NO950960L - Fremgangsmåte og innretning for å produsere integrert-krets anordninger - Google Patents
Fremgangsmåte og innretning for å produsere integrert-krets anordningerInfo
- Publication number
- NO950960L NO950960L NO950960A NO950960A NO950960L NO 950960 L NO950960 L NO 950960L NO 950960 A NO950960 A NO 950960A NO 950960 A NO950960 A NO 950960A NO 950960 L NO950960 L NO 950960L
- Authority
- NO
- Norway
- Prior art keywords
- integrated circuit
- circuit devices
- producing integrated
- producing
- multiplicity
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06551—Conductive connections on the side of the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06579—TAB carriers; beam leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06589—Thermal management, e.g. cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Dicing (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Bipolar Transistors (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
En fremgangsmåte for fremstilling av Integrert-krets anordninger, Innbefattende trinnene å fremstille et flertall av Integrerte kretser på en skive, der hver av de Integrerte kretser Innbefatter et flertall av puter (19) og deretter å oppstykke skiven, for derved å definere et flertall av Integrerte kretselementer, og oppstykklngstrlnnet avdekker snlttoverflate hos nevnte flertall av puter. Anordning for å utføre fremgangs- måten og integrert-krets anordninger er også beskrevet og angitt l kravform.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP1992/002134 WO1994007267A1 (en) | 1992-09-14 | 1992-09-14 | Methods and apparatus for producing integrated circuit devices |
Publications (2)
Publication Number | Publication Date |
---|---|
NO950960D0 NO950960D0 (no) | 1995-03-13 |
NO950960L true NO950960L (no) | 1995-05-10 |
Family
ID=8165681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO950960A NO950960L (no) | 1992-09-14 | 1995-03-13 | Fremgangsmåte og innretning for å produsere integrert-krets anordninger |
Country Status (23)
Country | Link |
---|---|
US (2) | US5455455A (no) |
EP (1) | EP0660967B1 (no) |
JP (1) | JP3621093B2 (no) |
KR (1) | KR100310220B1 (no) |
AT (1) | ATE200593T1 (no) |
AU (1) | AU2554192A (no) |
BG (1) | BG99554A (no) |
CA (1) | CA2144323C (no) |
DE (1) | DE69231785T2 (no) |
DK (1) | DK0660967T3 (no) |
EC (1) | ECSP930975A (no) |
FI (1) | FI951142A (no) |
GT (1) | GT199300053A (no) |
HU (1) | HUT73312A (no) |
IL (1) | IL106710A (no) |
MA (1) | MA25277A1 (no) |
MX (1) | MX9305603A (no) |
MY (1) | MY129454A (no) |
NO (1) | NO950960L (no) |
PL (1) | PL169823B1 (no) |
PT (1) | PT101354A (no) |
WO (1) | WO1994007267A1 (no) |
ZA (1) | ZA936039B (no) |
Families Citing this family (142)
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-
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- 1992-09-14 AU AU25541/92A patent/AU2554192A/en not_active Abandoned
- 1992-09-14 PL PL92308140A patent/PL169823B1/pl unknown
- 1992-09-14 HU HU9500783A patent/HUT73312A/hu unknown
- 1992-09-14 WO PCT/EP1992/002134 patent/WO1994007267A1/en active IP Right Grant
- 1992-09-14 AT AT92919323T patent/ATE200593T1/de active
- 1992-09-14 MX MX9305603A patent/MX9305603A/es not_active IP Right Cessation
- 1992-09-14 EP EP92919323A patent/EP0660967B1/en not_active Expired - Lifetime
- 1992-09-14 JP JP50772194A patent/JP3621093B2/ja not_active Expired - Lifetime
- 1992-09-14 KR KR1019950700986A patent/KR100310220B1/ko not_active IP Right Cessation
- 1992-09-14 DK DK92919323T patent/DK0660967T3/da active
- 1992-09-14 US US07/962,222 patent/US5455455A/en not_active Expired - Lifetime
- 1992-09-14 CA CA002144323A patent/CA2144323C/en not_active Expired - Fee Related
- 1992-09-14 DE DE69231785T patent/DE69231785T2/de not_active Expired - Fee Related
-
1993
- 1993-08-16 IL IL10671093A patent/IL106710A/xx not_active IP Right Cessation
- 1993-08-18 ZA ZA936039A patent/ZA936039B/xx unknown
- 1993-08-20 EC EC1993000975A patent/ECSP930975A/es unknown
- 1993-09-02 PT PT101354A patent/PT101354A/pt not_active Application Discontinuation
- 1993-09-09 GT GT199300053A patent/GT199300053A/es unknown
- 1993-09-13 MA MA23286A patent/MA25277A1/fr unknown
- 1993-09-14 MY MYPI93001866A patent/MY129454A/en unknown
-
1994
- 1994-07-13 US US08/274,251 patent/US5547906A/en not_active Expired - Lifetime
-
1995
- 1995-03-10 FI FI951142A patent/FI951142A/fi not_active Application Discontinuation
- 1995-03-13 NO NO950960A patent/NO950960L/no unknown
- 1995-04-10 BG BG99554A patent/BG99554A/xx unknown
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NO950960D0 (no) | 1995-03-13 |
GT199300053A (es) | 1995-03-03 |
IL106710A0 (en) | 1993-12-08 |
PL308140A1 (en) | 1995-07-24 |
EP0660967A1 (en) | 1995-07-05 |
IL106710A (en) | 1997-01-10 |
EP0660967B1 (en) | 2001-04-11 |
HU9500783D0 (en) | 1995-05-29 |
MY129454A (en) | 2007-04-30 |
FI951142A (fi) | 1995-05-10 |
JP3621093B2 (ja) | 2005-02-16 |
MA25277A1 (fr) | 2001-12-31 |
CA2144323A1 (en) | 1994-03-31 |
DE69231785D1 (de) | 2001-05-17 |
AU2554192A (en) | 1994-04-12 |
JPH08503813A (ja) | 1996-04-23 |
KR100310220B1 (ko) | 2001-12-17 |
PT101354A (pt) | 1994-07-29 |
WO1994007267A1 (en) | 1994-03-31 |
US5455455A (en) | 1995-10-03 |
MX9305603A (es) | 1994-05-31 |
DE69231785T2 (de) | 2001-11-15 |
ATE200593T1 (de) | 2001-04-15 |
US5547906A (en) | 1996-08-20 |
HUT73312A (en) | 1996-07-29 |
DK0660967T3 (da) | 2001-08-13 |
ZA936039B (en) | 1994-03-10 |
ECSP930975A (es) | 1994-04-20 |
FI951142A0 (fi) | 1995-03-10 |
BG99554A (en) | 1996-03-29 |
PL169823B1 (pl) | 1996-09-30 |
CA2144323C (en) | 2005-06-28 |
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