PT2829637T - Material metálico para componente eletrónico, terminal conector obtido utilizando o mesmo, conector e componente eletrónico - Google Patents
Material metálico para componente eletrónico, terminal conector obtido utilizando o mesmo, conector e componente eletrónicoInfo
- Publication number
- PT2829637T PT2829637T PT137639597T PT13763959T PT2829637T PT 2829637 T PT2829637 T PT 2829637T PT 137639597 T PT137639597 T PT 137639597T PT 13763959 T PT13763959 T PT 13763959T PT 2829637 T PT2829637 T PT 2829637T
- Authority
- PT
- Portugal
- Prior art keywords
- electronic component
- connector
- same
- metallic material
- terminal obtained
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/60—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12681—Ga-, In-, Tl- or Group VA metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12722—Next to Group VIII metal-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electroplating Methods And Accessories (AREA)
- Non-Insulated Conductors (AREA)
- Contacts (AREA)
- Physical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012068148 | 2012-03-23 | ||
JP2012112634A JP5138827B1 (ja) | 2012-03-23 | 2012-05-16 | 電子部品用金属材料、それを用いたコネクタ端子、コネクタ及び電子部品 |
Publications (1)
Publication Number | Publication Date |
---|---|
PT2829637T true PT2829637T (pt) | 2017-12-15 |
Family
ID=47789827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PT137639597T PT2829637T (pt) | 2012-03-23 | 2013-01-25 | Material metálico para componente eletrónico, terminal conector obtido utilizando o mesmo, conector e componente eletrónico |
Country Status (10)
Country | Link |
---|---|
US (1) | US9330804B2 (pt) |
EP (1) | EP2829637B1 (pt) |
JP (1) | JP5138827B1 (pt) |
KR (1) | KR101678289B1 (pt) |
CN (1) | CN104246015B (pt) |
CA (1) | CA2879453C (pt) |
ES (1) | ES2652260T3 (pt) |
PT (1) | PT2829637T (pt) |
TW (1) | TWI432316B (pt) |
WO (1) | WO2013140850A1 (pt) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6488070B2 (ja) * | 2013-11-11 | 2019-03-20 | 株式会社オートネットワーク技術研究所 | 端子金具 |
JP6172811B2 (ja) * | 2014-03-24 | 2017-08-02 | Jx金属株式会社 | Ag−Sn合金めっき液及び電子部品の製造方法 |
JP6420567B2 (ja) * | 2014-05-19 | 2018-11-07 | 矢崎総業株式会社 | 端子および端子の製造方法 |
JP6451385B2 (ja) * | 2014-10-30 | 2019-01-16 | 株式会社オートネットワーク技術研究所 | 端子金具及びコネクタ |
JP6441040B2 (ja) * | 2014-11-19 | 2018-12-19 | Jx金属株式会社 | 電子部品用金属材料及びその製造方法 |
JP6430863B2 (ja) * | 2015-03-13 | 2018-11-28 | トヨタ自動車株式会社 | 接合体 |
JP6532323B2 (ja) * | 2015-07-03 | 2019-06-19 | Dowaメタルテック株式会社 | 銀めっき材およびその製造方法 |
EP3382814A4 (en) * | 2015-11-27 | 2019-09-04 | Mitsubishi Materials Corporation | PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND TERMINAL PART STRUCTURE OF ELECTRIC WIRE |
JP6226037B2 (ja) * | 2015-12-15 | 2017-11-08 | 三菱マテリアル株式会社 | 錫めっき付き銅端子材の製造方法 |
US10998657B2 (en) | 2016-03-18 | 2021-05-04 | Apple Inc. | Precious-metal-alloy contacts |
DE202017001425U1 (de) | 2016-03-18 | 2017-07-06 | Apple Inc. | Kontakte aus Edelmetallegierungen |
JP6423383B2 (ja) * | 2016-03-31 | 2018-11-14 | 日新製鋼株式会社 | 接続部品用材料 |
JP6624999B2 (ja) * | 2016-03-31 | 2019-12-25 | 日鉄日新製鋼株式会社 | 自動車用端子 |
WO2018008168A1 (ja) * | 2016-07-04 | 2018-01-11 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
