NO119489B - - Google Patents
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- NO119489B NO119489B NO149673A NO14967363A NO119489B NO 119489 B NO119489 B NO 119489B NO 149673 A NO149673 A NO 149673A NO 14967363 A NO14967363 A NO 14967363A NO 119489 B NO119489 B NO 119489B
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- tool
- shaft
- tool holder
- conical
- bore
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- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
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- 238000005553 drilling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/2205—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities from the substrate during epitaxy, e.g. autodoping; Preventing or using autodoping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
- H01L21/2255—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/866—Zener diodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/037—Diffusion-deposition
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/043—Dual dielectric
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/053—Field effect transistors fets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/062—Gold diffusion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/118—Oxide films
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/914—Doping
- Y10S438/92—Controlling diffusion profile by oxidation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/965—Shaped junction formation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/981—Utilizing varying dielectric thickness
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Bipolar Transistors (AREA)
- Formation Of Insulating Films (AREA)
- Gripping On Spindles (AREA)
- Thyristors (AREA)
- Bipolar Integrated Circuits (AREA)
Description
Innretning til å fastspenne verktøy eller lignende.
Denne oppfinnelse vedrører en innretning til å fastspenne et med et konisk skaft forsynt verktøy eller lignende i en drivdels koniske boring ved hjelp av en på tvers av verktøyet anordnet fastspenningskamaksel, hvis kamskive, som er anordnet i til hinannen hørende utsparinger i verktøyet og i drivdelen, ved dreining av akslen i en retning fastspenner verktøyet. I henhold til oppfinnelsen har kamskiven på akslen en utkastningskant og verktøyet er forsynt med en utkastningsribbe som er således anordnet at utkastningskanten ved dreining av akslen i retning motsatt fastspenningsretningen treffer utkastnings-ribben.
Oppfinnelsen er vist på tegningen, hvor fig. 1 er et lengdesnitt gjennom en drivspindel og viser sett fra siden en verk-tøyholder fastlåst i spindelens koniske
holder eller boring, fig. 2 er et liknende riss med kamakselen dreiet i stilling for holderens frigjøring og utstøtning, fig. 3 og 4 er tverrsnitt henholdsvis efter linjene 3—3 og 4—4 i fig. 1, fig. 5 er et detaljsnitt efter linjen 5—5 i fig. 4, fig. 6 viser sett ovenfra den kombinrte kamlås og utstøter fig. 7 viser verktøyholderen sett ovenfra.
Fig. 8, 9 og 10 er sideriss av verktøyholde-ren som viser dens bruk i forskjllige øye-med, og fig. 11 og 12 viser i snitt forstør-relser av fig. 1 resp. 2 og illustrerer krefte-nes retning ved låsning og utkastning av verktøyholderen.
Verktøyspindelen eller drivdelen, som
generelt er betegnet 11, har en konisk boring 12 avpasset til å oppta den koniske ende 13 på en verktøyholder betegnet generelt 14. Delen 11 kan være drivspindelen
eller hvilkensomhelst annen anordning til å forbindes med en drivspindel. I verktøy-maskinpraksisen er delen 11 drivdelen. Konusvinkelen av boringen 12 og enden 13 av verktøyholderen er fortrinsvis den som er kjent som NMTB-konussen, en standard som er antatt av «National Machine Tool Builders». Denne konus er dannet slik at den ikke skal kile seg fast eller «klebe» men under hensyntagen til den store grad av fasthet og stivhet som er ønskelig i inngrepet mellom disse koniske deler og det faktum at enkelte arbeidere i overdreven grad driver verktøyholderen inn i den koniske boring, og det enkelte ganger vanskelig å frigjøre holderen uten hamring eller drivning som er vel kjent på området.
Oppfinnelsen er imidlertid ikke begrenset til denne spesielle konusvinkel.
Som vist i fig. 4 er drivdelen 11 utstyrt med en tverrgående boring 15 som skjærer den koniske boring 12 og har ved den ene ende en boring 16 med redusert diameter. I denne boring er montert for roterende bevegelse en fastspenningskamaksel 17 som er kombinert låse- og utstøterdel. Denne del 17 har tapper 18 og 19 som er lagret i det største og minste parti av tverrboringen
som vist i fig. 4. En tapp 21 som er gjenget
inn i spindeldelen griper inn i sporet 22 for å holde akselen 17 fast mot aksial for-skyvning. Som vist i fig. 5 har sporet 22 ender 23 og 24 soom begrenser akselens 17 dreiebevegelse ved å støte mot tappen 21. Akselen 17 har en fordypning eller et hull 25 i den ene ende til å oppta en standard
skrunøkkel 20 som operatøren bruker for å dreie akselen 17 i retning for låsning og for å dreie den i motsatt retning for fri-
gjøring og utstøtning av verktøyholderen. ] Disse funksjoner utføres ved de nye an-ordninger som nu vil bli beskrevet.
