SE7714310L - Sett att framstella formstyva ledningsplattor - Google Patents

Sett att framstella formstyva ledningsplattor

Info

Publication number
SE7714310L
SE7714310L SE7714310A SE7714310A SE7714310L SE 7714310 L SE7714310 L SE 7714310L SE 7714310 A SE7714310 A SE 7714310A SE 7714310 A SE7714310 A SE 7714310A SE 7714310 L SE7714310 L SE 7714310L
Authority
SE
Sweden
Prior art keywords
circuit board
printed circuit
outer layer
flexible
conductor plates
Prior art date
Application number
SE7714310A
Other languages
English (en)
Other versions
SE424132B (sv
Inventor
H Kober
Original Assignee
Schoeller & Co Elektronik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoeller & Co Elektronik filed Critical Schoeller & Co Elektronik
Publication of SE7714310L publication Critical patent/SE7714310L/sv
Publication of SE424132B publication Critical patent/SE424132B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Conductors (AREA)
SE7714310A 1976-12-17 1977-12-15 Sett att framstella styva ledade ledningsplattor SE424132B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762657212 DE2657212C3 (de) 1976-12-17 1976-12-17 Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten

Publications (2)

Publication Number Publication Date
SE7714310L true SE7714310L (sv) 1978-06-18
SE424132B SE424132B (sv) 1982-06-28

Family

ID=5995786

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7714310A SE424132B (sv) 1976-12-17 1977-12-15 Sett att framstella styva ledade ledningsplattor

Country Status (10)

Country Link
BE (1) BE861966A (sv)
CH (1) CH630202A5 (sv)
DE (1) DE2657212C3 (sv)
DK (1) DK142475C (sv)
FR (1) FR2374818A1 (sv)
GB (1) GB1561620A (sv)
IE (1) IE46109B1 (sv)
IT (1) IT1091374B (sv)
NL (1) NL180294C (sv)
SE (1) SE424132B (sv)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2946726C2 (de) * 1979-11-20 1982-05-19 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Leiterplatte mit starren und flexiblen Bereichen und Verfahren zu deren Herstellung
DE3047197C1 (de) * 1980-12-15 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Leiterplatten,die abschnittsweise relativ starre und demgegenueber relativ flexible Bereiche aufweisen
DE3119884C1 (de) * 1981-05-19 1982-11-04 Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten
DE3140061C1 (de) * 1981-10-08 1983-02-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten
DE3318717C1 (de) * 1983-05-21 1984-05-30 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig & Co KG, 8510 Fürth Verfahren zum Herstellen von Leiterplatten mit starren und flexiblen Bereichen
DE3434672C2 (de) * 1984-09-21 1986-09-11 Fa. Carl Freudenberg, 6940 Weinheim Verfahren zur Herstellung von flexiblen Leiterplatten für hohe Biegebeanspruchung
DE3535773C1 (en) * 1985-10-07 1987-04-23 Messerschmitt Boelkow Blohm Method for producing rigid-flexible multilayer circuits
DE3624718A1 (de) * 1986-07-22 1988-01-28 Schoeller & Co Elektronik Mehrlagige, starre und flexible bereiche aufweisende leiterplatte
DE3624719A1 (de) * 1986-07-22 1988-01-28 Schoeller & Co Elektronik Vorlaminat fuer starr-flexible leiterplatten
JP2631287B2 (ja) * 1987-06-30 1997-07-16 日本メクトロン 株式会社 混成多層回路基板の製造法
DE3723414A1 (de) * 1987-07-15 1989-01-26 Leitron Leiterplatten Verfahren zur herstellung von gedruckten schaltungen in starrer oder starrflexibler mehrlagentechnik
JP2676112B2 (ja) * 1989-05-01 1997-11-12 イビデン株式会社 電子部品搭載用基板の製造方法
ATE91377T1 (de) * 1989-07-15 1993-07-15 Freudenberg Carl Fa Verfahren zur herstellung von starre und flexible bereiche aufweisenden leiterplatten oder leiterplatten-innenlagen.
DE4003344C1 (sv) * 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4003345C1 (sv) * 1990-02-05 1991-08-08 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4131934A1 (de) * 1991-09-25 1993-04-08 Degussa Verfahren zur herstellung von starren, in teilbereichen biegbaren gedruckten schaltungen
DE4206746C1 (en) * 1992-03-04 1993-06-24 Degussa Ag, 6000 Frankfurt, De Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away
US6298013B1 (en) 1993-11-15 2001-10-02 Siemens Aktiengesellschaft Device for monitoring the travel time of mail shipments
DE10248112B4 (de) * 2002-09-09 2007-01-04 Ruwel Ag Verfahren zur Herstellung von gedruckten elektrischen Schaltungen
DE10243637B4 (de) 2002-09-19 2007-04-26 Ruwel Ag Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich sowie Verfahren zur Herstellung von starr-flexiblen Leiterplatten
DE10258090B4 (de) * 2002-09-19 2009-01-29 Ruwel Ag Verfahren zur Herstellung von starr-flexiblen Leiterplatten und Leiterplatten mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich
DE20221189U1 (de) * 2002-09-19 2005-05-19 Ruwel Ag Leiterplatte mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich
CN113286437B (zh) * 2021-06-11 2021-10-01 四川英创力电子科技股份有限公司 一种加工软硬结合板的辅助装置及其使用方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3459626A (en) * 1964-11-06 1969-08-05 Morgan Adhesives Co Label carrier and release laminate
FR1481461A (fr) * 1965-06-01 1967-05-19 Philips Nv Plaque à câblage imprimé
AT256275B (de) * 1965-06-01 1967-08-10 Philips Nv Leiterplatte, welche entlang einer durch eine Perforation, Einkerbungen od. dgl. festgelegten Bruchlinie bzw. Bruchlinien in mindestens zwei Leiterplattenteile teilbar ist

