SE409160B - Sammansatt folie innehallande ett elektroutfellt kopparskikt av en tjocklek, som ej er sjelvberande samt sett att framstella densamma - Google Patents
Sammansatt folie innehallande ett elektroutfellt kopparskikt av en tjocklek, som ej er sjelvberande samt sett att framstella densammaInfo
- Publication number
- SE409160B SE409160B SE7403540A SE7403540A SE409160B SE 409160 B SE409160 B SE 409160B SE 7403540 A SE7403540 A SE 7403540A SE 7403540 A SE7403540 A SE 7403540A SE 409160 B SE409160 B SE 409160B
- Authority
- SE
- Sweden
- Prior art keywords
- self
- produced
- thickness
- carried
- copper layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/917—Treatment of workpiece between coating steps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12472—Microscopic interfacial wave or roughness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12583—Component contains compound of adjacent metal
- Y10T428/1259—Oxide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12701—Pb-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12778—Alternative base metals from diverse categories
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
- Y10T428/12826—Group VIB metal-base component
- Y10T428/12847—Cr-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrochemical Coating By Surface Reaction (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/421,236 US3998601A (en) | 1973-12-03 | 1973-12-03 | Thin foil |
Publications (2)
Publication Number | Publication Date |
---|---|
SE7403540L SE7403540L (sv) | 1975-06-04 |
SE409160B true SE409160B (sv) | 1979-07-30 |
Family
ID=23669727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7403540A SE409160B (sv) | 1973-12-03 | 1974-03-15 | Sammansatt folie innehallande ett elektroutfellt kopparskikt av en tjocklek, som ej er sjelvberande samt sett att framstella densamma |
Country Status (11)
Country | Link |
---|---|
US (1) | US3998601A (sv) |
JP (1) | JPS5318329B2 (sv) |
BE (1) | BE822888A (sv) |
DE (1) | DE2413669C3 (sv) |
FI (1) | FI61425C (sv) |
FR (1) | FR2252920B1 (sv) |
GB (1) | GB1458259A (sv) |
IT (1) | IT1004471B (sv) |
LU (1) | LU71409A1 (sv) |
NL (1) | NL155892B (sv) |
SE (1) | SE409160B (sv) |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4073699A (en) * | 1976-03-01 | 1978-02-14 | Hutkin Irving J | Method for making copper foil |
US4088544A (en) * | 1976-04-19 | 1978-05-09 | Hutkin Irving J | Composite and method for making thin copper foil |
FR2361224A1 (fr) * | 1976-08-11 | 1978-03-10 | Uop Inc | Produit stratifie a placage metallique et son procede de fabrication |
US4169018A (en) * | 1978-01-16 | 1979-09-25 | Gould Inc. | Process for electroforming copper foil |
US4323632A (en) * | 1978-10-17 | 1982-04-06 | Gould Inc. | Metal composites and laminates formed therefrom |
US4234395A (en) * | 1978-10-17 | 1980-11-18 | Gould Inc. | Metal composites and laminates formed therefrom |
US4386139A (en) * | 1980-10-31 | 1983-05-31 | Furukawa Circuit Foil Co., Ltd. | Copper foil for a printed circuit and a method for the production thereof |
US4387137A (en) * | 1980-12-01 | 1983-06-07 | The Mica Corporation | Capacitor material |
US4305795A (en) * | 1981-01-08 | 1981-12-15 | Rca Corporation | Method for the manufacture of stampers |
US4394419A (en) * | 1981-06-12 | 1983-07-19 | Oak Industries Inc. | Printed circuit material |
JPS6020919B2 (ja) * | 1981-09-18 | 1985-05-24 | 住友電気工業株式会社 | 印刷配線板の製造方法 |
US4431685A (en) * | 1982-07-02 | 1984-02-14 | International Business Machines Corporation | Decreasing plated metal defects |
US4462873A (en) * | 1982-07-16 | 1984-07-31 | Eiji Watanabe | Method of fixedly arranging an array of electroformed letters or the like on an article |
US4487662A (en) * | 1982-09-20 | 1984-12-11 | Xerox Corporation | Electrodeposition method for check valve |
