NL194456C - Leidgestel voor gebruik bij de vervaardiging van halfgeleiderinrichtingen, voorzien van eerste en tweede positioneerorganen. - Google Patents
Leidgestel voor gebruik bij de vervaardiging van halfgeleiderinrichtingen, voorzien van eerste en tweede positioneerorganen. Download PDFInfo
- Publication number
- NL194456C NL194456C NL9200722A NL9200722A NL194456C NL 194456 C NL194456 C NL 194456C NL 9200722 A NL9200722 A NL 9200722A NL 9200722 A NL9200722 A NL 9200722A NL 194456 C NL194456 C NL 194456C
- Authority
- NL
- Netherlands
- Prior art keywords
- positioning
- guide frame
- semiconductor device
- conductors
- forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3096474A JP2608192B2 (ja) | 1991-04-26 | 1991-04-26 | リードフレーム |
JP9647491 | 1991-04-26 |
Publications (3)
Publication Number | Publication Date |
---|---|
NL9200722A NL9200722A (nl) | 1992-11-16 |
NL194456B NL194456B (nl) | 2001-12-03 |
NL194456C true NL194456C (nl) | 2002-04-04 |
Family
ID=14166046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL9200722A NL194456C (nl) | 1991-04-26 | 1992-04-21 | Leidgestel voor gebruik bij de vervaardiging van halfgeleiderinrichtingen, voorzien van eerste en tweede positioneerorganen. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5223738A (de) |
JP (1) | JP2608192B2 (de) |
DE (1) | DE4213411A1 (de) |
NL (1) | NL194456C (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3016658B2 (ja) * | 1992-04-28 | 2000-03-06 | ローム株式会社 | リードフレーム並びに半導体装置およびその製法 |
JP3046151B2 (ja) * | 1992-08-10 | 2000-05-29 | ローム株式会社 | リードフレーム |
US5517056A (en) * | 1993-09-30 | 1996-05-14 | Motorola, Inc. | Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same |
US5766983A (en) * | 1994-04-29 | 1998-06-16 | Hewlett-Packard Company | Tape automated bonding circuit with interior sprocket holes |
JP2687946B2 (ja) * | 1995-08-16 | 1997-12-08 | 日本電気株式会社 | リードフレーム |
US5781682A (en) * | 1996-02-01 | 1998-07-14 | International Business Machines Corporation | Low-cost packaging for parallel optical computer link |
US5929511A (en) * | 1996-07-15 | 1999-07-27 | Matsushita Electronics Corporation | Lead frame for resin sealed semiconductor device |
US5939775A (en) * | 1996-11-05 | 1999-08-17 | Gcb Technologies, Llc | Leadframe structure and process for packaging intergrated circuits |
JP4801243B2 (ja) * | 2000-08-08 | 2011-10-26 | ルネサスエレクトロニクス株式会社 | リードフレームおよびそれを用いて製造した半導体装置並びにその製造方法 |
EP1944518B1 (de) * | 2005-09-30 | 2013-07-31 | NTN Corporation | Lagervorrichtung für rad |
DE102014213217A1 (de) * | 2014-07-08 | 2016-01-14 | Continental Teves Ag & Co. Ohg | Körperschallentkopplung an mit Geberfeldern arbeitenden Sensoren |
JP6389768B2 (ja) * | 2015-01-23 | 2018-09-12 | 新日本無線株式会社 | リード内蔵型回路パッケージの製造方法 |
US9496206B2 (en) | 2015-04-10 | 2016-11-15 | Texas Instruments Incorporated | Flippable leadframe for packaged electronic system having vertically stacked chips and components |
US20190229044A1 (en) * | 2018-01-23 | 2019-07-25 | Nxp B.V. | Lead frame with plated lead tips |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5521128A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame used for semiconductor device and its assembling |
US4477827A (en) * | 1981-02-02 | 1984-10-16 | Northern Telecom Limited | Lead frame for leaded semiconductor chip carriers |
US4496965A (en) * | 1981-05-18 | 1985-01-29 | Texas Instruments Incorporated | Stacked interdigitated lead frame assembly |
DE3379882D1 (en) * | 1982-03-02 | 1989-06-22 | Siemens Ag | Film carrier for an electrical conductor pattern |
US4918511A (en) * | 1985-02-01 | 1990-04-17 | Advanced Micro Devices, Inc. | Thermal expansion compensated metal lead frame for integrated circuit package |
JPS62234337A (ja) * | 1986-04-04 | 1987-10-14 | Hitachi Cable Ltd | 半導体装置用フイルムキヤリア |
DE3635375A1 (de) * | 1986-10-17 | 1988-04-28 | Heraeus Gmbh W C | Systemtraeger fuer elektronische bauelemente |
JPS63148670A (ja) * | 1986-12-12 | 1988-06-21 | Texas Instr Japan Ltd | リ−ドフレ−ム材 |
KR960006710B1 (ko) * | 1987-02-25 | 1996-05-22 | 가부시기가이샤 히다찌세이사꾸쇼 | 면실장형 반도체집적회로장치 및 그 제조방법과 그 실장방법 |
JP2671900B2 (ja) * | 1987-03-06 | 1997-11-05 | 沖電気工業株式会社 | 半導体装置用リードフレーム |
JPH01145839A (ja) * | 1987-12-02 | 1989-06-07 | Rhythm Watch Co Ltd | リードフレーム |
JPH01165057A (ja) * | 1987-12-21 | 1989-06-29 | Toshiba Corp | テープカセット種別検出装置 |
US4868635A (en) * | 1988-01-13 | 1989-09-19 | Texas Instruments Incorporated | Lead frame for integrated circuit |
JPH0828455B2 (ja) * | 1988-02-24 | 1996-03-21 | 富士通株式会社 | リードフレーム及びそれを用いた電子部品の製造方法 |
JPH02232957A (ja) * | 1989-03-06 | 1990-09-14 | Yamada Seisakusho:Kk | 樹脂封止型半導体装置用のリードフレーム |
JPH02266550A (ja) * | 1989-04-07 | 1990-10-31 | Sharp Corp | 面実装形icパッケージ |
JPH02292836A (ja) * | 1989-05-02 | 1990-12-04 | Nippon Steel Corp | Icチップ実装用フィルムキャリア |
US5057901A (en) * | 1989-09-27 | 1991-10-15 | Die Tech, Inc. | Lead frame for semi-conductor device |
JPH0479358A (ja) * | 1990-07-23 | 1992-03-12 | Nec Corp | 半導体装置用リードフレーム |
-
1991
- 1991-04-26 JP JP3096474A patent/JP2608192B2/ja not_active Expired - Fee Related
-
1992
- 1992-04-15 US US07/868,419 patent/US5223738A/en not_active Expired - Lifetime
- 1992-04-21 NL NL9200722A patent/NL194456C/nl not_active IP Right Cessation
- 1992-04-23 DE DE4213411A patent/DE4213411A1/de not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
NL9200722A (nl) | 1992-11-16 |
DE4213411A1 (de) | 1992-10-29 |
JPH04326561A (ja) | 1992-11-16 |
US5223738A (en) | 1993-06-29 |
JP2608192B2 (ja) | 1997-05-07 |
NL194456B (nl) | 2001-12-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A1A | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
V1 | Lapsed because of non-payment of the annual fee |
Effective date: 20091101 |