JP2017082337A (ja) * | 2016-12-22 | 2017-05-18 | 株式会社オートネットワーク技術研究所 | 端子金具 |
JP2018120698A (ja) * | 2017-01-24 | 2018-08-02 | 矢崎総業株式会社 | 端子用めっき材並びにそれを用いた端子、端子付き電線及びワイヤーハーネス |
EP3575446B1 (en) * | 2017-01-30 | 2023-06-07 | JX Nippon Mining & Metals Corporation | Surface-treated plated material, connector terminal, connector, ffc terminal, ffc, fpc and electronic component |
US20190103693A1 (en) * | 2017-09-29 | 2019-04-04 | Apple Inc. | Electrical contacts having sacrificial layer for corrosion protection |
JP6653340B2 (ja) * | 2018-02-01 | 2020-02-26 | Jx金属株式会社 | バーンインテストソケット用表面処理金属材料、それを用いたバーンインテストソケット用コネクタ及びバーンインテストソケット |
JP7155677B2 (ja) * | 2018-07-05 | 2022-10-19 | 住友金属鉱山株式会社 | はんだ接合電極およびはんだ接合電極の被膜形成用錫合金ターゲット |
JP7033034B2 (ja) * | 2018-08-23 | 2022-03-09 | 株式会社日立製作所 | 腐食環境モニタリング方法および腐食環境モニタリングシステム |
EP3842596A4 (en) * | 2018-09-27 | 2022-01-19 | Toto Ltd. | WATER TAP |
JP7151499B2 (ja) * | 2019-01-18 | 2022-10-12 | 株式会社オートネットワーク技術研究所 | 金属材および接続端子 |
JP2020187971A (ja) * | 2019-05-16 | 2020-11-19 | 株式会社オートネットワーク技術研究所 | コネクタ端子、端子付き電線、及び端子対 |
CN111549256B (zh) * | 2020-06-24 | 2021-06-01 | 浙江省冶金研究院有限公司 | 一种提高锡基巴氏合金性能的方法 |
JP7155312B2 (ja) * | 2021-02-22 | 2022-10-18 | Jx金属株式会社 | 電子部品用めっき材料及び電子部品 |
CN113571934A (zh) * | 2021-08-17 | 2021-10-29 | 长春捷翼汽车零部件有限公司 | 插接端子、插接结构及机动车辆 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2726434B2 (ja) * | 1988-06-06 | 1998-03-11 | 古河電気工業株式会社 | SnまたはSn合金被覆材料 |
JP2959872B2 (ja) * | 1991-06-18 | 1999-10-06 | 古河電気工業株式会社 | 電気接点材料とその製造方法 |
JP2925986B2 (ja) | 1995-09-08 | 1999-07-28 | 古河電気工業株式会社 | 接点部と端子部とからなる固定接点用材料又は電気接点部品 |
JPH11279792A (ja) * | 1998-03-27 | 1999-10-12 | Nippon Mining & Metals Co Ltd | 錫−銀はんだ合金めっき層の形成方法 |
JPH11350189A (ja) * | 1998-06-03 | 1999-12-21 | Furukawa Electric Co Ltd:The | 電気・電子部品用材料とその製造方法、その材料を用いた電気・電子部品 |
JP2001053210A (ja) * | 1999-08-11 | 2001-02-23 | Nec Corp | リードフレーム、その外装めっきの製造方法、及び、半導体装置の製造方法 |
JP4112426B2 (ja) * | 2003-05-14 | 2008-07-02 | 三菱伸銅株式会社 | めっき処理材の製造方法 |
US7391116B2 (en) * | 2003-10-14 | 2008-06-24 | Gbc Metals, Llc | Fretting and whisker resistant coating system and method |
JP5401714B2 (ja) | 2007-12-27 | 2014-01-29 | 石原ケミカル株式会社 | 無電解メッキによるスズホイスカーの防止方法 |
JP4873332B2 (ja) * | 2009-05-18 | 2012-02-08 | 協和電線株式会社 | リードフレーム及びこの製造方法、この疲労特性の向上方法、これを用いた電子部品及び電子デバイス |
JP2012036436A (ja) * | 2010-08-05 | 2012-02-23 | Mitsubishi Materials Corp | Sn合金めっき付き導電材及びその製造方法 |
JP6050664B2 (ja) | 2012-06-27 | 2016-12-21 | Jx金属株式会社 | 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品 |
-
2012
- 2012-05-16 JP JP2012112634A patent/JP5138827B1/ja not_active Expired - Fee Related
-
2013
- 2013-01-25 CA CA2879453A patent/CA2879453C/en active Active
- 2013-01-25 PT PT137639597T patent/PT2829637T/pt unknown
- 2013-01-25 KR KR1020147029427A patent/KR101678289B1/ko active IP Right Grant
- 2013-01-25 US US14/387,115 patent/US9330804B2/en active Active
- 2013-01-25 CN CN201380015553.8A patent/CN104246015B/zh active Active
- 2013-01-25 EP EP13763959.7A patent/EP2829637B1/en active Active
- 2013-01-25 WO PCT/JP2013/051633 patent/WO2013140850A1/ja active Application Filing
- 2013-01-25 ES ES13763959.7T patent/ES2652260T3/es active Active
- 2013-02-04 TW TW102104123A patent/TWI432316B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN104246015A (zh) | 2014-12-24 |
