IT1186165B - Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazione - Google Patents
Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazioneInfo
- Publication number
- IT1186165B IT1186165B IT23335/85A IT2333585A IT1186165B IT 1186165 B IT1186165 B IT 1186165B IT 23335/85 A IT23335/85 A IT 23335/85A IT 2333585 A IT2333585 A IT 2333585A IT 1186165 B IT1186165 B IT 1186165B
- Authority
- IT
- Italy
- Prior art keywords
- canceled
- semiconductor device
- manufacturing process
- type semiconductor
- ultraviolet rays
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/18—Circuits for erasing optically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT23335/85A IT1186165B (it) | 1985-12-20 | 1985-12-20 | Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazione |
JP61300212A JPH07120732B2 (ja) | 1985-12-20 | 1986-12-18 | 紫外線による消去の可能なeprom型半導体装置とその製造方法 |
US07/224,202 US4971930A (en) | 1985-12-20 | 1988-07-21 | EPROM semiconductor device erasable with ultraviolet rays and manufacturing process thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT23335/85A IT1186165B (it) | 1985-12-20 | 1985-12-20 | Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazione |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8523335A0 IT8523335A0 (it) | 1985-12-20 |
IT1186165B true IT1186165B (it) | 1987-11-18 |
Family
ID=11206191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT23335/85A IT1186165B (it) | 1985-12-20 | 1985-12-20 | Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazione |
Country Status (3)
Country | Link |
---|---|
US (1) | US4971930A (it) |
JP (1) | JPH07120732B2 (it) |
IT (1) | IT1186165B (it) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR940002444B1 (ko) * | 1990-11-13 | 1994-03-24 | 금성일렉트론 주식회사 | 반도체 소자의 패키지 어셈블리 방법 |
US5256598A (en) * | 1992-04-15 | 1993-10-26 | Micron Technology, Inc. | Shrink accommodating lead frame |
MX9305603A (es) * | 1992-09-14 | 1994-05-31 | Pierre Badehi | Metodo y aparato para producir dispositivos de circuito integrado. |
IL106892A0 (en) * | 1993-09-02 | 1993-12-28 | Pierre Badehi | Methods and apparatus for producing integrated circuit devices |
US6117707A (en) * | 1994-07-13 | 2000-09-12 | Shellcase Ltd. | Methods of producing integrated circuit devices |
IL123207A0 (en) * | 1998-02-06 | 1998-09-24 | Shellcase Ltd | Integrated circuit device |
US6455774B1 (en) | 1999-12-08 | 2002-09-24 | Amkor Technology, Inc. | Molded image sensor package |
US6526653B1 (en) | 1999-12-08 | 2003-03-04 | Amkor Technology, Inc. | Method of assembling a snap lid image sensor package |
US6483030B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Snap lid image sensor package |
US6389687B1 (en) | 1999-12-08 | 2002-05-21 | Amkor Technology, Inc. | Method of fabricating image sensor packages in an array |
US6483101B1 (en) | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Molded image sensor package having lens holder |
DE10023539B4 (de) * | 2000-05-13 | 2009-04-09 | Micronas Gmbh | Verfahren zum Herstellen eines Bauteils |
US6686588B1 (en) | 2001-01-16 | 2004-02-03 | Amkor Technology, Inc. | Optical module with lens integral holder |
US7059040B1 (en) | 2001-01-16 | 2006-06-13 | Amkor Technology, Inc. | Optical module with lens integral holder fabrication method |
US6987034B1 (en) | 2002-01-09 | 2006-01-17 | Bridge Semiconductor Corporation | Method of making a semiconductor package device that includes singulating and trimming a lead |
US7190060B1 (en) | 2002-01-09 | 2007-03-13 | Bridge Semiconductor Corporation | Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same |
