NL7515149A - Inrichting voor het hanteren van wafels van halfgeleidend materiaal. - Google Patents
Inrichting voor het hanteren van wafels van halfgeleidend materiaal.Info
- Publication number
- NL7515149A NL7515149A NL7515149A NL7515149A NL7515149A NL 7515149 A NL7515149 A NL 7515149A NL 7515149 A NL7515149 A NL 7515149A NL 7515149 A NL7515149 A NL 7515149A NL 7515149 A NL7515149 A NL 7515149A
- Authority
- NL
- Netherlands
- Prior art keywords
- waffles
- handling
- semiconductive material
- semiconductive
- handling waffles
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J7/00—Micromanipulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/10—Associated with forming or dispersing groups of intersupporting articles, e.g. stacking patterns
- Y10S414/102—Associated with forming or dispersing groups of intersupporting articles, e.g. stacking patterns including support for group
- Y10S414/103—Vertically shiftable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP753369A JPS5811740B2 (ja) | 1974-12-28 | 1974-12-28 | ウエハイチアワセソウチ |
JP336875A JPS5178689A (ja) | 1974-12-28 | 1974-12-28 | Butsupinkyojihansosochi |
JP1975003574U JPS5521341Y2 (nl) | 1974-12-28 | 1974-12-28 | |
JP753370A JPS5811742B2 (ja) | 1974-12-28 | 1974-12-28 | ウエハキヨウキユウソウチ |
JP50002140A JPS5178692A (nl) | 1974-12-29 | 1974-12-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7515149A true NL7515149A (nl) | 1976-06-30 |
Family
ID=27518207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7515149A NL7515149A (nl) | 1974-12-28 | 1975-12-29 | Inrichting voor het hanteren van wafels van halfgeleidend materiaal. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4103232A (nl) |
CA (1) | CA1044379A (nl) |
DE (1) | DE2558963A1 (nl) |
GB (1) | GB1531429A (nl) |
NL (1) | NL7515149A (nl) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4266191A (en) * | 1979-04-18 | 1981-05-05 | Spano John D | Test probe alignment apparatus |
US4485911A (en) * | 1982-01-26 | 1984-12-04 | The Budd Company | Transfer machine |
US4457664A (en) * | 1982-03-22 | 1984-07-03 | Ade Corporation | Wafer alignment station |
US4508435A (en) * | 1982-06-18 | 1985-04-02 | Coulter Electronics, Inc. | Air vacuum chuck for a microscope |
US4538885A (en) * | 1982-06-18 | 1985-09-03 | Coulter Electronics, Inc. | Optical microscope system |
JPS5978538A (ja) * | 1982-10-27 | 1984-05-07 | Toshiba Corp | ダイボンダ装置 |
JPH0662305B2 (ja) * | 1983-12-29 | 1994-08-17 | オ−ストラリア国 | テクネチウム−99m−標識放射医薬の製造 |
JPH0620922B2 (ja) * | 1984-10-19 | 1994-03-23 | 株式会社東芝 | 被検物の搬送装置 |
US4938654A (en) * | 1985-05-17 | 1990-07-03 | Schram Richard R | Automated wafer inspection system |
US4818169A (en) * | 1985-05-17 | 1989-04-04 | Schram Richard R | Automated wafer inspection system |
PH25206A (en) * | 1985-12-12 | 1991-03-27 | Lintec K K | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
US4818933A (en) * | 1986-10-08 | 1989-04-04 | Hewlett-Packard Company | Board fixturing system |
JPS63252438A (ja) * | 1987-03-11 | 1988-10-19 | Yokogawa Hewlett Packard Ltd | 自動表面清浄装置 |
US4904934A (en) * | 1987-10-21 | 1990-02-27 | Mitsubishi Denki Kabushiki Kaisha | Testing apparatus for semiconductor devices |
JPH0833433B2 (ja) * | 1987-11-30 | 1996-03-29 | 東京エレクトロン株式会社 | プローブ装置 |
US4907931A (en) * | 1988-05-18 | 1990-03-13 | Prometrix Corporation | Apparatus for handling semiconductor wafers |
IL86514A0 (nl) * | 1988-05-26 | 1988-11-15 | ||
US4941800A (en) * | 1988-10-21 | 1990-07-17 | Tokyo Electron Limited | Transfer apparatus for plate-like member |
US5172053A (en) * | 1989-02-24 | 1992-12-15 | Tokyo Electron Limited | Prober apparatus |
US4940935A (en) * | 1989-08-28 | 1990-07-10 | Ried Ashman Manufacturing | Automatic SMD tester |
US5321352A (en) * | 1991-08-01 | 1994-06-14 | Tokyo Electron Yamanashi Limited | Probe apparatus and method of alignment for the same |
JP2821046B2 (ja) * | 1991-09-05 | 1998-11-05 | 三菱電機エンジニアリング株式会社 | 半導体素子用特性検査装置 |
US5424651A (en) * | 1992-03-27 | 1995-06-13 | Green; Robert S. | Fixture for burn-in testing of semiconductor wafers, and a semiconductor wafer |
KR100291110B1 (ko) * | 1993-06-19 | 2001-06-01 | 히가시 데쓰로 | 프로우브장치 및 그것을 사용한 피검사체의 검사방법 |
US5506512A (en) * | 1993-11-25 | 1996-04-09 | Tokyo Electron Limited | Transfer apparatus having an elevator and prober using the same |
