SE7714310L - METHOD OF MANUFACTURING MOLDED CONDUCTOR PLATES - Google Patents
METHOD OF MANUFACTURING MOLDED CONDUCTOR PLATESInfo
- Publication number
- SE7714310L SE7714310L SE7714310A SE7714310A SE7714310L SE 7714310 L SE7714310 L SE 7714310L SE 7714310 A SE7714310 A SE 7714310A SE 7714310 A SE7714310 A SE 7714310A SE 7714310 L SE7714310 L SE 7714310L
- Authority
- SE
- Sweden
- Prior art keywords
- circuit board
- printed circuit
- outer layer
- flexible
- conductor plates
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The printed circuit board is produced by pressing rigid and flexible individual layers (3,1). To remove the rigid outer layer (3) in that area (6) of the printed circuit board which is required to be flexible, grooves (4,5) are made on the inside of the rigid outer layer (3) before pressing and on its outside after the conductor pattern (8a) has been produced and the part (6a) of the rigid outer layer (3) between the grooves (4,5) is broken out. In this way, the flexible area (6) of the printed circuit board is reliably and expediently covered and uncontrollable positional errors in the covering are eliminated. <IMAGE>
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19762657212 DE2657212C3 (en) | 1976-12-17 | 1976-12-17 | Process for the production of rigid and flexible areas having printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
SE7714310L true SE7714310L (en) | 1978-06-18 |
SE424132B SE424132B (en) | 1982-06-28 |
Family
ID=5995786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7714310A SE424132B (en) | 1976-12-17 | 1977-12-15 | SET TO MAKE STUFF LEADED WIRING PLATE |
Country Status (10)
Country | Link |
---|---|
BE (1) | BE861966A (en) |
CH (1) | CH630202A5 (en) |
DE (1) | DE2657212C3 (en) |
DK (1) | DK142475C (en) |
FR (1) | FR2374818A1 (en) |
GB (1) | GB1561620A (en) |
IE (1) | IE46109B1 (en) |
IT (1) | IT1091374B (en) |
NL (1) | NL180294C (en) |
SE (1) | SE424132B (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2946726C2 (en) * | 1979-11-20 | 1982-05-19 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Printed circuit board with rigid and flexible areas and process for their manufacture |
DE3047197C1 (en) * | 1980-12-15 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | Process for the production of printed circuit boards which have sections which are relatively rigid and, on the other hand, relatively flexible areas |
DE3119884C1 (en) * | 1981-05-19 | 1982-11-04 | Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München | Process for the production of rigid and flexible printed circuit boards |
DE3140061C1 (en) * | 1981-10-08 | 1983-02-03 | Siemens AG, 1000 Berlin und 8000 München | Method of producing printed circuit boards having rigid and flexible regions |
DE3318717C1 (en) * | 1983-05-21 | 1984-05-30 | Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig & Co KG, 8510 Fürth | Process for manufacturing printed circuit boards with rigid and flexible areas |
DE3434672C2 (en) * | 1984-09-21 | 1986-09-11 | Fa. Carl Freudenberg, 6940 Weinheim | Process for the production of flexible printed circuit boards for high bending stress |
DE3535773C1 (en) * | 1985-10-07 | 1987-04-23 | Messerschmitt Boelkow Blohm | Method for producing rigid-flexible multilayer circuits |
DE3624719A1 (en) * | 1986-07-22 | 1988-01-28 | Schoeller & Co Elektronik | PRELAMINATE FOR RIGID-FLEXIBLE PCB |
DE3624718A1 (en) * | 1986-07-22 | 1988-01-28 | Schoeller & Co Elektronik | MULTI-LAYER, RIGID AND FLEXIBLE AREAS HAVING PCB |
JP2631287B2 (en) * | 1987-06-30 | 1997-07-16 | 日本メクトロン 株式会社 | Manufacturing method of hybrid multilayer circuit board |
DE3723414A1 (en) * | 1987-07-15 | 1989-01-26 | Leitron Leiterplatten | METHOD FOR PRODUCING PRINTED CIRCUITS IN RIGID OR RIGID-FLEXIBLE MULTIPLE-LAYER TECHNOLOGY |
