PT3553129T - Composição de resina curável, produto curado obtido a partir dela, método de cura da mesma e dispositivo semicondutor - Google Patents

Composição de resina curável, produto curado obtido a partir dela, método de cura da mesma e dispositivo semicondutor

Info

Publication number
PT3553129T
PT3553129T PT178794103T PT17879410T PT3553129T PT 3553129 T PT3553129 T PT 3553129T PT 178794103 T PT178794103 T PT 178794103T PT 17879410 T PT17879410 T PT 17879410T PT 3553129 T PT3553129 T PT 3553129T
Authority
PT
Portugal
Prior art keywords
resin composition
curing
curing resin
semiconductor device
cured product
Prior art date
Application number
PT178794103T
Other languages
English (en)
Original Assignee
Eneos Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eneos Corp filed Critical Eneos Corp
Publication of PT3553129T publication Critical patent/PT3553129T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/06—Polyhydrazides; Polytriazoles; Polyamino-triazoles; Polyoxadiazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C08G59/623—Aminophenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/50—Phosphorus bound to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PT178794103T 2016-12-09 2017-12-08 Composição de resina curável, produto curado obtido a partir dela, método de cura da mesma e dispositivo semicondutor PT3553129T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016239894 2016-12-09

Publications (1)

Publication Number Publication Date
PT3553129T true PT3553129T (pt) 2024-01-23

Family

ID=62491907

Family Applications (1)

Application Number Title Priority Date Filing Date
PT178794103T PT3553129T (pt) 2016-12-09 2017-12-08 Composição de resina curável, produto curado obtido a partir dela, método de cura da mesma e dispositivo semicondutor

Country Status (8)

Country Link
US (1) US20200095422A1 (pt)
EP (1) EP3553129B1 (pt)
JP (1) JP6849698B2 (pt)
KR (1) KR102215814B1 (pt)
CN (1) CN110291150B (pt)
PT (1) PT3553129T (pt)
TW (1) TWI742211B (pt)
WO (1) WO2018105743A1 (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3450499B1 (en) * 2016-04-28 2023-11-01 ENEOS Corporation Composition for curable resin, and cured product thereof
JP6946088B2 (ja) * 2017-07-14 2021-10-06 Ｅｎｅｏｓ株式会社 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置
EP3702390B1 (en) * 2017-10-27 2023-12-27 ENEOS Corporation Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
US11584824B2 (en) 2017-10-27 2023-02-21 Eneos Corporation Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
EP3702388B1 (en) * 2017-10-27 2024-06-12 ENEOS Corporation Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
CN112424256B (zh) * 2018-08-03 2023-02-17 引能仕株式会社 固化树脂用组合物、该组合物的固化物、该组合物及该固化物的制造方法、以及半导体装置
CN109161194A (zh) * 2018-08-17 2019-01-08 巢湖市翔宇渔具有限公司 一种钓竿用高强韧性复合材料
US20220106437A1 (en) * 2018-12-10 2022-04-07 Eneos Corporation Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
JP7384559B2 (ja) * 2019-01-31 2023-11-21 京セラ株式会社 高周波用封止材樹脂組成物および半導体装置
US20220195188A1 (en) * 2019-04-26 2022-06-23 Eneos Corporation Composition for curable resins, cured product of said composition, production method for said composition and said cured product, and semiconductor device
JP2021155372A (ja) * 2020-03-27 2021-10-07 Ｅｎｅｏｓ株式会社 エポキシ化合物の立体異性体、これを含む硬化性組成物および硬化性組成物を硬化させた硬化物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1147741A (en) 1979-05-23 1983-06-07 George A. Doorakian Phosphonium phenoxide catalysts for promoting reaction of epoxides with phenols and/or carboxylic acids
JP2006233188A (ja) * 2005-01-31 2006-09-07 Toray Ind Inc 複合材料用プリプレグ、および複合材料
JP2006233288A (ja) * 2005-02-25 2006-09-07 Ntn Corp 転動溝付き機械部品およびその製造方法
TWI491596B (zh) * 2008-10-10 2015-07-11 Sumitomo Bakelite Co 脂環二環氧化物之製備技術
JP2012036318A (ja) 2010-08-10 2012-02-23 Gun Ei Chem Ind Co Ltd 熱硬化性樹脂
JP2013060407A (ja) 2011-09-15 2013-04-04 Sumitomo Chemical Co Ltd ベンゾオキサジン化合物およびその製造方法
WO2013046434A1 (ja) * 2011-09-30 2013-04-04 Ｊｘ日鉱日石エネルギー株式会社 ベンゾオキサジン樹脂組成物及び繊維強化複合材料
US9005761B2 (en) * 2011-12-22 2015-04-14 Elite Material Co., Ltd. Halogen-free resin composition and its application for copper clad laminate and printed circuit board
CN102633990A (zh) * 2012-04-05 2012-08-15 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板
JP2014148562A (ja) * 2013-01-31 2014-08-21 Nippon Zeon Co Ltd 硬化性樹脂組成物、フィルム、プリプレグ、及び硬化物
US9850375B2 (en) * 2013-08-23 2017-12-26 Elite Electronic Material (Kunshan) Co. Ltd. Resin composition, copper clad laminate and printed circuit board using same
CN104974520B (zh) * 2014-04-02 2017-11-03 广东生益科技股份有限公司 一种无卤树脂组合物及其用途
CN104371273B (zh) * 2014-11-11 2017-05-24 广东生益科技股份有限公司 一种无卤树脂组合物及用其制作的预浸料与层压板
CN105802128B (zh) * 2014-12-29 2018-05-04 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板
JP6460899B2 (ja) * 2015-04-24 2019-01-30 積水化学工業株式会社 半導体接合用接着剤