US5509191A (en) * | 1994-01-26 | 1996-04-23 | Best; Norman D. | Apparatus for assembling and processing small parts using a robot |
US5642298A (en) * | 1994-02-16 | 1997-06-24 | Ade Corporation | Wafer testing and self-calibration system |
US5511005A (en) * | 1994-02-16 | 1996-04-23 | Ade Corporation | Wafer handling and processing system |
US5568058A (en) * | 1994-05-20 | 1996-10-22 | Emerson Electric Co. | Automatic motor tester |
JP3412114B2 (ja) * | 1995-07-26 | 2003-06-03 | 株式会社アドバンテスト | Ic試験装置 |
US5731708A (en) * | 1995-10-31 | 1998-03-24 | Hughes Aircraft Company | Unpackaged semiconductor testing using an improved probe and precision X-Y table |
JPH09321102A (ja) * | 1996-05-31 | 1997-12-12 | Tokyo Electron Ltd | 検査装置 |
JP3689215B2 (ja) * | 1997-02-20 | 2005-08-31 | 株式会社ルネサステクノロジ | 半導体デバイスのテスト用搬送装置 |
JP3099183B2 (ja) * | 1997-05-14 | 2000-10-16 | 株式会社東京精密 | ウェーハプロービングマシン |
US6104184A (en) * | 1997-11-17 | 2000-08-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for loading a wafer into a test machine |
JP3584845B2 (ja) * | 2000-03-16 | 2004-11-04 | 日立ハイテク電子エンジニアリング株式会社 | Icデバイスの試験装置及び試験方法 |
JP2003084009A (ja) * | 2001-09-11 | 2003-03-19 | Umc Japan | テスト用ピンユニット |
US6670807B2 (en) | 2002-01-16 | 2003-12-30 | Applied Materials, Inc. | Proximity sensor detecting loss of magnetic field complete |
JP4134289B2 (ja) * | 2002-05-29 | 2008-08-20 | 東京エレクトロン株式会社 | プローブカード搬送装置及びアダプタ |
US20060182556A1 (en) * | 2005-01-10 | 2006-08-17 | Au Optronics Corporation | Substrate transportation device (wire) |
US20070033827A1 (en) * | 2005-07-28 | 2007-02-15 | Kim Young M | Apparatus for moving up and down a wafer cassette and chip sorter having the apparatus |
US20070093168A1 (en) * | 2005-10-24 | 2007-04-26 | Joel Scholz | Toy hang glider for both flying and launching |
CN101364560B (zh) * | 2007-08-08 | 2010-11-03 | 京元电子股份有限公司 | 可调整式芯片夹治具 |
TWI372437B (en) * | 2008-02-26 | 2012-09-11 | Cheng Mei Instr Co Ltd | System for inspecting chip surface in a tray, tray handling apparatus and method thereof |
US20110248738A1 (en) * | 2010-04-12 | 2011-10-13 | Sze Chak Tong | Testing apparatus for electronic devices |
CN107958866B (zh) * | 2015-11-20 | 2021-09-14 | 苏州赛森电子科技有限公司 | 蒸发镀膜工艺中的圆片固定装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3238455A (en) * | 1962-04-18 | 1966-03-01 | Sylvania Electric Prod | Magazine for supporting a plurality of electrical devices and apparatus for making electrical contact to devices supported therein |
US3221394A (en) * | 1962-10-26 | 1965-12-07 | Method and apparatus for use in the manufacture of transistors | |
US3219068A (en) * | 1963-02-14 | 1965-11-23 | Texas Instruments Inc | System for handling electrical components having slender columnar leads |
US3437929A (en) * | 1965-08-05 | 1969-04-08 | Electroglas Inc | Automatically indexed probe assembly for testing semiconductor wafers and the like |
US3625384A (en) * | 1968-09-26 | 1971-12-07 | Ibm | Article-handling apparatus |
US3583561A (en) * | 1968-12-19 | 1971-06-08 | Transistor Automation Corp | Die sorting system |
US3581375A (en) * | 1969-03-07 | 1971-06-01 | Ibm | Method and apparatus for manufacturing integrated circuits |
US3584741A (en) * | 1969-06-30 | 1971-06-15 | Ibm | Batch sorting apparatus |
US3765763A (en) * | 1969-07-29 | 1973-10-16 | Texas Instruments Inc | Automatic slice processing |
US3816700A (en) * | 1971-10-21 | 1974-06-11 | Union Carbide Corp | Apparatus for facilitating laser scribing |
US3851758A (en) * | 1972-04-26 | 1974-12-03 | Ibm | Semiconductor chip fixture |
US4024963A (en) * | 1975-05-07 | 1977-05-24 | Hautau Charles F | Apparatus for transferring articles |
-
1975
- 1975-12-24 CA CA242,588A patent/CA1044379A/en not_active Expired
- 1975-12-29 DE DE19752558963 patent/DE2558963A1/de not_active Ceased
- 1975-12-29 NL NL7515149A patent/NL7515149A/nl not_active Application Discontinuation
- 1975-12-29 US US05/645,020 patent/US4103232A/en not_active Expired - Lifetime
- 1975-12-29 GB GB53002/75A patent/GB1531429A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB1531429A (en) | 1978-11-08 |
US4103232A (en) | 1978-07-25 |
DE2558963A1 (de) | 1976-07-08 |
CA1044379A (en) | 1978-12-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BA | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
A85 | Still pending on 85-01-01 | ||
BV | The patent application has lapsed |