US6936495B1 (en) | 2002-01-09 | 2005-08-30 | Bridge Semiconductor Corporation | Method of making an optoelectronic semiconductor package device |
US6891276B1 (en) | 2002-01-09 | 2005-05-10 | Bridge Semiconductor Corporation | Semiconductor package device |
US7095621B2 (en) * | 2003-02-24 | 2006-08-22 | Avago Technologies Sensor Ip (Singapore) Pte. Ltd. | Leadless leadframe electronic package and sensor module incorporating same |
US20050009239A1 (en) * | 2003-07-07 | 2005-01-13 | Wolff Larry Lee | Optoelectronic packaging with embedded window |
DE10361650A1 (de) * | 2003-12-30 | 2005-08-04 | Osram Opto Semiconductors Gmbh | Optoelektronisches Modul und Verfahren zu dessen Herstellung |
US7273767B2 (en) * | 2004-12-31 | 2007-09-25 | Carsem (M) Sdn. Bhd. | Method of manufacturing a cavity package |
JP2009000276A (ja) * | 2007-06-21 | 2009-01-08 | Olympus Medical Systems Corp | 医療用チューブ、医療用器具、ステントセット及び内視鏡装置 |
US7582954B1 (en) * | 2008-02-25 | 2009-09-01 | National Semiconductor Corporation | Optical leadless leadframe package |
US7728399B2 (en) * | 2008-07-22 | 2010-06-01 | National Semiconductor Corporation | Molded optical package with fiber coupling feature |
US7915717B2 (en) * | 2008-08-18 | 2011-03-29 | Eastman Kodak Company | Plastic image sensor packaging for image sensors |
US20140377915A1 (en) * | 2013-06-20 | 2014-12-25 | Infineon Technologies Ag | Pre-mold for a magnet semiconductor assembly group and method of producing the same |
MY184608A (en) * | 2013-12-10 | 2021-04-07 | Carsem M Sdn Bhd | Pre-molded integrated circuit packages |
JP2019050338A (ja) * | 2017-09-12 | 2019-03-28 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子および撮像素子の製造方法、撮像装置、並びに電子機器 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3622419A (en) * | 1969-10-08 | 1971-11-23 | Motorola Inc | Method of packaging an optoelectrical device |
JPS5541748A (en) * | 1978-09-18 | 1980-03-24 | Mitsubishi Electric Corp | Semiconductor memory device |
JPS5776867A (en) * | 1980-10-30 | 1982-05-14 | Nec Corp | Semiconductor device |
JPS5834934A (ja) * | 1981-08-26 | 1983-03-01 | Toshiba Corp | 半導体装置 |
US4460915A (en) * | 1981-12-28 | 1984-07-17 | Intel Corporation | Plastic package for radiation sensitive semiconductor devices |
US4491857A (en) * | 1982-03-23 | 1985-01-01 | Texas Instruments Incorporated | Avalanche fuse element with isolated emitter |
JPS6083337A (ja) * | 1983-10-14 | 1985-05-11 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
US4644384A (en) * | 1984-02-02 | 1987-02-17 | National Semiconductor Corporation | Apparatus and method for packaging eprom integrated circuits |
JPS60239043A (ja) * | 1984-05-14 | 1985-11-27 | Oki Electric Ind Co Ltd | 半導体装置用パツケ−ジの製造方法 |
JPS60257546A (ja) * | 1984-06-04 | 1985-12-19 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
US4665426A (en) * | 1985-02-01 | 1987-05-12 | Advanced Micro Devices, Inc. | EPROM with ultraviolet radiation transparent silicon nitride passivation layer |
JPH0642518B2 (ja) * | 1985-09-30 | 1994-06-01 | 三菱電機株式会社 | 半導体装置 |
-
1985
- 1985-12-20 IT IT23335/85A patent/IT1186165B/it active
-
1986
- 1986-12-18 JP JP61300212A patent/JPH07120732B2/ja not_active Expired - Lifetime
-
1988
- 1988-07-21 US US07/224,202 patent/US4971930A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
IT8523335A0 (it) | 1985-12-20 |
JPS62156842A (ja) | 1987-07-11 |
US4971930A (en) | 1990-11-20 |
JPH07120732B2 (ja) | 1995-12-20 |
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Legal Events
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TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19961227 |