Also Published As

Publication number Publication date
JPWO2018105743A1 (ja) 2019-10-24
KR102215814B1 (ko) 2021-02-16
EP3553129A1 (en) 2019-10-16
EP3553129B1 (en) 2023-11-22
JP6849698B2 (ja) 2021-03-24
US20200095422A1 (en) 2020-03-26
TWI742211B (zh) 2021-10-11
TW201835140A (zh) 2018-10-01
CN110291150A (zh) 2019-09-27
KR20190084348A (ko) 2019-07-16
EP3553129A4 (en) 2020-05-06
CN110291150B (zh) 2022-06-07
WO2018105743A1 (ja) 2018-06-14

Similar Documents

Publication Publication Date Title
PT3553129T (pt) Composição de resina curável, produto curado obtido a partir dela, método de cura da mesma e dispositivo semicondutor
PT3339352T (pt) Resina, composição, película curada, método para o fabrico de película curada e dispositivo semicondutor
SG11201706733UA (en) Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device
SG11201707013RA (en) Radical-polymerizable resin composition, curing method thereof, method of producing same, use of radical-polymerizable resin composition, and use method of thereof
EP3165549A4 (en) Epoxy resin composition for electronic material, cured product thereof and electronic member
PT3492982T (pt) Composição de resina fotossensível, película curada, laminado, método para produzir película curada, método para produzir laminado, e dispositivo semicondutor
PT3702390T (pt) Composição para resina curada, produto curado da referida composição, método de produção para a referida composição e o referido produto curado, e dispositivo semicondutor
EP3321054A4 (en) Method and apparatus for manufacturing fiber-reinforced resin molding material
EP3153535A4 (en) Polyurethane-modified epoxy resin, method for producing same, epoxy resin composition and cured product
EP3162868A4 (en) Thermal base generator, thermosetting resin composition, cured film, cured film manufacturing method, and semiconductor device
PT3450499T (pt) Composição de resina curável e produto curado obtido a partir da mesma
EP3216810A4 (en) Photocurable resin composition, cured product of same and method for producing cured product
EP3061773A4 (en) Method and device for manufacturing cured light-curing resin composition
EP3248754A4 (en) Device and method for molding molded resin article
EP3702391A4 (en) COMPOSITION FOR HARDENABLE RESIN, HARDENED PRODUCT OF THIS COMPOSITION, MANUFACTURING METHOD FOR THIS COMPOSITION AND SAID HARDENED PRODUCT AND SEMICONDUCTIVE COMPONENT
EP3481899A4 (en) PLASTICIZED THERMOSETTING RESIN, ASSOCIATED HARDENED RESIN, HARDENING METHOD AND ARTICLE COMPRISING HARDENED RESIN
EP3395526A4 (en) Method for manufacturing fiber-reinforced resin molding material, and device for manufacturing fiber-reinforced resin molding material
EP3229266A4 (en) Resin molding device and resin molding method
SG11201708729TA (en) Resin composition, method for manufacturing semiconductor element using same, and semiconductor device
EP3260263A4 (en) Curing device for resin composite material, curing method, and molded resin article
SG11201704514XA (en) Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product and semiconductor sealing material
EP3345950A4 (en) FIBER REINFORCED PLASTIC RESIN COMPOSITION, HARDENED FIBER-REINFORCED PLASTIC PRODUCT CONTAINING THE SAME, AND METHOD FOR MANUFACTURING THE FIBER-REINFORCED PLASTIC
EP3263308A4 (en) Curing device for resin composite material, curing method, and molded resin article
EP3118237A4 (en) Method for curing resin composition
SG11201703288UA (en) Resin composition, semiconductor device manufacturing method and semiconductor device