MY151817A - Release film for semiconductor resin molds - Google Patents
Release film for semiconductor resin moldsInfo
- Publication number
- MY151817A MY151817A MYPI20090646A MY151817A MY 151817 A MY151817 A MY 151817A MY PI20090646 A MYPI20090646 A MY PI20090646A MY 151817 A MY151817 A MY 151817A
- Authority
- MY
- Malaysia
- Prior art keywords
- release film
- resin molds
- semiconductor resin
- release
- plastic support
- Prior art date
Links
- 239000011347 resin Substances 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 229920003023 plastic Polymers 0.000 abstract 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract 2
- 239000005977 Ethylene Substances 0.000 abstract 2
- 229920001577 copolymer Polymers 0.000 abstract 2
- 230000035699 permeability Effects 0.000 abstract 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 abstract 1
- 238000011109 contamination Methods 0.000 abstract 1
- 239000008096 xylene Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006223565 | 2006-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY151817A true MY151817A (en) | 2014-07-14 |
Family
ID=39082069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20090646 MY151817A (en) | 2006-08-18 | 2007-07-30 | Release film for semiconductor resin molds |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5110440B2 (ja) |
| KR (1) | KR101395520B1 (ja) |
| CN (1) | CN101506961B (ja) |
| MY (1) | MY151817A (ja) |
| TW (1) | TWI428226B (ja) |
| WO (1) | WO2008020543A1 (ja) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5476680B2 (ja) * | 2008-05-29 | 2014-04-23 | ダイキン工業株式会社 | 離型フィルム |
| SG172062A1 (en) * | 2009-01-08 | 2011-07-28 | Asahi Glass Co Ltd | Mold-releasing film and method for manufacturing light emitting diode |
| JP5297233B2 (ja) * | 2009-03-09 | 2013-09-25 | 三井化学株式会社 | 半導体封止プロセス用離型フィルム、およびそれを用いた樹脂封止半導体の製造方法 |
| WO2012077571A1 (ja) * | 2010-12-07 | 2012-06-14 | 東洋紡績株式会社 | モールド工程用離型ポリエステルフィルム |
| JP5541468B2 (ja) * | 2012-02-20 | 2014-07-09 | 信越ポリマー株式会社 | 離型用フィルム |
| JP5822811B2 (ja) * | 2012-09-26 | 2015-11-24 | 信越ポリマー株式会社 | 離型用フィルム |
| JP5822810B2 (ja) * | 2012-09-26 | 2015-11-24 | 信越ポリマー株式会社 | 離型用フィルム |
| JP2014179593A (ja) * | 2013-02-15 | 2014-09-25 | Nitto Denko Corp | 半導体素子用封止シート、半導体装置及び半導体装置の製造方法 |
| JP5792904B2 (ja) * | 2013-06-18 | 2015-10-14 | 積水化学工業株式会社 | 離型フィルム |
| KR101486052B1 (ko) * | 2013-07-03 | 2015-01-23 | 고병수 | 반도체 패키지 제조용 몰드 이형시트 및 제조방법 |
| CN104425290B (zh) * | 2013-08-27 | 2017-08-08 | 硕正科技股份有限公司 | 应用于晶圆封装的离形元件 |
| MY176541A (en) | 2013-11-07 | 2020-08-14 | Agc Inc | Mold release film and process for producing semiconductor package |
| WO2015068807A1 (ja) * | 2013-11-07 | 2015-05-14 | 旭硝子株式会社 | 離型フィルム、および半導体パッケージの製造方法 |
| SG11201607469SA (en) * | 2014-03-07 | 2016-10-28 | Asahi Glass Co Ltd | Mold release film and process for producing sealed body |