GB8333753D0 (en) * | 1983-12-19 | 1984-01-25 | Thorpe J E | Dielectric boards |
EP0208177A3 (en) * | 1985-07-05 | 1988-09-14 | Yates Industries, Inc. | Ultrathin copper foil and process for producing such foil |
US4846918A (en) * | 1988-02-24 | 1989-07-11 | Psi Star | Copper etching process and product with controlled nitrous acid reaction |
US4927700A (en) * | 1988-02-24 | 1990-05-22 | Psi Star | Copper etching process and product with controlled nitrous acid reaction |
US5127146A (en) * | 1988-12-14 | 1992-07-07 | Sulzer Brothers, Ltd. | Method for production of thin sections of reactive metals |
US5121535A (en) * | 1988-12-14 | 1992-06-16 | Sulzer Bros. Ltd. | Method for production of thin sections of reactive metals |
NL9000310A (nl) * | 1989-02-27 | 1990-09-17 | Omi Int Corp | Mengsel en werkwijze voor omzetting. |
JPH0818401B2 (ja) * | 1989-05-17 | 1996-02-28 | 福田金属箔粉工業株式会社 | 複合箔とその製法 |
US5096522A (en) * | 1989-06-23 | 1992-03-17 | Meiko Electronics Co., Ltd. | Process for producing copper-clad laminate |
DE4116045A1 (de) * | 1991-05-16 | 1992-11-19 | Chen Ron Hon | Entwicklungsverfahren mit indikationseffekt |
US5403672A (en) * | 1992-08-17 | 1995-04-04 | Hitachi Chemical Co., Ltd. | Metal foil for printed wiring board and production thereof |
US5322975A (en) * | 1992-09-18 | 1994-06-21 | Gould Electronics Inc. | Universal carrier supported thin copper line |
IT1264791B1 (it) * | 1993-05-31 | 1996-10-10 | Rotoincisa Srl | Matrici sfilabili,per i cilindri delle macchine per la stampa a rotocalco, riciclabili |
US5527998A (en) * | 1993-10-22 | 1996-06-18 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
US5447619A (en) * | 1993-11-24 | 1995-09-05 | Circuit Foil Usa, Inc. | Copper foil for the manufacture of printed circuit boards and method of producing the same |
TW289900B (sv) * | 1994-04-22 | 1996-11-01 | Gould Electronics Inc | |
US6117300A (en) * | 1996-05-01 | 2000-09-12 | Honeywell International Inc. | Method for forming conductive traces and printed circuits made thereby |
US6270889B1 (en) * | 1998-01-19 | 2001-08-07 | Mitsui Mining & Smelting Co., Ltd. | Making and using an ultra-thin copper foil |
US6319620B1 (en) | 1998-01-19 | 2001-11-20 | Mitsui Mining & Smelting Co., Ltd. | Making and using an ultra-thin copper foil |
JP3612594B2 (ja) * | 1998-05-29 | 2005-01-19 | 三井金属鉱業株式会社 | 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法 |
US5903813A (en) * | 1998-07-24 | 1999-05-11 | Advanced Materials Products, Inc. | Method of forming thin dense metal sections from reactive alloy powders |
US6183880B1 (en) | 1998-08-07 | 2001-02-06 | Mitsui Mining & Smelting Co., Ltd. | Composite foil of aluminum and copper |
EP0996318B1 (en) * | 1998-10-19 | 2006-04-19 | Mitsui Mining & Smelting Co., Ltd. | Novel composite foil, process for producing the same and copper-clad laminate |
SG101924A1 (en) * | 1998-10-19 | 2004-02-27 | Mitsui Mining & Smelting Co | Composite material used in making printed wiring boards |
US6120693A (en) * | 1998-11-06 | 2000-09-19 | Alliedsignal Inc. | Method of manufacturing an interlayer via and a laminate precursor useful for same |
US6355322B1 (en) | 1998-12-08 | 2002-03-12 | 3M Innovative Properties Company | Release liner incorporating a metal layer |
CA2360994A1 (en) * | 1999-01-21 | 2000-07-27 | Ga-Tek Inc. | Process for recovering copper from a high acid mixed metal solution |
LU90376B1 (en) * | 1999-03-23 | 2000-09-25 | Circuit Foil Luxembourg Trading Sarl | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
IL145153A (en) * | 1999-03-23 | 2005-05-17 | Circuit Foil Luxembourg Trading Sarl | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
US6372113B2 (en) | 1999-09-13 | 2002-04-16 | Yates Foil Usa, Inc. | Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same |
