GB2313489B - Mounting structure for mounting an electrical device with terminal pins on a printed wiring board - Google Patents

Mounting structure for mounting an electrical device with terminal pins on a printed wiring board

Info

Publication number
GB2313489B
GB2313489B GB9709850A GB9709850A GB2313489B GB 2313489 B GB2313489 B GB 2313489B GB 9709850 A GB9709850 A GB 9709850A GB 9709850 A GB9709850 A GB 9709850A GB 2313489 B GB2313489 B GB 2313489B
Authority
GB
United Kingdom
Prior art keywords
wiring board
printed wiring
electrical device
terminal pins
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9709850A
Other versions
GB2313489A (en
GB9709850D0 (en
Inventor
Hiroto Kinuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of GB9709850D0 publication Critical patent/GB9709850D0/en
Publication of GB2313489A publication Critical patent/GB2313489A/en
Application granted granted Critical
Publication of GB2313489B publication Critical patent/GB2313489B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10075—Non-printed oscillator
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The present invention provides a mounting structure for mounting an electrical device having terminal pins, capable of avoiding the breakage of solder joints joining the terminal pins to a conductive pattern of the printed wiring board even if the ambient temperature varies in a wide range, and of being fabricated without requiring increase in cost and additional components. A projection (3a) is formed by half-punching a printed wiring board (3). When mounting an electrical device (1) having terminal pins (2) on the printed wiring board (3), the electrical device (1) is put on the printed wiring board (3) with its bottom surface in contact with the projection (3a), and then the terminal pins (2) are soldered to a conductive pattern formed on the printed wiring board (3). Since a predetermined space (G) is formed between the bottom surface of the electrical device (1) and the surface of the printed wiring board (3), molten flux will not be caused to flow into the joint of the bottom surface of the electrical device (l) and the projection (3a) by capillarity. Since the contraction of the printed wiring board (3) is greater than that of the terminal pins (2) when the solder solidifies, a clearance is formed between the bottom surface of the electrical device (1) and the upper surface of the projection (3a).
GB9709850A 1996-05-23 1997-05-16 Mounting structure for mounting an electrical device with terminal pins on a printed wiring board Expired - Fee Related GB2313489B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8128445A JPH09312449A (en) 1996-05-23 1996-05-23 Structure for mounting component with terminal

Publications (3)

Publication Number Publication Date
GB9709850D0 GB9709850D0 (en) 1997-07-09
GB2313489A GB2313489A (en) 1997-11-26
GB2313489B true GB2313489B (en) 2000-11-29

Family

ID=14984904

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9709850A Expired - Fee Related GB2313489B (en) 1996-05-23 1997-05-16 Mounting structure for mounting an electrical device with terminal pins on a printed wiring board

Country Status (5)

Country Link
JP (1) JPH09312449A (en)
KR (1) KR100272806B1 (en)
CN (1) CN1088550C (en)
GB (1) GB2313489B (en)
MY (1) MY118880A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100421857C (en) * 2003-07-24 2008-10-01 台湾莫仕股份有限公司 Method for transplanting solder on electric terminal
DE102006013825A1 (en) * 2006-03-23 2007-09-27 Endress + Hauser Flowtec Ag Printed circuit board-panel for electronic device e.g. through hole-technology- device, has flexible device attachments protruding over surface of one of printed circuit boards and supporting electronic device in desired position
JP2016171132A (en) * 2015-03-11 2016-09-23 株式会社小糸製作所 Light source module
KR102236798B1 (en) * 2019-05-21 2021-04-06 조인셋 주식회사 Elastic electric connect terminal assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4211890A (en) * 1977-05-25 1980-07-08 Shin-Etsu Polymer Co., Ltd. Electronic circuit boards

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715129A (en) * 1993-06-28 1995-01-17 Hitachi Ltd Mounting structure and mounting method of surface mount type semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4211890A (en) * 1977-05-25 1980-07-08 Shin-Etsu Polymer Co., Ltd. Electronic circuit boards

Also Published As

Publication number Publication date
KR100272806B1 (en) 2001-04-02
CN1088550C (en) 2002-07-31
JPH09312449A (en) 1997-12-02
KR970078793A (en) 1997-12-12
CN1168080A (en) 1997-12-17
GB2313489A (en) 1997-11-26
MY118880A (en) 2005-02-28
GB9709850D0 (en) 1997-07-09

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20060516