Also Published As

Publication number Publication date
NL180294C (nl) 1987-02-02
DE2657212A1 (de) 1978-06-22
DK142475B (da) 1980-11-03
FR2374818A1 (fr) 1978-07-13
IE46109L (en) 1978-06-17
NL180294B (nl) 1986-09-01
GB1561620A (en) 1980-02-27
CH630202A5 (en) 1982-05-28
NL7713431A (nl) 1978-06-20
DK142475C (da) 1981-03-30
DE2657212C3 (de) 1982-09-02
DK546677A (da) 1978-06-18
DE2657212B2 (de) 1979-08-09
IE46109B1 (en) 1983-02-23
IT1091374B (it) 1985-07-06
SE424132B (sv) 1982-06-28
FR2374818B1 (sv) 1982-05-21
BE861966A (fr) 1978-06-16

Similar Documents

Publication Publication Date Title
SE7714310L (sv) Sett att framstella formstyva ledningsplattor
JPS5648198A (en) Method of manufacturing flexible printed circuit board
JPS566498A (en) Method of manufacturing flexible printed circuit board
JPS5225267A (en) Method of manufacturing multilayered printed circuit board
JPS5552285A (en) Method of manufacturing flexible printed circuit board
JPS5612794A (en) Method of manufacturing flexible printed circuit board
JPS5671990A (en) Method of manufacturing rigid flexible composite printed circuit board
JPS5578597A (en) Method of fabricating multilayer printed circuit board
JPS5552284A (en) Method of manufacturing flexible printed circuit board
JPS5553497A (en) Method of manufacturing multilayer printed circuit board
JPS5219263A (en) Method of manufacturing multilayered printed circuit board
JPS5521144A (en) Method of manufacturing multiple layer printed circuit board
JPS5550696A (en) Method of manufacturing multilayer printed circuit board
JPS554955A (en) Method of manufacturing multilayer printed circuit board
JPS5550695A (en) Method of manufacturing multilayer printed circuit board
JPS5550694A (en) Method of manufacturing multilayer printed circuit board
JPS51142669A (en) Method of manufacturing multilayered printed circuit board
JPS5575285A (en) Method of fabricating flexible printed circuit board
JPS5575292A (en) Method of fabricating flexible printed circuit board
JPS5575286A (en) Method of fabricating flexible printed circuit board
SU645294A1 (ru) Способ изготовлени многослойной платы
JPS55148487A (en) Method of fabricating flexible printed circuit board
JPS5543839A (en) Method of fabricating multilayer printed circuit board
JPS5574199A (en) Method of fabricating multilayer printed circuit board
JPS5553494A (en) Method of manufacturing multilayer printed circuit board

Legal Events

Date Code Title Description
NAL Patent in force

Ref document number: 7714310-5

Format of ref document f/p: F