PT95672A - Processo para a preparacao de composicoes ceramicas - Google Patents
Processo para a preparacao de composicoes ceramicasInfo
- Publication number
- PT95672A PT95672A PT95672A PT9567290A PT95672A PT 95672 A PT95672 A PT 95672A PT 95672 A PT95672 A PT 95672A PT 9567290 A PT9567290 A PT 9567290A PT 95672 A PT95672 A PT 95672A
- Authority
- PT
- Portugal
- Prior art keywords
- preparation
- ceramic compositions
- ceramic
- compositions
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
- H01B3/085—Particles bound with glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/04—Particles; Flakes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Glass Compositions (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3935471A DE3935471A1 (de) | 1989-10-25 | 1989-10-25 | Keramische stoffzusammensetzung und ihre verwendung |
Publications (2)
Publication Number | Publication Date |
---|---|
PT95672A true PT95672A (pt) | 1991-09-13 |
PT95672B PT95672B (pt) | 1997-12-31 |
Family
ID=6392142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PT95672A PT95672B (pt) | 1989-10-25 | 1990-10-24 | Processo para a preparacao de composicoes ceramicas e de produtos ceramicos a partir das mesmas |
Country Status (6)
Country | Link |
---|---|
US (1) | US5145540A (pt) |
EP (1) | EP0428880B1 (pt) |
JP (1) | JPH03150236A (pt) |
DE (2) | DE3935471A1 (pt) |
IE (1) | IE64626B1 (pt) |
PT (1) | PT95672B (pt) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5411563A (en) * | 1993-06-25 | 1995-05-02 | Industrial Technology Research Institute | Strengthening of multilayer ceramic/glass articles |
US5514451A (en) * | 1995-01-27 | 1996-05-07 | David Sarnoff Research Center, Inc. | Conductive via fill inks for ceramic multilayer circuit boards on support substrates |
GB2310314A (en) * | 1996-02-14 | 1997-08-20 | Gec Alsthom Ltd | Glass or glass ceramic substrates |
US6228468B1 (en) * | 1996-07-26 | 2001-05-08 | Paul L. Hickman | High density ceramic BGA package and method for making same |
US6033787A (en) * | 1996-08-22 | 2000-03-07 | Mitsubishi Materials Corporation | Ceramic circuit board with heat sink |
JP3513787B2 (ja) * | 1996-11-18 | 2004-03-31 | 株式会社村田製作所 | Lc複合部品 |
TW396350B (en) * | 1996-12-04 | 2000-07-01 | Nat Science Council | Dielectric composition, slurry for use in the tape casting process, porcess for producing a ceramic product and process for preparing multilayer ceramic package |
JP3419291B2 (ja) * | 1997-03-04 | 2003-06-23 | 株式会社村田製作所 | 低温焼結磁器組成物及びそれを用いた多層セラミック基板 |
US5866240A (en) * | 1997-03-06 | 1999-02-02 | Sarnoff Corporation | Thick ceramic on metal multilayer circuit board |
US7794557B2 (en) * | 2004-06-15 | 2010-09-14 | Inframat Corporation | Tape casting method and tape cast materials |
US7947214B1 (en) * | 2004-11-06 | 2011-05-24 | Rapp Jame E | Process and product for making ceramic materials for semiconductor doping |
US7288497B1 (en) * | 2006-06-30 | 2007-10-30 | San-Tsai Chueh | Ceramic powder |
US8143180B2 (en) * | 2007-11-30 | 2012-03-27 | Corning Incorporated | Honeycomb cement with ceramic-forming crystallizable glass and method therefor |
EP3247184A4 (en) * | 2015-01-13 | 2018-08-29 | NGK Spark Plug Co., Ltd. | Ceramic substrate and production method therefor |
JP6873393B2 (ja) * | 2016-12-01 | 2021-05-19 | 日本電気硝子株式会社 | 封着材料ペースト |
WO2021019654A1 (ja) * | 2019-07-29 | 2021-02-04 | Agc株式会社 | 支持ガラス基板 |
US11731907B2 (en) | 2020-08-04 | 2023-08-22 | Applied Materials, Inc. | Ceramic material with high thermal shock resistance and high erosion resistance |
CN114835402B (zh) * | 2022-04-19 | 2023-11-21 | 山东国瓷功能材料股份有限公司 | 一种半透光性良好、机械性能优异的玻璃陶瓷结构体的制备方法及应用 |
DE102022205759A1 (de) | 2022-06-07 | 2023-12-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Verfahren zur Herstellung von Elementen für elektrische Arbeitsmaschinen, die mit übereinander angeordneten Schichten aus Eisen oder einer Eisenlegierung mit weichmagnetischen Eigenschaften gebildet sind sowie ein damit hergestelltes Element |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4429007A (en) * | 1981-10-21 | 1984-01-31 | The United States Of America As Represented By The United States Department Of Energy | Electrical wire insulation and electromagnetic coil |
JPS61278195A (ja) * | 1985-06-03 | 1986-12-09 | 株式会社日立製作所 | 多層回路基板及びその製造方法 |
JPS62176943A (ja) * | 1986-01-27 | 1987-08-03 | Mitsubishi Electric Corp | 気密性耐熱板の製造方法 |
JPS63107095A (ja) * | 1986-10-23 | 1988-05-12 | 富士通株式会社 | 多層セラミツク回路基板 |
US4849379A (en) * | 1988-01-28 | 1989-07-18 | E. I. Du Pont De Nemours And Company | Dielectric composition |
US4849380A (en) * | 1988-01-28 | 1989-07-18 | E. I. Du Pont De Nemours And Company | Dielectric composition |
US4961998A (en) * | 1988-09-23 | 1990-10-09 | National Starch And Chemical Investment Holding Corporation | Dielectric composition having controlled thermal expansion |
US5024975A (en) * | 1989-10-19 | 1991-06-18 | E. I. Du Pont De Nemours And Co., Inc. | Crystallizable, low dielectric constant, low dielectric loss composition |
-
1989
- 1989-10-25 DE DE3935471A patent/DE3935471A1/de not_active Withdrawn
-
1990
- 1990-10-23 US US07/601,861 patent/US5145540A/en not_active Expired - Fee Related
- 1990-10-23 DE DE90120266T patent/DE59003691D1/de not_active Expired - Fee Related
- 1990-10-23 EP EP90120266A patent/EP0428880B1/de not_active Expired - Lifetime
- 1990-10-24 IE IE382390A patent/IE64626B1/en not_active IP Right Cessation
- 1990-10-24 JP JP2286907A patent/JPH03150236A/ja active Pending
- 1990-10-24 PT PT95672A patent/PT95672B/pt not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE59003691D1 (de) | 1994-01-13 |
IE903823A1 (en) | 1991-05-08 |
US5145540A (en) | 1992-09-08 |
EP0428880B1 (de) | 1993-12-01 |
JPH03150236A (ja) | 1991-06-26 |
DE3935471A1 (de) | 1991-05-02 |
EP0428880A1 (de) | 1991-05-29 |
PT95672B (pt) | 1997-12-31 |
IE64626B1 (en) | 1995-08-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BB1A | Laying open of patent application |
Effective date: 19910401 |
|
FG3A | Patent granted, date of granting |
Effective date: 19971008 |
|
MM3A | Annulment or lapse |
Free format text: LAPSE DUE TO NON-PAYMENT OF FEES Effective date: 20000430 |