MY169844A - Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof - Google Patents

Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof

Info

Publication number
MY169844A
MY169844A MYPI2014702262A MYPI2014702262A MY169844A MY 169844 A MY169844 A MY 169844A MY PI2014702262 A MYPI2014702262 A MY PI2014702262A MY PI2014702262 A MYPI2014702262 A MY PI2014702262A MY 169844 A MY169844 A MY 169844A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
polyvalent hydroxy
resin
composition
cured product
Prior art date
Application number
MYPI2014702262A
Inventor
Yamada Hisashi
Aoyagi Eijiro
Watanabe Keisuke
Okazaki Yutaka
Asakage Hideyasu
Original Assignee
Nippon Steel Chemical & Mat Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical & Mat Co Ltd filed Critical Nippon Steel Chemical & Mat Co Ltd
Publication of MY169844A publication Critical patent/MY169844A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)

Abstract

Provided are an epoxy resin, a polyvalent hydroxy resin, and a composition thereof, which are excellent in curability, provide a cured product excellent in mechanical strength, flame retardancy, moisture resistance, low elasticity, and the like, and are suitable for applications such as sealing of electrical and electronic parts, and circuit board materials. The polyvalent hydroxy resin is an aralkyl-modified polyvalent hydroxy resin, which is obtained by subjecting a narrowly dispersed polyvalent hydroxy compound including 15% or less of n=1 component and 50% or more of a total of n=2 and n=3 components and having an Mw/Mn of 1.2 or less to a reaction with an aralkylating agent such as a styrene. The epoxy epoxy resin is obtained by subjecting the aralkyl-modified polyvalent hydroxy resin to a reaction with epichlorohydrin. Further, the composition is an epoxy resin composition including the aralkyl-modified polyvalent hydroxy resin or the epoxy resin as an essential component.
MYPI2014702262A 2012-02-23 2013-02-21 Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof MY169844A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012037210 2012-02-23

Publications (1)

Publication Number Publication Date
MY169844A true MY169844A (en) 2019-05-17

Family

ID=49005798

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014702262A MY169844A (en) 2012-02-23 2013-02-21 Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof

Country Status (7)

Country Link
JP (1) JP6124865B2 (en)
KR (1) KR101987946B1 (en)
CN (1) CN104334597B (en)
MY (1) MY169844A (en)
SG (1) SG11201405075SA (en)
TW (1) TWI548681B (en)
WO (1) WO2013125620A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI595019B (en) * 2012-11-12 2017-08-11 Ｄｉｃ股份有限公司 Phenolic hydroxyl group-containing resin, epoxy resin, curable resin composition,cured product thereof and semiconductor encapsulating material
JP6406847B2 (en) * 2014-03-26 2018-10-17 新日鉄住金化学株式会社 Modified polyvalent hydroxy resin, epoxy resin, epoxy resin composition and cured product thereof
CN109071780B (en) * 2016-04-28 2022-04-08 昭和电工材料株式会社 Epoxy resin composition and electronic component device
JP7142233B2 (en) * 2017-12-14 2022-09-27 パナソニックＩｐマネジメント株式会社 EPOXY RESIN COMPOSITION FOR ENCAPSULATION, CURED PRODUCT AND SEMICONDUCTOR DEVICE
TWI751064B (en) * 2021-03-29 2021-12-21 長春人造樹脂廠股份有限公司 Polyhydric phenol resin, glycidyl ether of polyhydric phenol resin, and uses thereof

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JPS4852895A (en) 1971-11-05 1973-07-25
JPS62119220A (en) * 1985-11-18 1987-05-30 Arakawa Chem Ind Co Ltd Production of polyhydroxyl compound
JPH0356526A (en) * 1989-07-25 1991-03-12 Denki Kagaku Kogyo Kk Epoxy resin composition for sealing semiconductor
JP3196141B2 (en) * 1991-11-14 2001-08-06 東都化成株式会社 Epoxy resin composition
JP3146320B2 (en) 1991-11-18 2001-03-12 東都化成株式会社 Epoxy resin composition
EP0549968A1 (en) * 1991-12-20 1993-07-07 Hoechst Aktiengesellschaft Surface-active compounds based on modified oxalkylated novolaks, their preparation and their application
JPH06128183A (en) * 1992-02-27 1994-05-10 Mitsui Toatsu Chem Inc Method for simultaneous production of bisphenol f and novolak type phenolic resin
JP3587570B2 (en) * 1994-10-20 2004-11-10 三井化学株式会社 Benzylated polyphenols, their epoxy resins, their production methods and uses
JP3579800B2 (en) * 1994-12-14 2004-10-20 東都化成株式会社 Low dielectric epoxy resin composition
JPH10158352A (en) * 1996-11-28 1998-06-16 Dainippon Ink & Chem Inc Production of phenol resin
JPH11140166A (en) 1997-11-11 1999-05-25 Shin Etsu Chem Co Ltd Epoxy resin composition for semiconductor sealing and semiconductor device
JP3349963B2 (en) 1998-10-21 2002-11-25 日本電気株式会社 Flame-retardant epoxy resin composition and semiconductor device using the same
JP2000273280A (en) * 1999-03-26 2000-10-03 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP4188022B2 (en) 2002-07-30 2008-11-26 新日鐵化学株式会社 Polyvalent hydroxy resin, epoxy resin, production method thereof, epoxy resin composition and cured product using them
JP2004067968A (en) * 2002-08-09 2004-03-04 Sumitomo Bakelite Co Ltd Resin composition, prepreg, and laminated plate
JP2004323630A (en) * 2003-04-23 2004-11-18 Lignyte Co Ltd Preparation method for phenol resin
JP2005344081A (en) 2004-06-07 2005-12-15 Nippon Steel Chem Co Ltd Epoxy resin composition and cured product thereof
JP2008106219A (en) * 2006-03-29 2008-05-08 Sumitomo Bakelite Co Ltd Method for producing phenol resin
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JP5320130B2 (en) * 2009-03-31 2013-10-23 新日鉄住金化学株式会社 Polyvalent hydroxy resin, epoxy resin, production method thereof, epoxy resin composition and cured product thereof
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JP5209660B2 (en) * 2010-03-29 2013-06-12 新日鉄住金化学株式会社 Polyvalent hydroxy resin, epoxy resin, production method thereof, epoxy resin composition and cured product using them

Also Published As

Publication number Publication date
JP6124865B2 (en) 2017-05-10
WO2013125620A1 (en) 2013-08-29
KR101987946B1 (en) 2019-06-11
TW201345958A (en) 2013-11-16
CN104334597B (en) 2016-06-22
KR20140129227A (en) 2014-11-06
SG11201405075SA (en) 2014-10-30
TWI548681B (en) 2016-09-11
CN104334597A (en) 2015-02-04
JPWO2013125620A1 (en) 2015-07-30

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