the carrier tape now containing the encapsulated components.

Tämän keksinnön tarkoituksena on edelleen parantaa kantonauhalla olevien komponenttien suojausta. Tämä tapahtuu kek- 2 76220 sinnön mukaan käyttämällä polymeerikalvosta tehtyä kuppia tai sentapaista, 'joka liimataan komponentista lähtevien tai johtimia tukevan tukirenkaan alle. Kuppi estää suojauspoly-meerin leviämisen haluttua aluetta laajemmalle ja antaa suojaukselle tarkasti rajatun muodon.It is an object of the present invention to further improve the protection of the components on the carrier strap. According to the invention, this is done by using a cup made of polymer film or the like, which is glued under a support ring leaving the component or supporting the conductors. The cup prevents the protective polymer from spreading beyond the desired area and gives the protection a well-defined shape.

Täsmällisemmin sanottuna keksinnön mukaiselle menetelmälle on tunnusomaista se, mikä on esitetty patenttivaatimuksen 1 tunnusmerkkiosassa.More specifically, the method according to the invention is characterized by what is set forth in the characterizing part of claim 1.

Keksinnön mukaisella menetelmällä suojattuja komponentteja voidaan edullisesti käyttää bondaus- ja ladontakoneissa. Ladottaessa komponentit, joiden liitosjohtimet on taivutettu, liimataan pohjalevylle ja juotetaan johtimet pohjalevyn liitoskohtiin.The components protected by the method according to the invention can advantageously be used in bonding and stacking machines. When stacking components with bent connecting leads, glue to the base plate and solder the leads to the base plate junctions.

Keksinnön mukaista menetelmää ryhdytään seuraavassa lähemmin tarkastelemaan oheisten piirustusten mukaisten suoritusesi-merkkien avulla.The method according to the invention will now be examined in more detail with the aid of the embodiments according to the accompanying drawings.

Kuvio 1 esittää sivulta ja kuvio 2 päältä katsottuna kanto-nauhalla olevaa TAB-komponenttia.Figure 1 is a side view and Figure 2 is a top view of the TAB component on the carrier strap.

Kuvio 3 esittää kaaviollisesti keksinnön mukaisessa menetelmässä käytettävän kupin valmistusta.Figure 3 schematically shows the manufacture of a cup for use in the method according to the invention.

Kuvio 4 esittää leikkauskuvantona ja kuvio 5 päältä katsottuna yhtä kuppia.Figure 4 is a sectional view and Figure 5 is a plan view of one cup.

Kuvio 6 esittää kaaviollisesti polymeerin annostelua kupin pohjalle.Figure 6 schematically shows the dosing of the polymer to the bottom of the cup.

Kuvio 7 esittää leikkauskuvantona kupin liimausta kantonau-haan.Figure 7 is a sectional view of the gluing of the cup to the carrier.

Kuvio 8 esittää leikkauskuvantona ja kuvio 9 päältä katsottuna polymeerin annostelua ja levitystä komponentin päälle.Figure 8 is a sectional view and Figure 9 is a plan view of the dispensing and application of the polymer onto the component.

Kuvio 10 esittää kaaviollisesti samanaikaisesti suoritettavaa liimausta, suojausta ja esikovetusta.Figure 10 shows schematically the simultaneous gluing, protection and pre-curing.

3 762203,76220

Kuvio 11 esitttää leikkauskuvantona ja kuvio 12 päältä katsottuna kantonauhalla olevaa valmista suojattua komponenttia.Fig. 11 is a sectional view and Fig. 12 is a plan view of the finished protected component on the carrier tape.

Kuvio 13 esittää leikkauskuvantona kantonauhasta irrotettua, suojattua valmista komponenttia.Figure 13 shows a sectional view of a protected finished component detached from the carrier strap.