Akselen 17 er maskinert for å skaffe J en kamskive 26 med en bred side som ender ( ved 27 og 28 og har en gradvis økende radius som strekker seg fra et lavt punkt 29 til et høyt punkt 31 som vist i fig. 1 og 2. Denne kamskive er avpasset til å ligge an mot den plane, hellende flate 32 som er maskinert ved den ene ende av en fordypning 33 i den koniske ende 13 av verktøyholderen 14. Formen av kamskiven 26 vises best i fig. 11 og er i forhold til akseldreietappen 19 vist med strekede linjer i fig. 4. Ved dreining av delen 17 med urviseren, sett en fig. 1, legger skiven 26 seg an mot flaten 32 og meddeler denne et gradvis tiltagende trykk hvorved den koniske ende 13 drives inn i den koniske boring 12 for å anbringe og fastlåse verktøy-holderen i samme. Dette oppretter ikke bare låseinngrep men også drivinngrep mellom delene 11 og 14. Ved å dreie akselen 17 mot urviseren (fig. 2) vil skiven 26 gradvis føres bort fra flaten 32 for å tillate tilbaketrekning av verktøyholderen 14. Imidlertid griper ufravikelig den koniske ende 13 så fast i boringen 12 at den gjør det vanskelig å bli trukket ut uten bruk av kammer eller en utdrivningskile, som tid-ligere vanligvis ble brukt.
Ifølge oppfinnelsen er det skaffet an-ordninger til å frigjøre og utstøte verktø-holderen 14 fra dens nevnte låste inngrep, hvilke består av en bred utstøterkant 34 som er dannet på akselen 17 ved kampar - tiets høyeste ende og i samvirkende forhold med en utkastningsribbe 35 som er dannet på den koniske ende av verktøyholderen ved den høyeste ende av skråflaten 32. Det vil bemerkes at akselen 17 har en avflat-ning 36 for å skaffe klaring mellom delene 17 og 13 ved visse stillinger av delen 17. For å frigjøre kamskiven fra låsestilling, vist i fig. 1, innsettes nøklen 20 (fig. 4) i sporet 25 og dreies mot urviseren, hvorved skiven 26 trekkes bort fra skråflaten 32. Denne bevegelse av nøkkelen vil bli fort-satt i et hurtig slag for å føre kanten 34 i låseinngrep med ribben 35 for å meddele denne et trykkslag i en retning til å fri-gjøre den koniske ende 13 fra boringen 12 og støte verktøyholderen 14 ut som vist i fig. 2. Akselen 17 dreies herunder omkring 180°. Delene er således konstruert at kanten 34 (se fig. 11, 12) ved denne hurtige manu-elle bevegelse av skrunøkkelen 20 vil ut-føre i verktøyholderens 14 lengderetning en støtkraft som vil løse den tilspissede ende L3 fra boringen 12. Skjønt verktøyholderen 14 da som vist i fig. 2 er blitt løst fra spin-ielen 11 og delvis utkastet, kan den på 51-unn av anlegget mellom kanten 34 og ribben 35 ennu ikke fritt trekkes tilbake derfra. Reaksjonen fra støtkraften vil kaste tilbake akselen 17 noe i urviserens retning og derved trekke tilbake kanten 34 fra arealet innenfor boringen 12. Skulle arbeideren forsinke denne reaksjon, vil han omkaste bevegelsen av skrunøkkelen mot urviserens retning nok til å trekke kanten 34 tilbake og bringe klaringen 36 i hovedsakelig parallell stilling med verk-tøyholderens koniske parti. Dette gir full klaring for tilbaketrekning av verktøy-holderen 14 fra boringen 12. Disse opera-sjoner med låsing og og utkasting av verk-tøyholderen sees tydeligere av fig. 11 og 12. I fig. 11, som viser en forstørrelse av de i fig. 1 viste deler, er akselen 17 blitt beveget til fullstendig låst stilling. I denne stilling utøver akselen 17 en låsekraft i den linje som er betegnet med 46 i fig. 11. Dette skjer ved den omtalte kamskivevirkning, resultatet av den gradvise stigning av kamskiveflaten fra deres begynnelsespunkt 47 til et teoretisk låsepunkt 48. Denne kam-skiveflate fortsetter imidlertid å stige gradvis til omtrent endepunktet 49. Denne til-leggskamskiveflate fra låsepunktet 48 til punktet 49 tjener til å sikre full låsekraft i tilfelle av slitasje av delene eller i tilfelle av variasjoner i fabrikasjon av de samvirkende deler som nødvendiggjør klemvirk-ning utover den teoretisk fullstendige låsning ved 48. Kamskiveflaten kan fortsette til kanten 34. I fig. 12, som er en forstør-relse av de i fig. 2 viste deler, er akselen 17 blitt beveget mot urviserens retning for å trekke kamskiven tilbake fra flaten 32 og bringe kanten 34 i støtanlegg med ribben 35 på en sådan måte at der meddeles en utkastningskraft i den med 51 betegnede retning. Denne utløsning og utkastning av verktøyholderen er uten videre åpenbar for arbeideren, og han gir da skrunøkkelen 20 en liten bevegelse i motsatt retning, hvorved kanten 34 trekkes tilbake til den i fig.
