SE7705358L - Sett att framstella en halvledaranordning - Google Patents

Sett att framstella en halvledaranordning

Info

Publication number
SE7705358L
SE7705358L SE7705358A SE7705358A SE7705358L SE 7705358 L SE7705358 L SE 7705358L SE 7705358 A SE7705358 A SE 7705358A SE 7705358 A SE7705358 A SE 7705358A SE 7705358 L SE7705358 L SE 7705358L
Authority
SE
Sweden
Prior art keywords
manufacture
way
semiconductor device
semiconductor
Prior art date
Application number
SE7705358A
Other languages
English (en)
Other versions
SE429175B (sv
Inventor
W Steinmaier
De Zaldivar J Solo
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of SE7705358L publication Critical patent/SE7705358L/sv
Publication of SE429175B publication Critical patent/SE429175B/sv

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2251Diffusion into or out of group IV semiconductors
    • H01L21/2254Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
    • H01L21/2255Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238Complementary field-effect transistors, e.g. CMOS
    • H01L21/823857Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/053Field effect transistors fets
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/116Oxidation, differential
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/141Self-alignment coat gate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/143Shadow masking
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/914Doping
    • Y10S438/92Controlling diffusion profile by oxidation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
  • Thyristors (AREA)
SE7705358A 1976-05-11 1977-05-09 Sett att framstella en halvledaranordning SE429175B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7604986A NL7604986A (nl) 1976-05-11 1976-05-11 Werkwijze voor het vervaardigen van een halfgeleider- inrichting, en inrichting vervaardigd door toe- passing van de werkwijze.

Publications (2)

Publication Number Publication Date
SE7705358L true SE7705358L (sv) 1977-11-12
SE429175B SE429175B (sv) 1983-08-15

Family

ID=19826163

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7705358A SE429175B (sv) 1976-05-11 1977-05-09 Sett att framstella en halvledaranordning

Country Status (11)

Country Link
US (1) US4139402A (sv)
JP (1) JPS5850015B2 (sv)
AU (1) AU508451B2 (sv)
CA (1) CA1086868A (sv)
CH (1) CH615781A5 (sv)
DE (1) DE2718894C2 (sv)
FR (1) FR2351501A1 (sv)
GB (1) GB1523246A (sv)
IT (1) IT1085067B (sv)
NL (1) NL7604986A (sv)
SE (1) SE429175B (sv)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4217149A (en) * 1976-09-08 1980-08-12 Sanyo Electric Co., Ltd. Method of manufacturing complementary insulated gate field effect semiconductor device by multiple implantations and diffusion
US4506437A (en) * 1978-05-26 1985-03-26 Rockwell International Corporation Process for and structure of high density VLSI circuits, having self-aligned gates and contacts for FET devices and conducting lines
US4277881A (en) * 1978-05-26 1981-07-14 Rockwell International Corporation Process for fabrication of high density VLSI circuits, having self-aligned gates and contacts for FET devices and conducting lines
US4455737A (en) * 1978-05-26 1984-06-26 Rockwell International Corporation Process for and structure of high density VLSI circuits, having self-aligned gates and contacts for FET devices and conducting lines
DE2936724A1 (de) * 1978-09-11 1980-03-20 Tokyo Shibaura Electric Co Halbleitervorrichtung und verfahren zu ihrer herstellung
JPS5555559A (en) * 1978-10-19 1980-04-23 Toshiba Corp Method of fabricating semiconductor device
US4305760A (en) * 1978-12-22 1981-12-15 Ncr Corporation Polysilicon-to-substrate contact processing
US4306916A (en) * 1979-09-20 1981-12-22 American Microsystems, Inc. CMOS P-Well selective implant method
DE3037316C2 (de) * 1979-10-03 1982-12-23 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa Verfahren zur Herstellung von Leistungsthyristoren
US4295897B1 (en) * 1979-10-03 1997-09-09 Texas Instruments Inc Method of making cmos integrated circuit device
EP0030147B1 (en) * 1979-11-29 1983-05-11 Kabushiki Kaisha Toshiba Method for manufacturing a semiconductor integrated circuit
US4345366A (en) * 1980-10-20 1982-08-24 Ncr Corporation Self-aligned all-n+ polysilicon CMOS process
US4391650A (en) * 1980-12-22 1983-07-05 Ncr Corporation Method for fabricating improved complementary metal oxide semiconductor devices
NL187328C (nl) * 1980-12-23 1991-08-16 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting.
AT387474B (de) * 1980-12-23 1989-01-25 Philips Nv Verfahren zur herstellung einer halbleitervorrichtung
DE3132809A1 (de) * 1981-08-19 1983-03-10 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von integrierten mos-feldeffekttransistoren, insbesondere von komplementaeren mos-feldeffekttransistorenschaltungen mit einer aus metallsiliziden bestehenden zusaetzlichen leiterbahnebene
DE3133468A1 (de) * 1981-08-25 1983-03-17 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von hochintegrierten komplementaeren mos-feldeffekttransistorschaltungen in siliziumgate-technologie
US4486943A (en) * 1981-12-16 1984-12-11 Inmos Corporation Zero drain overlap and self aligned contact method for MOS devices
US4412375A (en) * 1982-06-10 1983-11-01 Intel Corporation Method for fabricating CMOS devices with guardband
US4532695A (en) * 1982-07-02 1985-08-06 The United States Of America As Represented By The Secretary Of The Air Force Method of making self-aligned IGFET
US4480375A (en) * 1982-12-09 1984-11-06 International Business Machines Corporation Simple process for making complementary transistors
DE3314450A1 (de) * 1983-04-21 1984-10-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von hochintegrierten komplementaeren mos-feldeffekttransistorschaltungen
US4584761A (en) * 1984-05-15 1986-04-29 Digital Equipment Corporation Integrated circuit chip processing techniques and integrated chip produced thereby
US4760033A (en) * 1986-04-08 1988-07-26 Siemens Aktiengesellschaft Method for the manufacture of complementary MOS field effect transistors in VLSI technology
DE68925879T2 (de) * 1988-12-21 1996-10-02 At & T Corp Thermisches Oxydierungsverfahren mit verändertem Wachstum für dünne Oxide
JP3256048B2 (ja) * 1993-09-20 2002-02-12 富士通株式会社 半導体装置及びその製造方法
DE4404757C2 (de) * 1994-02-15 1998-08-20 Siemens Ag Verfahren zur Herstellung eines einem Graben benachbarten Diffusionsgebietes in einem Substrat
US7851339B2 (en) * 2008-05-29 2010-12-14 Promos Technologies Pte. Ltd. Method of repairing deep subsurface defects in a silicon substrate that includes diffusing negatively charged ions into the substrate from a sacrificial oxide layer
US9000525B2 (en) 2010-05-19 2015-04-07 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for alignment marks
US20140264557A1 (en) * 2013-03-15 2014-09-18 International Business Machines Corporation Self-aligned approach for drain diffusion in field effect transistors