Levymäinen TAB(Tape Automatic Bonding)-komponentti 1 on kuvioiden 1 jo esittämällä tavalla ripustettu johtimien 7 varassa polyimidikantonauhassa 2 olevaan neliömäiseen aukkoon niin, että aukon ja komponentin 1 välille jää rengasmainen välys 4. Tätä välystä 4 ympäröi nauhan 2 osana tukirengas 5, jota puolestaan neljältä puolelta ympäröi neljä pitkänomaista aukkoa 3. Johtimet 7 yhdistävät komponentin 1 (välyksen 4 ja aukot 3 ylittäen) aukkojen ulkopuolella oleviin testausalueisiin 6. Edellä selostettu rakenne on lähtökohtana seu-raavassa selostettavassa viisivaiheisessa suojausmenetelmässä .The TAB (Tape Automatic Bonding) component 1 is suspended from the conductors 7 in a square opening in the polyimide carrier strip 2 as already shown in Figures 1, leaving an annular clearance 4 between the opening and the component 1. This clearance 4 is surrounded by a support ring 5 as part of the tape 2. is surrounded on four sides by four elongate openings 3. The conductors 7 connect the component 1 (beyond the clearance 4 and the openings 3) to the test areas 6 outside the openings. The structure described above is the starting point for the next five-step protection method.

VAIHE 1PHASE 1

Polyimidikalvoon 8 (paksuus n. 50 v>m), jonka pinnassa on esikovetettu liimakalvo, muovataan työkaluilla 12, 13 puristamalla loivareunainen kuppi 9-11. Kuppi 9-11 leikataan kalvosta 8 siten, että siinä on halutun levyinen reunus 9 (kuvio 4). Kupin syvyys mitoitetaan siten, että puolijohde-palan 1 pohjan ja kupin pohjan 10 väliin jää 100...200 nm. Kupin 9-11 reunus 9 mitoitetaan tukirenkaan 5 dimensioiden mukaan. Kupin 9-11 reunuksen 9 ulkomitat ovat 100...200 nm pienemmät kuin kantonauhassa 2 olevan tukirenkaan 5 ulkomitat. Tällä ja tarkalla kupin 9-11 kohdistuksella liimauksessa varmistetaan, etteivät johtimet 7 OLB-liitosalueella tai-vutusvaiheessa leikkaudu kupin 9-11 reunaa vasten.The polyimide film 8 (thickness approx. 50 v> m), which has a pre-cured adhesive film on its surface, is formed with tools 12, 13 by pressing a cup 9-11 with a bevelled edge. The cup 9-11 is cut from the film 8 so as to have a rim 9 of the desired width (Fig. 4). The depth of the cup is dimensioned so that 100 ... 200 nm is left between the bottom of the semiconductor chip 1 and the bottom 10 of the cup. The rim 9 of the cup 9-11 is dimensioned according to the dimensions of the support ring 5. The outer dimensions of the rim 9 of the cup 9-11 are 100 ... 200 nm smaller than the outer dimensions of the support ring 5 in the carrier strip 2. This and precise alignment of the cup 9-11 in gluing ensures that the conductors 7 in the OLB connection area or in the folding step do not cut against the edge of the cup 9-11.

VAIHE 2STEP 2

Muovattuun kuppiin 9-11 annostellaan polymeeriä 15 pohjalle 10 (kuvio 6). Tämä varmistaa yhtenäisen suojapolymeeriker-roksen muodostumisen komponentin 1 alle. Polymeeriä 15 4 76220 annostellaan vain sen verran, että se täyttää komponentin 1 ja kupin 9-11 välisen tilan, mutta niin, ettei se nosta komponenttia 1 ylöspäin.Polymer 15 is dispensed into the base 10 in the molded cup 9-11 (Figure 6). This ensures the formation of a uniform protective polymer layer under component 1. The polymer 15 4 76220 is dispensed only to the extent that it fills the space between component 1 and the cup 9-11, but so as not to lift component 1 upwards.

VAIHE 3STEP 3

Kuppi 9-11 liimataan kuppimateriaalina käytetyn kalvon 8 päällä olevalla esikovetetulla liimalla kantonauhan 2 alle (kuvio 7). Esikovetettu liima vaatii lämmityksen (n. 200°C) tarttuakseen kantonauhaan 2.The cup 9-11 is glued with a pre-cured adhesive on top of the film 8 used as the cup material under the carrier tape 2 (Fig. 7). The pre-cured adhesive requires heating (approx. 200 ° C) to adhere to the carrier tape 2.