12 med punktert linje viste stilling, nemlig
til den omtalte klaringsstilling. Ved hjelp av en enkelt del 17 fastlåses således en verk-tøyholder i en drivdel og den kan derefter
frigjøres og støtes ut av samme ganske enkelt ved dreiebevegelse av denne del 17. Ved denne anordning kan en operatør hurtig låse en verktøyholder fast i en spindel eller liknende og like hurtig frigjøre og ut-støte holderen, og disse funksjoner kan ut-føres meget nøyaktig uten å være avhengig
av at operatøren har særlig fagkunnskap eller er omsorgsfull. 1
Drivforbindelsen mellom delene 11 og 14 er utført på kjent måte ved at et eller flere fremspring 37 som på passende måte er stivt festet på spindeldelens 11 endeflate og er anordnet til å passe inn i slisser eller fordypninger 38 i en flens 39 som er utfor-met i ett med verktøyholderen 14. 'De samvirkende sider av fremspringene 37 og slis-sene 38 er fortrinsvis parallelle med delens 11 lengdeakse når de er låst sammen. Med denne konstruksjon vil de samvirkende sider 37—38 tjene til nøyaktig innstilling av verktøyholderen i forhold til spindelen slik at skråflaten 32 vil bli bragt i riktig og nøyaktig forhold til den eksentriske kamskive 26, hvorved enhver uriktig kontakt eller skjevhet i inngrepet mellom de samvirkende kamflater mellom endene 27 og 28 av siden 26 elimineres. En annen fordel er at der skaffes en stor drivdiameter ved hjelp av drivfremspringene 37, hvilken vil gi større dreiemoment enn inngrepet mellom kamflatene 26—32. Denne drift ved fremspringene 37 sikrer en spesiell solid og stiv drivforbindelse og avhjelper slitasje og påkjenning på kamflatene 26—32 og bortskaffer også mulig løsning av disse fla-ter i tilfelle av en mindre skjevhet mellom delene 11 og 14, som kunne oppstå hvis driften 36—37 ikke var anordnet.
Oppfinnelsen er bestemt til bruk på verktøyholdere i sin alminnelighet hvor en konisk del passer inn i en konisk holder eller boring, Som ovenfor beskrevet kan den koniske boring være i en drivspindel eller i en annen drivdel. Det skal fremholdes at verktøyholderdelen som har det koniske endeparti til å passe inn i den koniske boring kan være selve verktøyet, eller det kan være en mellomholder eller en hvilken som helst variant med forskjellige utform-ninger.
I de i fig. 1—4 viste utførelsesformer er delen 14 en verktøyholder. I fig. 8 er
vist en borstang hvor verktøyholderen 41 er utstyrt med et boreverktøy 42. I fig. 9 er vist en mellomholder 43 for en endefres 44. Freser av andre størrelser eller former
kan innskiftes på mellomholderen 43. I fig. 10 er vist en mellomholder 45 utstyrt med en konisk boring 46 til opptagelse av den koniske tange på et verktøy f. eks. et bor eller en fres. Selve verktøyholderen kan også tjene til å holde en verktøy-chuck. Dette illustrerer noen av de typer av verktøyholdere eller mellomholdere ved hvilke oppfinnelsen kan brukes. Det vil derfor være klart at oppfinnelsen er særlig fordelaktig hvor det arbeide som ut-føres krever ombytting av verktøy som f. eks. ved en serie av skjæreoper as joner, der spares megen tid og anstrengelse for operatøren, en best mulig drivforbindelse er opprettet og delene kan så å si øye-blikkelig frakoples lett og uten skade for maskinen.
Claims (1)
- Innretning til å fastspenne et med et konisk skaft forsynt verktøy eller lignendei en drivspindels koniske boring ved hjelp av en på tvers av verktøyet anordnet fastspenningskamaksel, hvis kamskive, som er anordnet i til hinannen hørende utsparinger i verktøyet og i drivspindelen, ved dreining av akselen i en retning fastspenner verktøyet, karakterisert ved at kamskiven på akselen har en utkastningskant (34) og verktøyet er forsynt med en utkastningsribbe (35) som er således anordnet at utkastningskanten (34) ved dreining av akselen (17) i retning motsatt fastspenningsretningen treffer ut-kastningsribben (35).
