MY169844A - Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof - Google Patents
Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereofInfo
- Publication number
- MY169844A MY169844A MYPI2014702262A MYPI2014702262A MY169844A MY 169844 A MY169844 A MY 169844A MY PI2014702262 A MYPI2014702262 A MY PI2014702262A MY PI2014702262 A MYPI2014702262 A MY PI2014702262A MY 169844 A MY169844 A MY 169844A
- Authority
- MY
- Malaysia
- Prior art keywords
- epoxy resin
- polyvalent hydroxy
- resin
- composition
- cured product
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
Provided are an epoxy resin, a polyvalent hydroxy resin, and a composition thereof, which are excellent in curability, provide a cured product excellent in mechanical strength, flame retardancy, moisture resistance, low elasticity, and the like, and are suitable for applications such as sealing of electrical and electronic parts, and circuit board materials. The polyvalent hydroxy resin is an aralkyl-modified polyvalent hydroxy resin, which is obtained by subjecting a narrowly dispersed polyvalent hydroxy compound including 15% or less of n=1 component and 50% or more of a total of n=2 and n=3 components and having an Mw/Mn of 1.2 or less to a reaction with an aralkylating agent such as a styrene. The epoxy epoxy resin is obtained by subjecting the aralkyl-modified polyvalent hydroxy resin to a reaction with epichlorohydrin. Further, the composition is an epoxy resin composition including the aralkyl-modified polyvalent hydroxy resin or the epoxy resin as an essential component.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012037210 | 2012-02-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY169844A true MY169844A (en) | 2019-05-17 |
Family
ID=49005798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2014702262A MY169844A (en) | 2012-02-23 | 2013-02-21 | Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6124865B2 (en) |
KR (1) | KR101987946B1 (en) |
CN (1) | CN104334597B (en) |
MY (1) | MY169844A (en) |
SG (1) | SG11201405075SA (en) |
TW (1) | TWI548681B (en) |
WO (1) | WO2013125620A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI595019B (en) * | 2012-11-12 | 2017-08-11 | Dic股份有限公司 | Phenolic hydroxyl group-containing resin, epoxy resin, curable resin composition,cured product thereof and semiconductor encapsulating material |
JP6406847B2 (en) * | 2014-03-26 | 2018-10-17 | 新日鉄住金化学株式会社 | Modified polyvalent hydroxy resin, epoxy resin, epoxy resin composition and cured product thereof |
CN109071780B (en) * | 2016-04-28 | 2022-04-08 | 昭和电工材料株式会社 | Epoxy resin composition and electronic component device |
JP7142233B2 (en) * | 2017-12-14 | 2022-09-27 | パナソニックIpマネジメント株式会社 | EPOXY RESIN COMPOSITION FOR ENCAPSULATION, CURED PRODUCT AND SEMICONDUCTOR DEVICE |
TWI751064B (en) * | 2021-03-29 | 2021-12-21 | 長春人造樹脂廠股份有限公司 | Polyhydric phenol resin, glycidyl ether of polyhydric phenol resin, and uses thereof |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4852895A (en) | 1971-11-05 | 1973-07-25 | ||
JPS62119220A (en) * | 1985-11-18 | 1987-05-30 | Arakawa Chem Ind Co Ltd | Production of polyhydroxyl compound |
JPH0356526A (en) * | 1989-07-25 | 1991-03-12 | Denki Kagaku Kogyo Kk | Epoxy resin composition for sealing semiconductor |
JP3196141B2 (en) * | 1991-11-14 | 2001-08-06 | 東都化成株式会社 | Epoxy resin composition |
JP3146320B2 (en) | 1991-11-18 | 2001-03-12 | 東都化成株式会社 | Epoxy resin composition |