Kuppi 9-11 asetetaan puristuspäähän 17, joka on muotoiltu siten, että se kohdistaa kupin 9-11. Puristuspää 17 kuumennetaan ja sillä puristetaan kuppi 9-11 kantonauhaan 2 kiinni. Liitoskohtaa 5 jäähdytetään, ennen kuin puristus lopetetaan, kupin 9-11 kiinnipysymisen varmistamiseksi. Lii-mausvaiheessa liiman tulee täyttää johtimien 7 välissä oleva tila ja muodostaa eristävä polymeerikerros johtimien 7 väliin. Tämän vuoksi liimakerroksen paksuus on 25...35 pm.The cup 9-11 is placed on a pressing head 17 shaped to align the cup 9-11. The pressing head 17 is heated and presses the cup 9-11 onto the carrier belt 2. The joint 5 is cooled before the compression is stopped to ensure that the cup 9-11 is retained. In the gluing step, the adhesive should fill the space between the conductors 7 and form an insulating polymer layer between the conductors 7. Therefore, the thickness of the adhesive layer is 25 to 35 μm.

VAIHE 4STEP 4

Komponentin 1 päälle levitetään suojapolymeeria 15' (kuvio 8). Annostelijän 14 kärkeä kuljetetaan komponentin 1 päällä kierukkamaisesti niin, että se kertaalleen kulkee koko päällystettävän alueen yli (kuvio 9). Annostelija 14 ja sen kärjen liikutus on siten konstruoitu, että polymeeriä 15' tulee tasaisesti koko siirtoreitille. Polymeerin 15' määrä on mitoitettu täyttämään komponentin 1 laidan ja kupin 9-11 reunan 9 välinen tila 4 ja komponentin 1 pinta kanto-nauhan 2 pinnan tasoa hieman korkeammaksi. Käytettävien suojapolymeer ien viskositeetit ovat 5.000...40.000 cps. Suoja-polymeerin valinnan määräävät suojausominaisuudet, kovetus-aika ja -lämpötila ja polymeerin kostutusominaisuudet.A protective polymer 15 'is applied to the component 1 (Fig. 8). The tip of the dispenser 14 is conveyed helically on the component 1 so that it once extends over the entire area to be coated (Fig. 9). The movement of the dispenser 14 and its tip is constructed so that the polymer 15 'enters evenly throughout the transfer path. The amount of polymer 15 'is dimensioned to fill the space 4 between the edge of the component 1 and the edge 9 of the cup 9-11 and the surface of the component 1 slightly higher than the surface level of the carrier strip 2. The viscosities of the protective polymers used are 5,000 ... 40,000 cps. The choice of protective polymer is determined by the protective properties, curing time and temperature, and the wetting properties of the polymer.

Suojapolymeerin 15' kostutusominaisuutta voidaan parantaa lämmittämällä kuppia 9-11, sillä suojapolymeerin viskositeetti laskee lämpötilan noustessa. Tällaisessa tapauksessa vaiheet 3 ja 4 tehdään samanaikaisesti (kuvio 10). Myös suo- 5 76220 japolymeerin esikovetus voidaan suorittaa tässä vaiheessa, kun pidetään suojattua komponenttia 1 puristusasennossa sekä säädetään puristuspään 17 lämpötila ja lämmitysaika polymeerille sopivaksi. Puristuspäässä 17 on jäähdytyskana-vat 18, joilla voidaan puristuspään 17 lämpötilaa alentaa, sekä irroituskanava 19, johon ohjattu paineilma irroittaa suojatun komponentin 1 puristuspäästä 17. Käytettäessä suo-japolymeerin 15' levitysvaiheessa tyhjöä, se yhdessä lämmityksen kanssa nopeuttaa haihtuvien osien poistumista ja vähentää huokosia kapseloinnissa.The wetting property of the protective polymer 15 'can be improved by heating the cup 9-11, since the viscosity of the protective polymer decreases with increasing temperature. In such a case, steps 3 and 4 are performed simultaneously (Fig. 10). The pre-curing of the protective polymer can also be carried out at this stage by holding the protected component 1 in the compression position and adjusting the temperature and heating time of the compression head 17 to suit the polymer. The compression head 17 has cooling channels 18 for lowering the temperature of the compression head 17 and a release duct 19 into which controlled compressed air detaches the shielded component 1 from the compression head 17. When vacuum is applied during application of the protective polymer 15 ' .

