NL194456C - Leidgestel voor gebruik bij de vervaardiging van halfgeleiderinrichtingen, voorzien van eerste en tweede positioneerorganen. - Google Patents

Leidgestel voor gebruik bij de vervaardiging van halfgeleiderinrichtingen, voorzien van eerste en tweede positioneerorganen. Download PDF

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Publication number
NL194456C
NL194456C NL9200722A NL9200722A NL194456C NL 194456 C NL194456 C NL 194456C NL 9200722 A NL9200722 A NL 9200722A NL 9200722 A NL9200722 A NL 9200722A NL 194456 C NL194456 C NL 194456C
Authority
NL
Netherlands
Prior art keywords
positioning
guide frame
semiconductor device
conductors
forming
Prior art date
Application number
NL9200722A
Other languages
English (en)
Dutch (nl)
Other versions
NL9200722A (nl
NL194456B (nl
Inventor
Makio Okada
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of NL9200722A publication Critical patent/NL9200722A/nl
Publication of NL194456B publication Critical patent/NL194456B/xx
Application granted granted Critical
Publication of NL194456C publication Critical patent/NL194456C/nl

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49565Side rails of the lead frame, e.g. with perforations, sprocket holes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
NL9200722A 1991-04-26 1992-04-21 Leidgestel voor gebruik bij de vervaardiging van halfgeleiderinrichtingen, voorzien van eerste en tweede positioneerorganen. NL194456C (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3096474A JP2608192B2 (ja) 1991-04-26 1991-04-26 リードフレーム
JP9647491 1991-04-26

Publications (3)

Publication Number Publication Date
NL9200722A NL9200722A (nl) 1992-11-16
NL194456B NL194456B (nl) 2001-12-03
NL194456C true NL194456C (nl) 2002-04-04

Family

ID=14166046

Family Applications (1)

Application Number Title Priority Date Filing Date
NL9200722A NL194456C (nl) 1991-04-26 1992-04-21 Leidgestel voor gebruik bij de vervaardiging van halfgeleiderinrichtingen, voorzien van eerste en tweede positioneerorganen.

Country Status (4)

Country Link
US (1) US5223738A (de)
JP (1) JP2608192B2 (de)
DE (1) DE4213411A1 (de)
NL (1) NL194456C (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3016658B2 (ja) * 1992-04-28 2000-03-06 ローム株式会社 リードフレーム並びに半導体装置およびその製法
JP3046151B2 (ja) * 1992-08-10 2000-05-29 ローム株式会社 リードフレーム
US5517056A (en) * 1993-09-30 1996-05-14 Motorola, Inc. Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same
US5766983A (en) * 1994-04-29 1998-06-16 Hewlett-Packard Company Tape automated bonding circuit with interior sprocket holes
JP2687946B2 (ja) * 1995-08-16 1997-12-08 日本電気株式会社 リードフレーム
US5781682A (en) * 1996-02-01 1998-07-14 International Business Machines Corporation Low-cost packaging for parallel optical computer link
US5929511A (en) * 1996-07-15 1999-07-27 Matsushita Electronics Corporation Lead frame for resin sealed semiconductor device
US5939775A (en) * 1996-11-05 1999-08-17 Gcb Technologies, Llc Leadframe structure and process for packaging intergrated circuits
JP4801243B2 (ja) * 2000-08-08 2011-10-26 ルネサスエレクトロニクス株式会社 リードフレームおよびそれを用いて製造した半導体装置並びにその製造方法
EP1944518B1 (de) * 2005-09-30 2013-07-31 NTN Corporation Lagervorrichtung für rad
DE102014213217A1 (de) * 2014-07-08 2016-01-14 Continental Teves Ag & Co. Ohg Körperschallentkopplung an mit Geberfeldern arbeitenden Sensoren
JP6389768B2 (ja) * 2015-01-23 2018-09-12 新日本無線株式会社 リード内蔵型回路パッケージの製造方法
US9496206B2 (en) 2015-04-10 2016-11-15 Texas Instruments Incorporated Flippable leadframe for packaged electronic system having vertically stacked chips and components
US20190229044A1 (en) * 2018-01-23 2019-07-25 Nxp B.V. Lead frame with plated lead tips

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
US4477827A (en) * 1981-02-02 1984-10-16 Northern Telecom Limited Lead frame for leaded semiconductor chip carriers
US4496965A (en) * 1981-05-18 1985-01-29 Texas Instruments Incorporated Stacked interdigitated lead frame assembly
DE3379882D1 (en) * 1982-03-02 1989-06-22 Siemens Ag Film carrier for an electrical conductor pattern
US4918511A (en) * 1985-02-01 1990-04-17 Advanced Micro Devices, Inc. Thermal expansion compensated metal lead frame for integrated circuit package
JPS62234337A (ja) * 1986-04-04 1987-10-14 Hitachi Cable Ltd 半導体装置用フイルムキヤリア
DE3635375A1 (de) * 1986-10-17 1988-04-28 Heraeus Gmbh W C Systemtraeger fuer elektronische bauelemente
JPS63148670A (ja) * 1986-12-12 1988-06-21 Texas Instr Japan Ltd リ−ドフレ−ム材
KR960006710B1 (ko) * 1987-02-25 1996-05-22 가부시기가이샤 히다찌세이사꾸쇼 면실장형 반도체집적회로장치 및 그 제조방법과 그 실장방법
JP2671900B2 (ja) * 1987-03-06 1997-11-05 沖電気工業株式会社 半導体装置用リードフレーム
JPH01145839A (ja) * 1987-12-02 1989-06-07 Rhythm Watch Co Ltd リードフレーム
JPH01165057A (ja) * 1987-12-21 1989-06-29 Toshiba Corp テープカセット種別検出装置
US4868635A (en) * 1988-01-13 1989-09-19 Texas Instruments Incorporated Lead frame for integrated circuit
JPH0828455B2 (ja) * 1988-02-24 1996-03-21 富士通株式会社 リードフレーム及びそれを用いた電子部品の製造方法
JPH02232957A (ja) * 1989-03-06 1990-09-14 Yamada Seisakusho:Kk 樹脂封止型半導体装置用のリードフレーム
JPH02266550A (ja) * 1989-04-07 1990-10-31 Sharp Corp 面実装形icパッケージ
JPH02292836A (ja) * 1989-05-02 1990-12-04 Nippon Steel Corp Icチップ実装用フィルムキャリア
US5057901A (en) * 1989-09-27 1991-10-15 Die Tech, Inc. Lead frame for semi-conductor device
JPH0479358A (ja) * 1990-07-23 1992-03-12 Nec Corp 半導体装置用リードフレーム

Also Published As

Publication number Publication date
NL9200722A (nl) 1992-11-16
DE4213411A1 (de) 1992-10-29
JPH04326561A (ja) 1992-11-16
US5223738A (en) 1993-06-29
JP2608192B2 (ja) 1997-05-07
NL194456B (nl) 2001-12-03

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A1A A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
V1 Lapsed because of non-payment of the annual fee

Effective date: 20091101