GB1209901A - Improvements relating to the mounting of integrated circuit assemblies - Google Patents

Improvements relating to the mounting of integrated circuit assemblies

Info

Publication number
GB1209901A
GB1209901A GB0639/67A GB163967A GB1209901A GB 1209901 A GB1209901 A GB 1209901A GB 0639/67 A GB0639/67 A GB 0639/67A GB 163967 A GB163967 A GB 163967A GB 1209901 A GB1209901 A GB 1209901A
Authority
GB
United Kingdom
Prior art keywords
conductors
integrated circuit
mounting
improvements relating
circuit assemblies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB0639/67A
Inventor
Leslie Albert Dyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Telecommunications PLC
British Telecommunications Research Ltd
Original Assignee
British Telecommunications PLC
British Telecommunications Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Telecommunications PLC, British Telecommunications Research Ltd filed Critical British Telecommunications PLC
Priority to GB0639/67A priority Critical patent/GB1209901A/en
Publication of GB1209901A publication Critical patent/GB1209901A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

1,209,901. Mounting semiconductor devices. PLESSEY TELECOMMUNICATION RESEARCH Ltd. 8 Jan., 1968 [11 Jan., 1967], No. 1639/67. Headings H1K and H1R. An integrated circuit chip 1 is mounted on an insulating support 2 carrying a plurality of conductors 3 which extend over an aperture 6 in the support 2 to leave terminal ends 7 free for direct connection to the circuit chip 1. The conductors 3 are formed by etching metal foil on the insulating support. Apertures 8, 9 allow the conductors 3 to be bonded to printed wires of a printed circuit board (not shown). The chip 1, terminal ends 7 and conductors 3 may be encapsulated as shown by the chain outline.
GB0639/67A 1967-01-11 1967-01-11 Improvements relating to the mounting of integrated circuit assemblies Expired GB1209901A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0639/67A GB1209901A (en) 1967-01-11 1967-01-11 Improvements relating to the mounting of integrated circuit assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0639/67A GB1209901A (en) 1967-01-11 1967-01-11 Improvements relating to the mounting of integrated circuit assemblies

Publications (1)

Publication Number Publication Date
GB1209901A true GB1209901A (en) 1970-10-21

Family

ID=9725432

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0639/67A Expired GB1209901A (en) 1967-01-11 1967-01-11 Improvements relating to the mounting of integrated circuit assemblies

Country Status (1)

Country Link
GB (1) GB1209901A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2080918A1 (en) * 1970-01-21 1971-11-26 Siemens Ag
US3942245A (en) * 1971-11-20 1976-03-09 Ferranti Limited Related to the manufacture of lead frames and the mounting of semiconductor devices thereon
FR2317852A1 (en) * 1975-07-07 1977-02-04 Nat Semiconductor Corp INTERCONNECTION TAPE FOR CONNECTING AN ASSEMBLY OF SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SUCH TAPE
FR2438339A1 (en) * 1978-10-05 1980-04-30 Suisse Horlogerie Electrical connection to integrated circuit - by placing integrated circuit in housing punched in thickness of substrate supporting printed conductors
GB2124433A (en) * 1982-07-07 1984-02-15 Int Standard Electric Corp Electronic component assembly
US4472876A (en) * 1981-08-13 1984-09-25 Minnesota Mining And Manufacturing Company Area-bonding tape
US4550248A (en) * 1981-03-24 1985-10-29 Gao Gesellschaft Fur Automation Und Organisation Gmbh Identification card having an IC module
WO1986003591A1 (en) * 1984-12-10 1986-06-19 Aseco Corporation Contact set for test apparatus for testing integrated circuit package
US4867715A (en) * 1988-05-02 1989-09-19 Delco Electronics Corporation Interconnection lead with redundant bonding regions
EP0406373A1 (en) * 1988-12-07 1991-01-09 Tribotech Tape automated bonded lead package and reusable transport tape for use therewith
US5390079A (en) * 1991-09-10 1995-02-14 Hitachi, Ltd. Tape carrier package

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2080918A1 (en) * 1970-01-21 1971-11-26 Siemens Ag
US3942245A (en) * 1971-11-20 1976-03-09 Ferranti Limited Related to the manufacture of lead frames and the mounting of semiconductor devices thereon
FR2317852A1 (en) * 1975-07-07 1977-02-04 Nat Semiconductor Corp INTERCONNECTION TAPE FOR CONNECTING AN ASSEMBLY OF SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SUCH TAPE
FR2438339A1 (en) * 1978-10-05 1980-04-30 Suisse Horlogerie Electrical connection to integrated circuit - by placing integrated circuit in housing punched in thickness of substrate supporting printed conductors
US4550248A (en) * 1981-03-24 1985-10-29 Gao Gesellschaft Fur Automation Und Organisation Gmbh Identification card having an IC module
US4472876A (en) * 1981-08-13 1984-09-25 Minnesota Mining And Manufacturing Company Area-bonding tape
GB2124433A (en) * 1982-07-07 1984-02-15 Int Standard Electric Corp Electronic component assembly
WO1986003591A1 (en) * 1984-12-10 1986-06-19 Aseco Corporation Contact set for test apparatus for testing integrated circuit package
US4686468A (en) * 1984-12-10 1987-08-11 Aseco Corporation Contact set for test apparatus for testing integrated circuit package
US4867715A (en) * 1988-05-02 1989-09-19 Delco Electronics Corporation Interconnection lead with redundant bonding regions
EP0406373A1 (en) * 1988-12-07 1991-01-09 Tribotech Tape automated bonded lead package and reusable transport tape for use therewith
EP0406373A4 (en) * 1988-12-07 1992-04-29 Tribotech Tape automated bonded lead package and reusable transport tape for use therewith
US5390079A (en) * 1991-09-10 1995-02-14 Hitachi, Ltd. Tape carrier package

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees