MX9709038A - Sistema y metodo de produccion de montajes de tableros de circuitos impresos. - Google Patents

Sistema y metodo de produccion de montajes de tableros de circuitos impresos.

Info

Publication number
MX9709038A
MX9709038A MX9709038A MX9709038A MX9709038A MX 9709038 A MX9709038 A MX 9709038A MX 9709038 A MX9709038 A MX 9709038A MX 9709038 A MX9709038 A MX 9709038A MX 9709038 A MX9709038 A MX 9709038A
Authority
MX
Mexico
Prior art keywords
printed circuit
parts
circuit board
circuit boards
production
Prior art date
Application number
MX9709038A
Other languages
English (en)
Inventor
Eon-Min Shin
Kyu-Dong Lee
Tae-Ha Kim
Doo-Won Kang
Bum-Suck Kim
Yang-Koog Kim
Seong-Deok Lee
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1019960057795A external-priority patent/KR100268663B1/ko
Priority claimed from KR1019960061342A external-priority patent/KR19980041644A/ko
Priority claimed from KR1019960060056A external-priority patent/KR100434457B1/ko
Priority claimed from KR1019960061340A external-priority patent/KR100424653B1/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of MX9709038A publication Critical patent/MX9709038A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work
    • Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53022—Means to assemble or disassemble with means to test work or product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Un metodo para producir un montaje de tablero de circuitos impresos; el cual se implementa en un sistema que tiene una computadora para almacenar los diagramas de instruccion de la insercion de las partes y exhibir las instrucciones de la insercion de las partes, y una unidad de soldadura para soldar un tablero de circuitos impresos, incluye los pasos de: montar diferenets tipos de tablero de circuitos impresos a partir de piezas de partes e inspeccionarlas en una multitud de celdas; instalar diferentes tipos de tablero de circuitos impresos en portadores para montarlos de manera separada de acuerdo a las instrucciones de insercion de las partes exhibidas por la computadora de cada celda, y moverlos a la unidad de soldadura a través de una línea de transportador de transferencia; y regresar los transportadores que tienen los tableros de circuitos impresos completamente soldados a cada celda identificada por los portadores a través de una línea del transportador de regreso.
MX9709038A 1996-11-25 1997-11-24 Sistema y metodo de produccion de montajes de tableros de circuitos impresos. MX9709038A (es)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1019960057795A KR100268663B1 (ko) 1996-11-25 1996-11-25 다기종 혼류 프린트 보드 어레이 생산 장치 및 그 방법
KR1019960061342A KR19980041644A (ko) 1996-11-29 1996-11-29 다양한 크기의 프린트 배선 회로용 기판장착이 가능한 캐리어
KR1019960060056A KR100434457B1 (ko) 1996-11-29 1996-11-29 다기종혼류프린트보드어셈블리생산시스템에서각종부품들을수납할수있는모판및그구동장치
KR1019960061340A KR100424653B1 (ko) 1996-11-29 1996-11-29 다기종 혼류 프린트 보드 어셈블리 생산시스템의 작업대

Publications (1)

Publication Number Publication Date
MX9709038A true MX9709038A (es) 1998-08-30

Family

ID=27483170

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9709038A MX9709038A (es) 1996-11-25 1997-11-24 Sistema y metodo de produccion de montajes de tableros de circuitos impresos.

Country Status (6)

Country Link
US (2) US6145190A (es)
JP (1) JP2919818B2 (es)
CN (1) CN1095315C (es)
DE (1) DE19752176B4 (es)
GB (1) GB2319661B (es)
MX (1) MX9709038A (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112453887A (zh) * 2020-10-27 2021-03-09 长沙格力暖通制冷设备有限公司 一种空调线控器的自动化生产***

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11224679A (ja) * 1998-02-06 1999-08-17 Matsushita Electric Ind Co Ltd 固体高分子型燃料電池及びその製造方法
JP3609315B2 (ja) * 2000-02-28 2005-01-12 富士通株式会社 プリント配線板の製造データ作成システム、及びプリント配線板の製造システム
US6556451B1 (en) * 2000-03-31 2003-04-29 Intel Corporation Adjustable guide mechanism for computer add in card retention
JP2001313493A (ja) * 2000-04-27 2001-11-09 Sony Corp 電子部品の実装システム
US6799714B2 (en) * 2003-03-06 2004-10-05 James Gleason Circuit board pallet with component arm
GB0307105D0 (en) * 2003-03-27 2003-04-30 Pillarhouse Int Ltd Soldering method and apparatus
US7191019B2 (en) * 2005-06-02 2007-03-13 Markem Corporation Dynamic line configuration
US7860600B2 (en) * 2006-02-09 2010-12-28 Panasonic Corporation Method of determining pickup order of components
US7578046B2 (en) * 2006-03-08 2009-08-25 Seagate Technology Llc Small form factor PCBA process carrier
KR100872577B1 (ko) * 2008-05-02 2008-12-08 박두환 자동 약 공급 및 투약시각 알림장치
US8140369B2 (en) * 2008-08-21 2012-03-20 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for optimizing manufacturing workforce
US8555784B2 (en) 2008-11-19 2013-10-15 Illinois Tool Works Inc. Method of processing electronic substrates using vertically separated pass through conveyor system
JP5201115B2 (ja) * 2009-10-08 2013-06-05 パナソニック株式会社 部品実装システム
JP5597050B2 (ja) * 2010-07-15 2014-10-01 富士機械製造株式会社 基板停止位置制御方法および装置、ならびに基板装着位置制御方法
US8141766B1 (en) * 2010-09-06 2012-03-27 Cheng Uei Precision Industry Co., Ltd. Automatic soldering system
US8281917B1 (en) * 2012-05-23 2012-10-09 Paradigm Circuit Solutions Inc. System and method to automate transport of electronic devices on an assembly line for testing
DE102012211810A1 (de) * 2012-07-06 2014-02-20 Siemens Aktiengesellschaft Bildung von Rüstfamilien auf Bestückungslinien
CN103009056A (zh) * 2012-12-05 2013-04-03 合肥天琪机电设备有限公司 电动燃油泵泵芯全自动装配生产线
DE202013102221U1 (de) 2013-05-22 2013-06-06 Göpel electronic GmbH AOI-System für Bauteil- und Lötstellenkontrolle von bestückten Leiterplatten
DE202013102447U1 (de) 2013-06-07 2014-09-08 Seho Systemtechnik Gmbh In Transportsystem integrierter Arbeitsplatz
JP6472805B2 (ja) * 2014-08-06 2019-02-20 株式会社Ｆｕｊｉ 対基板作業装置
CN104648519B (zh) * 2015-01-29 2017-12-05 广东利元亨智能装备有限公司 车载模块自动化生产线
US9674963B1 (en) * 2015-06-03 2017-06-06 Eric Sari Multilevel machine to process coatings
JP6412051B2 (ja) * 2016-04-18 2018-10-24 ファナック株式会社 プリント板の自動組み立ての歩留りを向上する自動組立システム及び自動組立方法
CN110214477B (zh) * 2017-01-31 2021-05-18 西门子股份公司 用于在装配线上优化产量地生产电路板的控制装置和方法
CN107263091A (zh) * 2017-09-11 2017-10-20 苏州市全力自动化科技有限公司 机器人pcb板异型元器件装配线及其生产工艺
CN108438881B (zh) * 2018-04-27 2023-07-25 广东溢达纺织有限公司 排花装筒装置
CN108961168B (zh) * 2018-07-27 2021-08-06 奔腾激光(温州)有限公司 一种激光加工现场图形显示方法
CN109732327A (zh) * 2019-03-11 2019-05-10 柳州万超汽车天窗有限公司 一种全景天窗的装配***
CN113478216B (zh) * 2021-06-30 2022-05-24 广东利元亨智能装备股份有限公司 一种消防栓按钮的生产线及生产工艺
CN113478238B (zh) * 2021-07-02 2022-07-12 深圳市瑞福自动化设备有限公司 一种3c主板全自动化精密组装测试生产线
CN113910347A (zh) * 2021-11-19 2022-01-11 港加贺电子（深圳）有限公司 一种分板机压板机构
CN115179038B (zh) * 2022-08-09 2023-10-24 东莞市本末科技有限公司 直驱电机的基座自动组装pcb板工艺
CN115255919B (zh) * 2022-08-09 2023-10-24 东莞市本末科技有限公司 直驱电机的控制板组装设备
CN116119299A (zh) * 2022-12-02 2023-05-16 南京熊猫电子制造有限公司 一种多功能转角传输机设备