LU90532B1 (en) * | 2000-02-24 | 2001-08-27 | Circuit Foil Luxembourg Trading Sarl | Comosite copper foil and manufacturing method thereof |
MY120403A (en) * | 2000-03-10 | 2005-10-31 | Gbc Metals Llc | Copper foil composite including a release layer |
US6569543B2 (en) | 2001-02-15 | 2003-05-27 | Olin Corporation | Copper foil with low profile bond enahncement |
US6346335B1 (en) | 2000-03-10 | 2002-02-12 | Olin Corporation | Copper foil composite including a release layer |
JP3743702B2 (ja) * | 2000-04-28 | 2006-02-08 | 三井金属鉱業株式会社 | プリント配線板のセミアディティブ製造法 |
US6660406B2 (en) * | 2000-07-07 | 2003-12-09 | Mitsui Mining & Smelting Co., Ltd. | Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit |
US6447929B1 (en) | 2000-08-29 | 2002-09-10 | Gould Electronics Inc. | Thin copper on usable carrier and method of forming same |
US7026059B2 (en) * | 2000-09-22 | 2006-04-11 | Circuit Foil Japan Co., Ltd. | Copper foil for high-density ultrafine printed wiring boad |
US6893742B2 (en) | 2001-02-15 | 2005-05-17 | Olin Corporation | Copper foil with low profile bond enhancement |
JP4672907B2 (ja) * | 2001-06-04 | 2011-04-20 | Jx日鉱日石金属株式会社 | 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板 |
US6763575B2 (en) * | 2001-06-11 | 2004-07-20 | Oak-Mitsui Inc. | Printed circuit boards having integrated inductor cores |
US6770976B2 (en) | 2002-02-13 | 2004-08-03 | Nikko Materials Usa, Inc. | Process for manufacturing copper foil on a metal carrier substrate |
ES2203324B1 (es) * | 2002-05-23 | 2005-02-16 | Antonio Rodriguez Siurana | Lamina de cobre, material laminar compuesto que comprende dicha lamina de cobre y procedimiento para su obtencion. |
JP2003347149A (ja) * | 2002-05-23 | 2003-12-05 | Nitto Denko Corp | 金属転写シート、金属転写シートの製造方法およびセラミックコンデンサの製造方法 |
CN100452342C (zh) * | 2002-07-31 | 2009-01-14 | 索尼株式会社 | 制造内置器件的基板的方法 |
JP3977790B2 (ja) * | 2003-09-01 | 2007-09-19 | 古河サーキットフォイル株式会社 | キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板 |
US7132158B2 (en) * | 2003-10-22 | 2006-11-07 | Olin Corporation | Support layer for thin copper foil |
JP2006068920A (ja) * | 2004-08-31 | 2006-03-16 | Shin Etsu Chem Co Ltd | フレキシブル銅箔ポリイミド積層板の製造方法 |
US20060108336A1 (en) * | 2004-11-23 | 2006-05-25 | Northrop Grumman Corporation | Fabrication process for large-scale panel devices |
US20070098910A1 (en) * | 2005-10-14 | 2007-05-03 | Mitsui Mining & Smelting Co., Ltd. | Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape |
TW200804626A (en) * | 2006-05-19 | 2008-01-16 | Mitsui Mining & Smelting Co | Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she |
JP4890546B2 (ja) * | 2006-06-12 | 2012-03-07 | Jx日鉱日石金属株式会社 | 粗化処理面を備えた圧延銅又は銅合金箔及び圧延銅又は銅合金箔の粗化方法 |
DE102008022722B4 (de) * | 2008-05-06 | 2010-02-11 | Siemens Aktiengesellschaft | Verfahren zum elektrochemischen Erzeugen eines Metallbandes |
JP2009143233A (ja) * | 2008-12-24 | 2009-07-02 | Nippon Mining & Metals Co Ltd | キャリア付金属箔 |
CN102452197B (zh) | 2010-10-21 | 2014-08-20 | 财团法人工业技术研究院 | 附载箔铜箔及其制造方法 |
US8329315B2 (en) * | 2011-01-31 | 2012-12-11 | Nan Ya Plastics Corporation | Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing method |
US8828245B2 (en) | 2011-03-22 | 2014-09-09 | Industrial Technology Research Institute | Fabricating method of flexible circuit board |
US10057984B1 (en) * | 2017-02-02 | 2018-08-21 | Chang Chun Petrochemical Co., Ltd. | Composite thin copper foil and carrier |
JP7085419B2 (ja) * | 2018-03-14 | 2022-06-16 | 東洋鋼鈑株式会社 | 圧延接合体及びその製造方法 |
LU503243B1 (en) | 2022-12-22 | 2024-06-25 | Circuit Foil Luxembourg | Method for producing a composite copper foil and composite copper foil obtained therewith |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US454381A (en) * | 1891-06-16 | Alexander gael seinfeld | ||
US510013A (en) * | 1893-12-05 | Carl endbuweit | ||
US2433441A (en) * | 1947-12-30 | Electrolytic production of thin | ||