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312577A (en) * 1964-11-24 1967-04-04 Int Standard Electric Corp Process for passivating planar semiconductor devices
US3418180A (en) * 1965-06-14 1968-12-24 Ncr Co p-n junction formation by thermal oxydation
US3507716A (en) * 1966-09-02 1970-04-21 Hitachi Ltd Method of manufacturing semiconductor device
US3574009A (en) * 1968-03-06 1971-04-06 Unitrode Corp Controlled doping of semiconductors
JPS495668B1 (sv) * 1970-04-03 1974-02-08
BE766403A (fr) * 1970-05-25 1971-09-16 Gen Electric Procede de fabrication de transistors a effet de champ
US3932239A (en) * 1970-10-27 1976-01-13 Cogar Corporation Semiconductor diffusion process
US3690969A (en) * 1971-05-03 1972-09-12 Motorola Inc Method of doping semiconductor substrates
US3921283A (en) * 1971-06-08 1975-11-25 Philips Corp Semiconductor device and method of manufacturing the device
US3798081A (en) * 1972-02-14 1974-03-19 Ibm Method for diffusing as into silicon from a solid phase
US3806382A (en) * 1972-04-06 1974-04-23 Ibm Vapor-solid impurity diffusion process
JPS5341035B2 (sv) * 1972-05-02 1978-10-31
IT993637B (it) * 1972-10-16 1975-09-30 Rca Corp Metodo per la fabbricazione di dispositivi semiconduttori del tipo a doppia giunzione
GB1503017A (en) * 1974-02-28 1978-03-08 Tokyo Shibaura Electric Co Method of manufacturing semiconductor devices

Also Published As

Publication number Publication date
NL7604986A (nl) 1977-11-15
CH615781A5 (sv) 1980-02-15
US4139402A (en) 1979-02-13
AU508451B2 (en) 1980-03-20
SE429175B (sv) 1983-08-15
JPS52137276A (en) 1977-11-16
FR2351501A1 (fr) 1977-12-09
DE2718894C2 (de) 1983-04-14
CA1086868A (en) 1980-09-30
JPS5850015B2 (ja) 1983-11-08
IT1085067B (it) 1985-05-28
DE2718894A1 (de) 1977-11-24
GB1523246A (en) 1978-08-31
FR2351501B1 (sv) 1982-11-19
AU2498977A (en) 1978-11-16

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