MY118880A - Mounting structure for mounting electrical device with terminal pins on printed wiring board - Google Patents

Mounting structure for mounting electrical device with terminal pins on printed wiring board

Info

Publication number
MY118880A
MY118880A MYPI97002264A MYPI9702264A MY118880A MY 118880 A MY118880 A MY 118880A MY PI97002264 A MYPI97002264 A MY PI97002264A MY PI9702264 A MYPI9702264 A MY PI9702264A MY 118880 A MY118880 A MY 118880A
Authority
MY
Malaysia
Prior art keywords
wiring board
printed wiring
terminal pins
hole device
mounting
Prior art date
Application number
MYPI97002264A
Inventor
Hiroto Kinuyama
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of MY118880A publication Critical patent/MY118880A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10075—Non-printed oscillator
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

THE PRESENT INVENTION PROVIDES A MOUNTING STRUCTURE FOR MOUNTING A THROUGH-HOLE DEVICE HAVING TERMINAL PINS, CAPABLE OF AVOIDING THE BREAKAGE OF SOLDER JOINTS JOINING THE TERMINAL PINS TO A CONDUCTIVE PATTERN OF THE PRINTED WIRING BOARD EVEN IF THE AMBIENT TEMPERATURE VARIES IN A WIDE RANGE, AND OF BEING FABRICATED WITHOUT REQUIRING INCREASE IN COST AND MEMBER. A PROJECTION (3A) IS FORMED BY HALF-PUNCHING A PRINTED WIRING BOARD (3). WHEN MOUNTING A THROUGH-HOLE DEVICE (1) HAVING TERMINAL PINS (2) ON THE PRINTED WIRING BOARD (3), THE THROUGH-HOLE DEVICE (1) IS PUT ON THE PRINTED WIRING BOARD (3) WITH ITS BOTTOM SURFACE IN CONTACT WITH THE PROJECTION (3A), AND THEN THE TERMINAL PINS (2) ARE SOLDERED TO A CONDUCTIVE PATTERN FORMED ON THE PRINTED WIRING BOARD (34). SINCE A PREDETERMINED SPACE(G) IS FORMED BETWEEN THE BOTTOM SURFACE OF THE THROUGH-HOLE DEVICE (1) AND THE SURFACE OF THE PRINTED WIRING BOARD (3), MOLTEN FLUX WILL NOT BE CAUSED TO FLOW INTO THE JOINT OF THE BOTTOM SURFACE OF THE THROUGH-HOLE DEVICE (1) AND THE PROJECTION (3A) BY CAPILLARITY. SINCE THE CONTRACTION OF THE PRINTED WIRING BOARD (3) IS GREATER THAN THAT OF THE TERMINAL PINS (2) WHEN THE SOLDER SOLIDIFIES, A CLEARANCE IS FORMED BETWEEN THE BOTTOM SURFACE OF THE THROUGH-HOLE DEVICE (1) AND THE UPPER SURFACE OF THE PROJECTION (3A).(FIG. 1)
MYPI97002264A 1996-05-23 1997-05-23 Mounting structure for mounting electrical device with terminal pins on printed wiring board MY118880A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8128445A JPH09312449A (en) 1996-05-23 1996-05-23 Structure for mounting component with terminal

Publications (1)

Publication Number Publication Date
MY118880A true MY118880A (en) 2005-02-28

Family

ID=14984904

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI97002264A MY118880A (en) 1996-05-23 1997-05-23 Mounting structure for mounting electrical device with terminal pins on printed wiring board

Country Status (5)

Country Link
JP (1) JPH09312449A (en)
KR (1) KR100272806B1 (en)
CN (1) CN1088550C (en)
GB (1) GB2313489B (en)
MY (1) MY118880A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100421857C (en) * 2003-07-24 2008-10-01 台湾莫仕股份有限公司 Method for transplanting solder on electric terminal
DE102006013825A1 (en) * 2006-03-23 2007-09-27 Endress + Hauser Flowtec Ag Printed circuit board-panel for electronic device e.g. through hole-technology- device, has flexible device attachments protruding over surface of one of printed circuit boards and supporting electronic device in desired position
JP2016171132A (en) * 2015-03-11 2016-09-23 株式会社小糸製作所 Light source module
KR102236798B1 (en) * 2019-05-21 2021-04-06 조인셋 주식회사 Elastic electric connect terminal assembly

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6314473Y2 (en) * 1977-05-25 1988-04-22
JPH0715129A (en) * 1993-06-28 1995-01-17 Hitachi Ltd Mounting structure and mounting method of surface mount type semiconductor device

Also Published As

Publication number Publication date
GB2313489A (en) 1997-11-26
KR100272806B1 (en) 2001-04-02
GB2313489B (en) 2000-11-29
CN1088550C (en) 2002-07-31
JPH09312449A (en) 1997-12-02
GB9709850D0 (en) 1997-07-09
CN1168080A (en) 1997-12-17
KR970078793A (en) 1997-12-12

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