US2105440A (en) * | 1938-01-11 | Manufacture of metal coated paper | ||
US676357A (en) * | 1897-12-31 | 1901-06-11 | Carl Endruweit | Process of making metal paper in endless strips. |
US880484A (en) * | 1904-06-29 | 1908-02-25 | Edison Storage Battery Co | Process of producing very thin sheet metal. |
GB117872A (en) * | 1917-11-08 | 1918-08-08 | Michael Alfred Bolton | Improvements in and relating to the Deposition of Metals by Electrolysis. |
US1574055A (en) * | 1920-05-15 | 1926-02-23 | Madsenell Corp | Fabrication of metal sheets by electrodeposition |
US1494152A (en) * | 1921-10-12 | 1924-05-13 | Cowper-Coles Sherard Osborn | Continuous automatic process for the production of metal sheets, wire, tubes, cylinders, and other articles |
GB230456A (sv) * | 1924-03-04 | 1926-06-03 | Carl Muller | |
US1589564A (en) * | 1924-06-27 | 1926-06-22 | Anaconda Sales Co | Process of electrodeposition |
US1760028A (en) * | 1924-12-01 | 1930-05-27 | Gen Motors Res Corp | Process of producing metal sheets by electrodeposition |
FR619284A (fr) * | 1926-07-14 | 1927-03-30 | Procédé et dispositif pour la production de dépôts métalliques lamellaires | |
GB275221A (en) | 1926-07-27 | 1928-01-12 | Edmund Breuning | Process for the production by electrolysis of thin superposed nickel sheets and for separating them one from another |
US1924410A (en) * | 1931-03-12 | 1933-08-29 | Chrysler Corp | Method and means for forming separable plated coatings on metal surfaces |
US2203253A (en) * | 1936-09-26 | 1940-06-04 | Western Electric Co | Electroplating process |
NL108173C (sv) * | 1954-06-25 | |||
GB853422A (en) | 1958-05-30 | 1960-11-09 | Angus George Co Ltd | Improvements in and relating to coating fluorocarbon materials with metal |
US3293109A (en) * | 1961-09-18 | 1966-12-20 | Clevite Corp | Conducting element having improved bonding characteristics and method |
US3324014A (en) * | 1962-12-03 | 1967-06-06 | United Carr Inc | Method for making flush metallic patterns |
FR1571857A (sv) | 1968-07-03 | 1969-06-20 | ||
US3617450A (en) * | 1968-08-07 | 1971-11-02 | Mitsubishi Metal Mining Co Ltd | Automatic stripping of electrodeposited starting sheets |
BE792930A (fr) * | 1971-05-26 | 1973-06-18 | Fortin Laminating Corp | Procede de production d'un stratifie revetu d'un clinquant metallique |
BE788117A (fr) * | 1971-08-30 | 1973-02-28 | Perstorp Ab | Procede de production d'elements pour circuits imprimes |
-
1973
- 1973-12-03 US US05/421,236 patent/US3998601A/en not_active Expired - Lifetime
-
1974
- 1974-03-15 SE SE7403540A patent/SE409160B/sv not_active IP Right Cessation
- 1974-03-19 GB GB1217574A patent/GB1458259A/en not_active Expired
- 1974-03-19 DE DE2413669A patent/DE2413669C3/de not_active Expired
- 1974-04-10 NL NL7404880.A patent/NL155892B/xx not_active IP Right Cessation
- 1974-04-16 IT IT50401/74A patent/IT1004471B/it active
- 1974-04-16 JP JP4184474A patent/JPS5318329B2/ja not_active Expired
- 1974-10-14 FI FI2978/74A patent/FI61425C/fi active
- 1974-11-12 FR FR7437294A patent/FR2252920B1/fr not_active Expired
- 1974-12-03 BE BE151101A patent/BE822888A/xx not_active IP Right Cessation
- 1974-12-03 LU LU71409A patent/LU71409A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
LU71409A1 (sv) | 1976-04-13 |
US3998601A (en) | 1976-12-21 |
JPS5086431A (sv) | 1975-07-11 |
FI297874A (sv) | 1975-06-04 |
IT1004471B (it) | 1976-07-10 |
GB1458259A (en) | 1976-12-15 |
NL155892B (nl) | 1978-02-15 |
SE7403540L (sv) | 1975-06-04 |
DE2413669C3 (de) | 1981-02-12 |
FI61425C (fi) | 1982-08-10 |
FR2252920A1 (sv) | 1975-06-27 |
JPS5318329B2 (sv) | 1978-06-14 |
DE2413669B2 (de) | 1980-05-14 |
NL7404880A (nl) | 1975-06-05 |
DE2413669A1 (de) | 1975-06-12 |
BE822888A (fr) | 1975-06-03 |
FR2252920B1 (sv) | 1980-05-30 |
FI61425B (fi) | 1982-04-30 |
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