NL193617B - Kleefvel voor halfgeleiders. - Google Patents
Kleefvel voor halfgeleiders.Info
- Publication number
- NL193617B NL193617B NL9302150A NL9302150A NL193617B NL 193617 B NL193617 B NL 193617B NL 9302150 A NL9302150 A NL 9302150A NL 9302150 A NL9302150 A NL 9302150A NL 193617 B NL193617 B NL 193617B
- Authority
- NL
- Netherlands
- Prior art keywords
- semiconductors
- adhesive sheet
- adhesive
- sheet
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29518985 | 1985-12-27 | ||
JP29519085 | 1985-12-27 | ||
JP60295188A JPS62153375A (ja) | 1985-12-27 | 1985-12-27 | ウエハダイシング用粘着シート |
JP60295190A JPS62153377A (ja) | 1985-12-27 | 1985-12-27 | ウェハダイシング用粘着シート |
JP60295189A JPS62153376A (ja) | 1985-12-27 | 1985-12-27 | ウェハダイシング用粘着シート |
JP29518885 | 1985-12-27 | ||
JP4578586 | 1986-03-03 | ||
JP61045786A JPS62205180A (ja) | 1986-03-03 | 1986-03-03 | 粘着シ−ト |
JP61045785A JPS62205179A (ja) | 1986-03-03 | 1986-03-03 | ウエハ貼着用粘着シ−ト |
JP4578686 | 1986-03-03 | ||
JP16168086 | 1986-07-09 | ||
JP61161680A JPS6317980A (ja) | 1986-07-09 | 1986-07-09 | ウエハ貼着用粘着シ−ト |
NL8603269A NL191241C (nl) | 1985-12-27 | 1986-12-23 | Kleefvel voor halfgeleiders. |
NL8603269 | 1986-12-23 |
Publications (3)
Publication Number | Publication Date |
---|---|
NL9302150A NL9302150A (nl) | 1994-04-05 |
NL193617B true NL193617B (nl) | 1999-12-01 |
NL193617C NL193617C (nl) | 2000-04-04 |
Family
ID=27564628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL9302150A NL193617C (nl) | 1985-12-27 | 1993-12-09 | Kleefvel voor halfgeleiders. |
Country Status (1)
Country | Link |
---|---|
NL (1) | NL193617C (nl) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0616524B2 (ja) * | 1984-03-12 | 1994-03-02 | 日東電工株式会社 | 半導体ウエハ固定用接着薄板 |
-
1993
- 1993-12-09 NL NL9302150A patent/NL193617C/nl not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
NL9302150A (nl) | 1994-04-05 |
NL193617C (nl) | 2000-04-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NL191241C (nl) | Kleefvel voor halfgeleiders. | |
NO860260L (no) | Klebestrimmel. | |
FI862754A0 (fi) | Orienterad film med syrespaerr. | |
FI863146A0 (fi) | Roekbar syntetisk film foer livsmedelsfoerpackning. | |
DE3683492D1 (de) | Reinraum. | |
DE3689554D1 (de) | Automatische Blattwendeeinrichtung. | |
DE3682752D1 (de) | Polyaethylen-2,6-naphthalatfilm fuer kondensator. | |
DE3674345D1 (de) | Blattfoerderer. | |
DE3675542D1 (de) | Blattfoerdervorrichtung. | |
DE3481493D1 (de) | Blattfoerdervorrichtung. | |
IT8620783A0 (it) | Dispositivo di avanzamento. | |
FI865020A0 (fi) | Anordning foer spetsdragning av pappersbana. | |
IT8619724A0 (it) | Dispositivo di piegatura. | |
DE3677817D1 (de) | Blattzufuehrungsvorrichtung. | |
DE3580479D1 (de) | Auftragsvorrichtung. | |
DE3676679D1 (de) | Verpacken. | |
DE3686920D1 (de) | Blattfoerdergeraet. | |
DE3672382D1 (de) | Blattsortiervorrichtung. | |
DE3677843D1 (de) | Klebstoffe. | |
DE3688402D1 (de) | Polycyanoarylaether-filme. | |
NO156230C (no) | Anordning for aa fjerne elektrodemantel. | |
DE3679170D1 (de) | Laminierungsvorrichtung. | |
NO864767D0 (no) | Papir-skjaereanordning. | |
DE3675862D1 (de) | Fuellmundstueck fuer fluessigkeiten. | |
FR2591195B1 (fr) | Pochette adhesive. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A1A | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
BK | Erratum |
Free format text: ON THE FRONTPAGE OF PAMPHLET 193617, ISSUED ON 05.06.2000, SHOULD AS PRIORITY BE ADDED: 27.12.1985 JP 0295189/85 27.12.1985 JP 0295190/85 03.03.1986 JP 0045786/86 |
|
V4 | Discontinued because of reaching the maximum lifetime of a patent |
Effective date: 20061223 |