VAIHE 5STEP 5

Kantonauha 2, jossa olevat komponentit 1 on suojattu, ohjataan (ei-esitetyn) esikovetusuunin läpi. Suojapolymeeri 15' esikovetetaan ja kantonauha 2 pannaan spacer-nauhan kanssa kelalle. Tämän jälkeen kela pannaan suojapolymeerin vaatimaan loppukovetukseen.The carrier belt 2, in which the components 1 are protected, is guided through a pre-curing oven (not shown). The protective polymer 15 'is pre-cured and the carrier tape 2 is placed on a spool with a spacer tape. The coil is then placed in the final cure required by the protective polymer.

Suojattu komponentti voidaan nyt leikata irti kantonauhasta 2 esim. aukkojen 3 ulkoreunojen kohdalta, ja johtimet 7, joista komponentti 1 juotetaan piirilevyyn, taivutetaan (kuvio 13). Komponentit voidaan latoa ja liimata pohjasta piirilevylle ja juottaa kaikki komponentit samanaikaisesti tai juottaa kukin komponentti yksitellen.The shielded component can now be cut off from the carrier strip 2, e.g. at the outer edges of the openings 3, and the conductors 7 from which the component 1 is soldered to the circuit board are bent (Fig. 13). The components can be stacked and glued from the bottom to the circuit board and all components can be soldered simultaneously or each component can be soldered individually.

Käytetty kapselointipolymeeri 15, 15' voi olla epoksi-, silikoni- tai fenolityyppistä (esim. CASTAL 3^1 FR tai SUMITOMO CR 2000). Tärkeää on, ettei komponentin 1 ja kupin 9-11 väliin jää onkalolta.The encapsulation polymer 15, 15 'used can be of the epoxy, silicone or phenol type (e.g. CASTAL 3 ^ 1 FR or SUMITOMO CR 2000). It is important that there is no cavity between component 1 and cup 9-11.

Kuppien 9-11 raaka-aineena 8 voidaan polyimidin (esim. NITTO JR 2250) asemesta käyttää myös polyesteriä.Instead of polyimide (e.g. NITTO JR 2250), polyester can also be used as the raw material 8 for cups 9-11.

Kuppikalvon 8 päällä oleva liimakerros voi olla sinänsä tunnettua silikoni-, akryyli- tai epoksipohjäistä liima-ainetta. Liimakerros ei kylmänä ollessaan tartu, ja se on muovattavissa.The adhesive layer on the cup film 8 can be a silicone, acrylic or epoxy-based adhesive known per se. The adhesive layer does not stick when cold and is moldable.

6 762206 76220

Kantonauha 2 voi polyimidin asemesta olla esim. polyesteriä. Tällöin myös kuppikalvo 8 on mieluimmin polyesteriä.Instead of polyimide, the carrier strip 2 can be, for example, polyester. In this case, the cup film 8 is also preferably made of polyester.

Claims (6)