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3421211A (en) * 1966-03-17 1969-01-14 Hewlett Packard Co Method of making and cleaning printed circuit assemblies
US3803556A (en) * 1971-05-11 1974-04-09 Conveyor Systems Conveyor control system
US4256296A (en) * 1980-02-25 1981-03-17 Scheinert Karol V Printed circuit board assembly fixture
JPS5834733A (ja) * 1981-08-25 1983-03-01 Mazda Motor Corp タイヤ組立ラインの制御方法
JPH0615140B2 (ja) * 1982-10-29 1994-03-02 株式会社日立製作所 生産処理システムにおける生産処理方法
US4667403A (en) * 1984-05-16 1987-05-26 Siemens Aktiengesellschaft Method for manufacturing electronic card modules
US4604704A (en) * 1984-09-10 1986-08-05 Doboy Packaging Machinery, Inc. High-speed microprocessor-controlled branch conveyor
US4731567A (en) * 1984-09-11 1988-03-15 The United States Of America As Represented By The Secretary Of The Air Force Method and apparatus for automated parts for storage and retrieval
JPH0668696B2 (ja) * 1985-02-22 1994-08-31 株式会社日立製作所 挿入機用ｎｃデータ作成方法
US4850104A (en) * 1985-10-28 1989-07-25 Cimm, Inc. System for configuring, automating and controlling operations performed on PCBS and other products
DE3540316A1 (de) * 1985-11-13 1987-05-14 Siemens Ag Fertigungsanlage zur automatischen montage und pruefung elektronischer flachbaugruppen
US4694570A (en) * 1985-11-21 1987-09-22 Amistar Corporation Surface mounted component transport mechanism
US4745004A (en) * 1987-01-08 1988-05-17 Schwerin Thomas E Method and apparatus for transporting circuit or other work units being processed
US4759488A (en) * 1987-02-09 1988-07-26 Northern Telecom Limited Circuit board carrier
US4821197A (en) * 1987-04-22 1989-04-11 Outboard Marine Corporation Apparatus and method for parts assembly
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
JPH07101791B2 (ja) * 1989-05-15 1995-11-01 富士通株式会社 プリント配線板への電子部品実装方法
US5268849A (en) * 1989-11-06 1993-12-07 Dunn-Edwards Corporation Process and apparatus for dispensing liquid colorants into a paint can, and quality control therefor
US5067648A (en) * 1990-07-27 1991-11-26 Lockheed Sanders, Inc. Apparatus for holding printed circuit boards during wave soldering and processing
US5086557A (en) * 1990-09-11 1992-02-11 Medeco Security Locks, Inc. Method of assembling electronic component systems
US5170554A (en) * 1990-09-28 1992-12-15 Hewlett-Packard Company High mix printed circuit assembly technique
WO1992017047A1 (fr) * 1991-03-18 1992-10-01 Fujitsu Limited Systeme et procede pour la production de cartes a circuits imprimes
JPH0673891A (ja) * 1992-08-24 1994-03-15 Mitsubishi Heavy Ind Ltd 物品自動搬送システム
FI930875A (fi) * 1992-10-29 1994-04-30 Pfu Ltd Maongsidigt produktionssystem
US5680696A (en) * 1994-09-13 1997-10-28 Axis Usa, Inc. Dynamo-electric machine component conveying systems with load/unload devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112453887A (zh) * 2020-10-27 2021-03-09 长沙格力暖通制冷设备有限公司 一种空调线控器的自动化生产***

Also Published As

Publication number Publication date
JPH10166231A (ja) 1998-06-23
JP2919818B2 (ja) 1999-07-19
US6295728B1 (en) 2001-10-02
GB9724834D0 (en) 1998-01-21
DE19752176B4 (de) 2007-01-25
CN1095315C (zh) 2002-11-27
GB2319661A (en) 1998-05-27
CN1199319A (zh) 1998-11-18
US6145190A (en) 2000-11-14
GB2319661B (en) 2001-06-13
DE19752176A1 (de) 1998-05-28

Similar Documents

Publication Publication Date Title
MX9709038A (es) Sistema y metodo de produccion de montajes de tableros de circuitos impresos.
ATE51339T1 (de) Fertigungskonzept fuer flachbaugruppen.
US8760886B2 (en) Lightweight audio system for automotive applications and method
GB2262495A (en) System for producing printed-wiring board unit and its producing method
CA2331265A1 (en) Method and apparatus for routing short messages
ES8502951A1 (es) Una maquina para realizar operaciones sobre material en forma de tira
HUP0003801A3 (en) Method for producing photovoltaic module as multilayer structure
HK33297A (en) High mix printed circuit assembly technique
DE3583760D1 (de) Einrichtung fuer die handbestueckung von leiterplatten.
HUT41407A (en) Process for producing 1-carba-/1-dethia/-cepheme-4-carboxylic acid derivatives
DE60027888D1 (de) Verfahren zum einbringen von zwischenverbindungen in regenerativen photovoltaischen photoelektrochemischen vielzellanordungen
DE69600201T2 (de) Aufnahmerahmen für elektronische Module
ATE207689T1 (de) Verfahren zur herstellung von abstandshaltern auf einer elektrischen leiterplatte
ATE386947T1 (de) Prüfsystem in einer leiterplatten- herstellungslinie für die automatisierte prüfung von leiterplatten
DE69420602T2 (de) Vakuumlastschalter, Elektrodenanordnung für Vakuumlastschalter und Verfahren zu dessen Herstellung
MY124018A (en) Manufacturing method of electrodeposited copper foil, electrodeposited copper foil, copper-clad laminate and printed wiring board
GB9904255D0 (en) A method for tracking printed circuit boards on multi-board panels through a production process
CN105025664A (zh) Pcba板的无板边插件方法
CN208977254U (zh) 一种真空助力器壳体固定托盘
CN101296606A (zh) Pcb实装方法
CN210806356U (zh) 一种快速拼装的配电柜
CN217846039U (zh) 一种用于芯片检测的目检工业相机检测***
CN216174389U (zh) 一种供电单元的自动检测装置
EP1112398B8 (de) Vorrichtung zum transportieren von geschirrelementen, insbesondere von lamellen
CN206077852U (zh) 一种汽车前灯印刷电路板拼板治具

Legal Events

Date Code Title Description
FG Grant or registration