| SG11201702684XA (en) | 2014-11-20 | 2017-05-30 | Asahi Glass Co Ltd | Mold release film, process for its production, and process for producing semiconductor package |
| DE102015208980A1 (de) * | 2015-05-15 | 2016-11-17 | Infiana Germany Gmbh & Co. Kg | Eine evakuierbare Form für Faserverbundkunststoff-Bauteile |
| JP2019504783A (ja) * | 2016-02-01 | 2019-02-21 | スリーエム イノベイティブ プロパティズ カンパニー | バリア複合体 |
| JP6738672B2 (ja) * | 2016-07-04 | 2020-08-12 | 倉敷紡績株式会社 | 離型フィルムおよび半導体パッケージの製造方法 |
| CN106166863A (zh) * | 2016-08-11 | 2016-11-30 | 苏州柯创电子材料有限公司 | 耐高温复合离型膜 |
| JP6423399B2 (ja) * | 2016-09-27 | 2018-11-14 | アピックヤマダ株式会社 | 樹脂成形方法、フィルム搬送装置および樹脂成形装置 |
| WO2018173682A1 (ja) * | 2017-03-24 | 2018-09-27 | 住友ベークライト株式会社 | モールド成形用離型フィルム及びモールド成形方法 |
| WO2019235556A1 (ja) * | 2018-06-08 | 2019-12-12 | 倉敷紡績株式会社 | 離型フィルムおよび離型フィルム製造方法 |
| MX2020013660A (es) * | 2018-06-22 | 2021-03-02 | Kobayashi & Co Ltd | Pelicula de liberacion y metodo para fabricar la pelicula de liberacion. |
| JP6562532B1 (ja) * | 2018-06-22 | 2019-08-21 | 株式会社コバヤシ | 離型フィルム及び離型フィルムの製造方法 |
| US20210257228A1 (en) | 2018-06-22 | 2021-08-19 | Kobayashi & Co.,Ltd. | Release film and method of manufacturing release film |
| CN110718474B (zh) * | 2019-09-03 | 2022-08-16 | 富联裕展科技(深圳)有限公司 | 封装方法、离型件及其制作方法 |
| KR102226153B1 (ko) | 2019-11-18 | 2021-03-10 | 실리콘밸리(주) | 거칠기 조절이 가능한 반도체 몰드용 이형필름 및 그 제조방법 |
| JP7427480B2 (ja) | 2020-03-09 | 2024-02-05 | キオクシア株式会社 | 半導体装置 |
| KR102280585B1 (ko) * | 2021-01-15 | 2021-07-23 | 씰테크 주식회사 | 반도체 패키지용 이형 필름 및 그 제조 방법 |
| KR102559027B1 (ko) | 2021-07-02 | 2023-07-24 | (주)제론텍 | 반도체 에폭시 몰드 컴파운드 공정용 내열 세퍼레이터 필름 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001310336A (ja) * | 2000-04-28 | 2001-11-06 | Asahi Glass Co Ltd | 樹脂モールド成形用離型フィルム |
| JP2002361643A (ja) * | 2001-06-01 | 2002-12-18 | Hitachi Chem Co Ltd | 半導体モールド用離型シート |
| JP2004079566A (ja) * | 2002-08-09 | 2004-03-11 | Hitachi Chem Co Ltd | 半導体モールド用離型シート |
| JPWO2005115751A1 (ja) * | 2004-05-27 | 2008-03-27 | 三菱樹脂株式会社 | 離型用積層フィルム |
| JP2006049850A (ja) * | 2004-06-29 | 2006-02-16 | Asahi Glass Co Ltd | 半導体チップ封止用離型フィルム |
-
2007
- 2007-07-30 KR KR1020097000243A patent/KR101395520B1/ko active IP Right Grant
- 2007-07-30 WO PCT/JP2007/064915 patent/WO2008020543A1/ja active Application Filing
- 2007-07-30 CN CN2007800306458A patent/CN101506961B/zh active Active
- 2007-07-30 JP JP2008529841A patent/JP5110440B2/ja active Active
- 2007-07-30 MY MYPI20090646 patent/MY151817A/en unknown
- 2007-08-16 TW TW096130361A patent/TWI428226B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101506961A (zh) | 2009-08-12 |
| TW200815175A (en) | 2008-04-01 |
| TWI428226B (zh) | 2014-03-01 |
| CN101506961B (zh) | 2011-01-05 |
| JPWO2008020543A1 (ja) | 2010-01-07 |
| KR101395520B1 (ko) | 2014-05-14 |
| KR20090042898A (ko) | 2009-05-04 |
| WO2008020543A1 (fr) | 2008-02-21 |
| JP5110440B2 (ja) | 2012-12-26 |
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