7622076220 1. Menetelmä sellaisten kantonauhalla (2) olevien komponenttien (1), varsinkin puolijohdekomponenttien, kapseloi-miseksi polymeerillä (15, 15') tai sentapaisella, jotka on johtimiensa (7) varassa ripustettu kantonauhassa (2) olevaan aukkoon (4), jonka menetelmän mukaan - muovataan kuppimainen rakenne (9-11), joka sovitetaan aukon (4) kohdalle niin, että sen reunat (9) ulottuvat aukon (4) reunojen yli ja komponentti (1) joutuu kosketukseen kuppimaisen rakenteen (9-11) pohjalle levitetyn täytekerroksen (15), sopivimmin polymeerikerroksen, kanssa, - komponentin (1) toiselle puolelle levitetään suoja-kerros (15'), sopivimmin polymeerikerros, joka ulottuu komponentin (1) reunojen yli kosketukseen täytekerroksen (15) kanssa, ja - täytekerros (15) ja suojakerros (15') saatetaan lämpökäsittelyn alaisiksi niin, että ne kovettues-saan sulkevat komponentin (1) sisäänsä, tunnettu siitä, että - käytetään sellaista kantonauhaa (2), jossa kutakin aukkoa (4) ympäröi tukirengas (5), - kuppimainen rakenne (9-11) muovataan liimapäällys-teisestä kalvomateriaalista (8) niin, että liima-kerros tulee rakenteen (9-11) sisäpuolelle, - kuppimaisen rakenteen reunat (9) sovitetaan ulottumaan tukirenkaan (5) alle, ja e 76220 - kuppimainen rakenne (9-11) kiinnitetään reunoistaan (9) puristamalla ja kuumentamalla kantonauhan (2) tukirenkaaseen (5).A method for encapsulating components (1) on a carrier tape (2), in particular semiconductor components, with a polymer (15, 15 ') or the like suspended on its conductors (7) in an opening (4) in the carrier tape (2), the method of which - forming a cup-shaped structure (9-11) which is fitted at the opening (4) so that its edges (9) extend over the edges of the opening (4) and the component (1) comes into contact with the filling layer applied to the bottom of the cup-shaped structure (9-11) (15), preferably with a polymer layer, - a protective layer (15 ') is applied to one side of the component (1), preferably a polymer layer extending over the edges of the component (1) into contact with the filling layer (15), and - the filling layer (15), and the protective layer (15 ') is subjected to a heat treatment so that, when cured, they enclose the component (1), characterized in that - a carrier strip (2) is used in which each opening (4) is surrounded by a support ring (5), - cup-shaped, the structure (9-11) is formed from an adhesive-coated film material (8) so that the adhesive layer comes inside the structure (9-11), - the edges (9) of the cup-shaped structure are adapted to extend under the support ring (5), and e 76220 - cup-shaped structure (9-11) are attached at their edges (9) by pressing and heating the support strap (2) to the support ring (5). 2. Patenttivaatimuksen 1 mukainen menetelmä, tunnettu siitä, että täytekerroksena (15) ja suojakerroksena (15') käytetään samaa ainetta, esim. jotain polymeeriä.Method according to Claim 1, characterized in that the same substance, e.g. a polymer, is used as the filling layer (15) and the protective layer (15 '). 3. Patenttivaatimuksen 1 mukainen menetelmä, tunnettu siitä, että täytekerroksen (15) levitys, kuppimaisen rakenteen (9-11) kiinnitys ja suojakerroksen (15') levitys suoritetaan erillisinä toimenpiteinä (kuviot 6 - 9).Method according to Claim 1, characterized in that the application of the filling layer (15), the attachment of the cup-like structure (9-11) and the application of the protective layer (15 ') are carried out as separate operations (Figures 6 to 9). 4. Jonkin edellisen patenttivaatimuksen mukainen menetelmä, tunnettu siitä, että puristus ja kuumennus suoritetaan samalla puristuskuumennuslaitteella (16-19). 9 76220Method according to one of the preceding claims, characterized in that the compression and heating are carried out by the same compression heating device (16-19). 