EP0549968A1 (en) * | 1991-12-20 | 1993-07-07 | Hoechst Aktiengesellschaft | Surface-active compounds based on modified oxalkylated novolaks, their preparation and their application |
JPH06128183A (en) * | 1992-02-27 | 1994-05-10 | Mitsui Toatsu Chem Inc | Method for simultaneous production of bisphenol f and novolak type phenolic resin |
JP3587570B2 (en) * | 1994-10-20 | 2004-11-10 | 三井化学株式会社 | Benzylated polyphenols, their epoxy resins, their production methods and uses |
JP3579800B2 (en) * | 1994-12-14 | 2004-10-20 | 東都化成株式会社 | Low dielectric epoxy resin composition |
JPH10158352A (en) * | 1996-11-28 | 1998-06-16 | Dainippon Ink & Chem Inc | Production of phenol resin |
JPH11140166A (en) | 1997-11-11 | 1999-05-25 | Shin Etsu Chem Co Ltd | Epoxy resin composition for semiconductor sealing and semiconductor device |
JP3349963B2 (en) | 1998-10-21 | 2002-11-25 | 日本電気株式会社 | Flame-retardant epoxy resin composition and semiconductor device using the same |
JP2000273280A (en) * | 1999-03-26 | 2000-10-03 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP4188022B2 (en) | 2002-07-30 | 2008-11-26 | 新日鐵化学株式会社 | Polyvalent hydroxy resin, epoxy resin, production method thereof, epoxy resin composition and cured product using them |
JP2004067968A (en) * | 2002-08-09 | 2004-03-04 | Sumitomo Bakelite Co Ltd | Resin composition, prepreg, and laminated plate |
JP2004323630A (en) * | 2003-04-23 | 2004-11-18 | Lignyte Co Ltd | Preparation method for phenol resin |
JP2005344081A (en) | 2004-06-07 | 2005-12-15 | Nippon Steel Chem Co Ltd | Epoxy resin composition and cured product thereof |
JP2008106219A (en) * | 2006-03-29 | 2008-05-08 | Sumitomo Bakelite Co Ltd | Method for producing phenol resin |
JP5228328B2 (en) * | 2007-02-01 | 2013-07-03 | 宇部興産株式会社 | Low melt viscosity phenol novolac resin, process for producing the same, and cured epoxy resin using the same |
JP5320130B2 (en) * | 2009-03-31 | 2013-10-23 | 新日鉄住金化学株式会社 | Polyvalent hydroxy resin, epoxy resin, production method thereof, epoxy resin composition and cured product thereof |
JP5462559B2 (en) * | 2009-09-08 | 2014-04-02 | 新日鉄住金化学株式会社 | Polyvalent hydroxy compounds, production method thereof, epoxy resin composition and cured product thereof |
JP5209660B2 (en) * | 2010-03-29 | 2013-06-12 | 新日鉄住金化学株式会社 | Polyvalent hydroxy resin, epoxy resin, production method thereof, epoxy resin composition and cured product using them |
-
2013
- 2013-02-21 MY MYPI2014702262A patent/MY169844A/en unknown
- 2013-02-21 KR KR1020147026281A patent/KR101987946B1/en active IP Right Grant
- 2013-02-21 CN CN201380010483.7A patent/CN104334597B/en active Active
- 2013-02-21 SG SG11201405075SA patent/SG11201405075SA/en unknown
- 2013-02-21 WO PCT/JP2013/054278 patent/WO2013125620A1/en active Application Filing
- 2013-02-21 JP JP2014500754A patent/JP6124865B2/en active Active
- 2013-02-22 TW TW102106199A patent/TWI548681B/en active
Also Published As
Publication number | Publication date |
---|---|
JP6124865B2 (en) | 2017-05-10 |
WO2013125620A1 (en) | 2013-08-29 |
KR101987946B1 (en) | 2019-06-11 |
TW201345958A (en) | 2013-11-16 |
CN104334597B (en) | 2016-06-22 |
KR20140129227A (en) | 2014-11-06 |
SG11201405075SA (en) | 2014-10-30 |
TWI548681B (en) | 2016-09-11 |
CN104334597A (en) | 2015-02-04 |
JPWO2013125620A1 (en) | 2015-07-30 |
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