GB1021320A - Microminiature electrical connection - Google Patents

Microminiature electrical connection

Info

Publication number
GB1021320A
GB1021320A GB2168364A GB2168364A GB1021320A GB 1021320 A GB1021320 A GB 1021320A GB 2168364 A GB2168364 A GB 2168364A GB 2168364 A GB2168364 A GB 2168364A GB 1021320 A GB1021320 A GB 1021320A
Authority
GB
United Kingdom
Prior art keywords
conductive
electrical connection
circuit element
disposed
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2168364A
Inventor
Michael Lazar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FCI USA LLC
Original Assignee
Burndy Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burndy Corp filed Critical Burndy Corp
Priority to GB2168364A priority Critical patent/GB1021320A/en
Publication of GB1021320A publication Critical patent/GB1021320A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

1,021,320. Couplings; two-part couplings. BURNDY CORPORATION. May 26, 1964, No. 21683/64. Heading H2E. An electrical connection between conductive elements 12, 13, 14, adjacent an opening 15 in a printed circuit board 10 and conductive tags 17, 18, 19, of a circuit element 16 which is disposed in the opening 15 is secured by an insulating member 20 with an adhesive coating on one side. The member 20 can have conductive areas 23, 24, 25, disposed on the same side as the adhesive coating so as to effect a better connection. The conductive tags of the circuit element need not overlap the conductive elements (Fig. 4, not shown) in which case the connections are completed by the conductive areas. A similar member 26 may be used on the other side of the circuit board 10. The circuit element 16 need not be of circular form.
GB2168364A 1964-05-26 1964-05-26 Microminiature electrical connection Expired GB1021320A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2168364A GB1021320A (en) 1964-05-26 1964-05-26 Microminiature electrical connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2168364A GB1021320A (en) 1964-05-26 1964-05-26 Microminiature electrical connection

Publications (1)

Publication Number Publication Date
GB1021320A true GB1021320A (en) 1966-03-02

Family

ID=10167068

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2168364A Expired GB1021320A (en) 1964-05-26 1964-05-26 Microminiature electrical connection

Country Status (1)

Country Link
GB (1) GB1021320A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0129137A2 (en) * 1983-06-20 1984-12-27 International Business Machines Corporation Method of forming an aperture in a dielectric substance and securing a conductive pin in said aperture
US4598470A (en) * 1983-06-20 1986-07-08 International Business Machines Corporation Method for providing improved electrical and mechanical connection between I/O pin and transverse via substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0129137A2 (en) * 1983-06-20 1984-12-27 International Business Machines Corporation Method of forming an aperture in a dielectric substance and securing a conductive pin in said aperture
EP0129137A3 (en) * 1983-06-20 1985-11-27 International Business Machines Corporation Method of forming an aperture in a dielectric substance and securing a conductive pin in said aperture
US4598470A (en) * 1983-06-20 1986-07-08 International Business Machines Corporation Method for providing improved electrical and mechanical connection between I/O pin and transverse via substrate

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