JP2676112B2 (en) * | 1989-05-01 | 1997-11-12 | イビデン株式会社 | Manufacturing method of electronic component mounting board |
EP0408773B1 (en) * | 1989-07-15 | 1993-07-07 | Firma Carl Freudenberg | Process for the production of circuit boards or inner layers of circuit boards containing rigid and flexible parts |
DE4003344C1 (en) * | 1990-02-05 | 1991-06-13 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
DE4003345C1 (en) * | 1990-02-05 | 1991-08-08 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
DE4131934A1 (en) * | 1991-09-25 | 1993-04-08 | Degussa | Mfg. circuit board with flexible section - using blank with cut=out regions and joining by forming thin laminate of same material as main section |
DE4206746C1 (en) * | 1992-03-04 | 1993-06-24 | Degussa Ag, 6000 Frankfurt, De | Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away |
US6298013B1 (en) | 1993-11-15 | 2001-10-02 | Siemens Aktiengesellschaft | Device for monitoring the travel time of mail shipments |
DE10248112B4 (en) * | 2002-09-09 | 2007-01-04 | Ruwel Ag | Process for the production of printed electrical circuits |
DE10258090B4 (en) * | 2002-09-19 | 2009-01-29 | Ruwel Ag | Method for producing rigid-flexible printed circuit boards and printed circuit boards with at least one rigid area and at least one flexible area |
DE10243637B4 (en) | 2002-09-19 | 2007-04-26 | Ruwel Ag | Printed circuit board with at least one rigid and at least one flexible region and method for producing rigid-flexible printed circuit boards |
DE20221189U1 (en) * | 2002-09-19 | 2005-05-19 | Ruwel Ag | Printed circuit board with at least one rigid area and at least one flexible area |
CN113286437B (en) * | 2021-06-11 | 2021-10-01 | 四川英创力电子科技股份有限公司 | Auxiliary device for processing rigid-flex board and using method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3459626A (en) * | 1964-11-06 | 1969-08-05 | Morgan Adhesives Co | Label carrier and release laminate |
FR1481461A (en) * | 1965-06-01 | 1967-05-19 | Philips Nv | Printed wiring plate |
AT256275B (en) * | 1965-06-01 | 1967-08-10 | Philips Nv | Circuit board which can be divided into at least two circuit board parts along a break line or break lines defined by a perforation, notches or the like |
-
1976
- 1976-12-17 DE DE19762657212 patent/DE2657212C3/en not_active Expired
-
1977
- 1977-11-28 GB GB4940477A patent/GB1561620A/en not_active Expired
- 1977-12-05 NL NL7713431A patent/NL180294C/en not_active IP Right Cessation
- 1977-12-08 DK DK546677A patent/DK142475C/en active
- 1977-12-15 IE IE254977A patent/IE46109B1/en not_active IP Right Cessation
- 1977-12-15 SE SE7714310A patent/SE424132B/en unknown
- 1977-12-16 BE BE6046268A patent/BE861966A/en not_active IP Right Cessation
- 1977-12-16 IT IT6982677A patent/IT1091374B/en active
- 1977-12-16 CH CH1554277A patent/CH630202A5/en not_active IP Right Cessation
- 1977-12-19 FR FR7738326A patent/FR2374818A1/en active Granted
Also Published As
Publication number | Publication date |
---|---|
BE861966A (en) | 1978-06-16 |
DE2657212B2 (en) | 1979-08-09 |
SE424132B (en) | 1982-06-28 |
NL180294C (en) | 1987-02-02 |
NL7713431A (en) | 1978-06-20 |
FR2374818A1 (en) | 1978-07-13 |
DK142475B (en) | 1980-11-03 |
IT1091374B (en) | 1985-07-06 |
IE46109L (en) | 1978-06-17 |
DE2657212C3 (en) | 1982-09-02 |
IE46109B1 (en) | 1983-02-23 |
FR2374818B1 (en) | 1982-05-21 |
CH630202A5 (en) | 1982-05-28 |
DK546677A (en) | 1978-06-18 |
GB1561620A (en) | 1980-02-27 |
NL180294B (en) | 1986-09-01 |
DE2657212A1 (en) | 1978-06-22 |
DK142475C (en) | 1981-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAL | Patent in force |
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