TW201338967A (zh) | 2013-10-01 |
EP2829637A4 (en) | 2015-12-09 |
JP2013224479A (ja) | 2013-10-31 |
US20150047879A1 (en) | 2015-02-19 |
JP5138827B1 (ja) | 2013-02-06 |
CN104246015B (zh) | 2016-03-23 |
WO2013140850A1 (ja) | 2013-09-26 |
ES2652260T3 (es) | 2018-02-01 |
TWI432316B (zh) | 2014-04-01 |
CA2879453A1 (en) | 2013-09-26 |
US9330804B2 (en) | 2016-05-03 |
CA2879453C (en) | 2017-07-18 |
KR101678289B1 (ko) | 2016-11-21 |
EP2829637A1 (en) | 2015-01-28 |
EP2829637B1 (en) | 2017-09-20 |
KR20140139021A (ko) | 2014-12-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2829637A4 (en) | METAL MATERIAL FOR ELECTRONIC COMPONENT, CONNECTING TERMINAL, CONNECTOR AND ELECTRONIC COMPONENT THEREWITH | |
EP2868773A4 (en) | ELECTRONIC COMPONENT METALLIC MATERIAL AND MANUFACTURING METHOD THEREOF, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT USING SAID METALLIC ELECTRONIC COMPONENT MATERIAL | |
EP2868776A4 (en) | ELECTRONIC COMPONENT METALLIC MATERIAL AND MANUFACTURING METHOD THEREOF, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT USING SAID METALLIC ELECTRONIC COMPONENT MATERIAL | |
HK1219927A1 (zh) | 金屬銅分散液、其製備方法及其用途 | |
ZA201405608B (en) | Mobile terminals and methods for generating electronic documents for the same | |
EP2811051A4 (en) | IMPRESSION CONTACT AND ELECTRONIC COMPONENT THEREFOR | |
EP2878704A4 (en) | METALLIC MATERIAL FOR ELECTRONIC COMPONENTS, METHOD FOR PRODUCING THE SAME, CONNECTOR TERMINAL USING THE SAME, CONNECTOR, AND ELECTRONIC COMPONENT | |
GB2503093B (en) | Crimp terminal | |
EP2843523A4 (en) | METHOD FOR TRANSMITTING FILE AND TERMINAL | |
EP2830295A4 (en) | METHOD AND DEVICE FOR ADJUSTING SCREEN LATCH TIME, AND ELECTRONIC TERMINAL THEREOF | |
EP2594997A4 (en) | CONDUCTIVE ELEMENT FOR ELECTRONIC PHOTOGRAPHY, PROCESS CARTRIDGE AND DEVICE FOR ELECTRONIC PHOTOGRAPHY | |
EP2840471A4 (en) | METHOD, DEVICE AND ELECTRONIC DEVICE FOR UNLOCKING | |
EP2868772A4 (en) | METAL MATERIAL FOR AN ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THEREOF AND CONNECTING END, CONNECTOR AND ELECTRONIC COMPONENT WITH THE METAL MATERIAL FOR AN ELECTRONIC COMPONENT | |
EP2827161A4 (en) | DETECTION CIRCUIT AND ELECTRONIC TERMINAL | |
HK1210867A1 (en) | Rotary-operation-type electronic component | |
EP2889889A4 (en) | ELECTRONIC COMPONENT, ELECTRONIC COMPONENT CONNECTION AND TERMINAL CONNECTION STRUCTURE, AND ELECTRICAL CONNECTION HOUSING WITH ELECTRONIC COMPONENT | |
EP2813928A4 (en) | METHOD AND TERMINAL FOR DATA TRANSMISSION BETWEEN TERMINALS | |
EP2927807A4 (en) | METHOD FOR ACTIVATING A TERMINAL AND TERMINAL | |
EP2838164A4 (en) | COMMUNICATION CONNECTOR AND ELECTRONIC DEVICE USING COMMUNICATION CONNECTOR | |
EP2824682A4 (en) | ELECTRONIC COMPONENT | |
EP3071005A4 (en) | DRAWER AND TERMINAL | |
EP2792722A4 (en) | ELECTRICALLY CONDUCTIVE ADHESIVE AND METHOD FOR CONNECTING AN ELECTRONIC COMPONENT | |
EP3081660A4 (en) | Copper alloy for electronic/electric device, copper alloy plastic working material for electronic/electric device, and component and terminal for electronic/electric device | |
EP2871721A4 (en) | CONNECTING STRUCTURE FOR CONNECTING PIECE AND SUBSTRATE | |
IL238152B (en) | Electronic signature method with ephemeral signature |