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US218904A US3226611A (en) | 1962-08-23 | 1962-08-23 | Semiconductor device |
US265736A US3226612A (en) | 1962-08-23 | 1963-03-18 | Semiconductor device and method |
US265649A US3226613A (en) | 1962-08-23 | 1963-03-18 | High voltage semiconductor device |
US321070A US3226614A (en) | 1962-08-23 | 1963-11-04 | High voltage semiconductor device |
US465012A US3309245A (en) | 1962-08-23 | 1965-06-18 | Method for making a semiconductor device |
US504813A US3309246A (en) | 1962-08-23 | 1965-10-24 | Method for making a high voltage semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
NO119489B true NO119489B (no) | 1970-05-25 |
Family
ID=27559106
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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NO149673A NO119489B (no) | 1962-08-23 | 1963-08-08 | |
NO149672A NO115810B (no) | 1962-08-23 | 1963-08-08 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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NO149672A NO115810B (no) | 1962-08-23 | 1963-08-08 |
Country Status (9)
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US (6) | US3226611A (no) |
BE (2) | BE636317A (no) |
CH (1) | CH439498A (no) |
DE (3) | DE1295094B (no) |
DK (2) | DK128388B (no) |
GB (2) | GB1060303A (no) |
NL (3) | NL146646B (no) |
NO (2) | NO119489B (no) |
SE (2) | SE315660B (no) |
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DE1210955B (de) * | 1964-06-09 | 1966-02-17 | Ibm Deutschland | Verfahren zum Maskieren von Kristallen und zum Herstellen von Halbleiterbauelementen |
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US3417464A (en) * | 1965-05-21 | 1968-12-24 | Ibm | Method for fabricating insulated-gate field-effect transistors |
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DE1105069B (de) * | 1959-04-25 | 1961-04-20 | Siemens Ag | AEtzverfahren eines pn-UEberganges bei der Herstellung einer Halbleiteranordnung |
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-
0
- NL NL297002D patent/NL297002A/xx unknown
- BE BE636316D patent/BE636316A/xx unknown
- BE BE636317D patent/BE636317A/xx unknown
- NL NL302804D patent/NL302804A/xx unknown
-
1962
- 1962-08-23 US US218904A patent/US3226611A/en not_active Expired - Lifetime
-
1963
- 1963-03-18 US US265649A patent/US3226613A/en not_active Expired - Lifetime
- 1963-03-18 US US265736A patent/US3226612A/en not_active Expired - Lifetime
- 1963-08-06 GB GB31031/63A patent/GB1060303A/en not_active Expired
- 1963-08-06 GB GB31030/63A patent/GB1059739A/en not_active Expired
- 1963-08-08 NO NO149673A patent/NO119489B/no unknown
- 1963-08-08 NO NO149672A patent/NO115810B/no unknown
- 1963-08-19 SE SE9043/63A patent/SE315660B/xx unknown
- 1963-08-21 DK DK399163AA patent/DK128388B/da unknown
- 1963-08-21 DK DK399263AA patent/DK126811B/da unknown
- 1963-08-22 NL NL63297002A patent/NL146646B/xx not_active IP Right Cessation
- 1963-08-23 DE DEM57928A patent/DE1295094B/de active Pending
- 1963-09-03 SE SE09596/63A patent/SE338619B/xx unknown
- 1963-09-27 DE DE6609659U patent/DE6609659U/de not_active Expired
- 1963-09-27 DE DEM58355A patent/DE1295093B/de active Pending
- 1963-11-04 US US321070A patent/US3226614A/en not_active Expired - Lifetime
-
1964
- 1964-11-03 CH CH1422564A patent/CH439498A/fr unknown
-
1965
- 1965-06-18 US US465012A patent/US3309245A/en not_active Expired - Lifetime
- 1965-10-24 US US504813A patent/US3309246A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CH439498A (fr) | 1967-07-15 |
BE636317A (no) | 1900-01-01 |
GB1060303A (en) | 1967-03-01 |
DE6609659U (de) | 1972-08-24 |
BE636316A (no) | 1900-01-01 |
US3226613A (en) | 1965-12-28 |
US3226611A (en) | 1965-12-28 |
GB1059739A (en) | 1967-02-22 |
NL146646B (nl) | 1975-07-15 |
NL302804A (no) | 1900-01-01 |
NO115810B (no) | 1968-12-09 |
NL297002A (no) | 1900-01-01 |
US3309245A (en) | 1967-03-14 |
DK128388B (da) | 1974-04-22 |
US3226614A (en) | 1965-12-28 |
US3226612A (en) | 1965-12-28 |
US3309246A (en) | 1967-03-14 |
SE338619B (no) | 1971-09-13 |
SE315660B (no) | 1969-10-06 |
DE1295093B (de) | 1969-05-14 |
DK126811B (da) | 1973-08-20 |
DE1295094B (de) | 1969-05-14 |
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