9,76220 1. Förfarande för inkapsling av sadana pa ett bärar-band (2) befintliga komponenter (1), isynnerhet halvledar-komponenter, med en polymer (15, 15') eller liknande, vilka frSn sinä ledare (7) är upphängda i en pä bärarbandet (2) belägen öppning, enligt vilket förfarande - en skalformig konstruktion (9-11) formas, som anordnas vid öppningen (4) sä, att dess kanter (9) sträcker sig över öppningens (4) kanter och komponenten (1) hamnar i beröring med ett pa den skSlformiga konstruktionens (9-11) botten utbrett fyllmaterialskikt (15), företrädesvis ett poly-merskikt, - pa komponentens (1) andra sida utbredes ett skydds-skikt (15'), lämpligen ett polymerskikt, som sträcker sig över komponentens (1) kanter i beröring med fyllmaterialskiktet (15) och fyllmaterialskiktet (15) och skyddsskiktet (15') underkastas en värmebehandling sa, att de vid sin härdning i sig inkapslar komponenten (1), kännetecknat därav, att - ett sadant bärarband (2) användes, där varje öppning (4) är omgiven av en stödring (5), - den skalformiga konstruktionen (9-11) formas av ett limbelagt filmmaterial (8) sa, att limskiktet hamnar pt insidan av konstruktionen (9-11),1. A method for encapsulating a batch of a band (2) without a component (1), a solid halogen component, with a polymer (15, 15 ') or a liquid, which is the same as the lead (7) bärarbandet (2) belägen öppning, enligt vilket förfarande - en scalformig konstruktion (9-11) forms, with an order in the case of (4) in the case of an edge (9) sträcker sig överningens (4) kanter and component (1) hamnar in the form of a construction (9-11) made of polyethylene materials (15), made of polyethylene and a polyester, - of component (1) and of said material and a plastic material (15 '), heated and made of polymer, with the component (1) exposed to the filamentary component (15) and filamentary filament (15) and the filament (15 ') under the box and the coloring of the component (1), the reverse part of the ink component (1) bärarband (2) användes, där varje öppning (4) är omgiven av en st - a scaled structure (9-11) in the form of a limiting film material (8), which is limited to the construction of the structure (9-11),
FI843631A 1984-09-17 1984-09-17 FOERFARANDE FOER INKAPSLING AV PAO ETT BAERARBAND ANORDNADE HALVLEDARKOMPONENTER. FI76220C (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FI843631A FI76220C (en) 1984-09-17 1984-09-17 FOERFARANDE FOER INKAPSLING AV PAO ETT BAERARBAND ANORDNADE HALVLEDARKOMPONENTER.
GB08522166A GB2164794B (en) 1984-09-17 1985-09-06 Method for encapsulating semiconductor components mounted on a carrier tape
BE0/215586A BE903242A (en) 1984-09-17 1985-09-16 METHOD OF ENCAPSULATING SEMICONDUCTOR ELEMENTS MOUNTED ON A CARRIER TAPE
FR858513669A FR2570544B1 (en) 1984-09-17 1985-09-16 METHOD OF ENCAPSULATING SEMICONDUCTOR COMPONENTS MOUNTED ON A CARRIER STRIP
SE8504295A SE8504295L (en) 1984-09-17 1985-09-16 WAY TO ENCOURAGE A WIREBAND ASSEMBLED SEMICONDUCTOR COMPONENTS
CH4004/85A CH669477A5 (en) 1984-09-17 1985-09-16
CA000490925A CA1232372A (en) 1984-09-17 1985-09-17 Method for encapsulating semiconductor components mounted on a carrier tape
DE19853533159 DE3533159A1 (en) 1984-09-17 1985-09-17 METHOD FOR ENCODING COMPONENTS ASSEMBLED ON A CARRIER TAPE, ESPECIALLY SEMICONDUCTOR COMPONENTS

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI843631 1984-09-17
FI843631A FI76220C (en) 1984-09-17 1984-09-17 FOERFARANDE FOER INKAPSLING AV PAO ETT BAERARBAND ANORDNADE HALVLEDARKOMPONENTER.

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FI843631L FI843631L (en) 1986-03-18
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CH (1) CH669477A5 (en)
DE (1) DE3533159A1 (en)
FI (1) FI76220C (en)
FR (1) FR2570544B1 (en)
GB (1) GB2164794B (en)
SE (1) SE8504295L (en)

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CA1232372A (en) 1988-02-02
GB2164794A (en) 1986-03-26
DE3533159A1 (en) 1986-03-27
FI76220B (en) 1988-05-31
FI843631A0 (en) 1984-09-17
FR2570544A1 (en) 1986-03-21
FI843631L (en) 1986-03-18
SE8504295D0 (en) 1985-09-16
BE903242A (en) 1986-01-16
SE8504295L (en) 1986-03-18
GB2164794B (en) 1988-03-23
GB8522166D0 (en) 1985-10-09
CH669477A5 (en) 1989-03-15
FR2570544B1 (en) 1990-01-05

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