MX163727B - Empaque para semiconductor y procedimiento para fabricarlo - Google Patents
Empaque para semiconductor y procedimiento para fabricarloInfo
- Publication number
- MX163727B MX163727B MX14407A MX1440788A MX163727B MX 163727 B MX163727 B MX 163727B MX 14407 A MX14407 A MX 14407A MX 1440788 A MX1440788 A MX 1440788A MX 163727 B MX163727 B MX 163727B
- Authority
- MX
- Mexico
- Prior art keywords
- leadframe
- copper
- metal
- polymer
- cap
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/140,859 US4888449A (en) | 1988-01-04 | 1988-01-04 | Semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
MX163727B true MX163727B (es) | 1992-06-17 |
Family
ID=22493123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX14407A MX163727B (es) | 1988-01-04 | 1988-12-30 | Empaque para semiconductor y procedimiento para fabricarlo |
Country Status (8)
Country | Link |
---|---|
US (1) | US4888449A (es) |
EP (1) | EP0400023A4 (es) |
JP (1) | JPH03502024A (es) |
KR (1) | KR900701038A (es) |
AU (1) | AU2926789A (es) |
CA (1) | CA1303251C (es) |
MX (1) | MX163727B (es) |
WO (1) | WO1989006442A1 (es) |
Families Citing this family (93)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5013871A (en) * | 1988-02-10 | 1991-05-07 | Olin Corporation | Kit for the assembly of a metal electronic package |
US5155299A (en) * | 1988-10-05 | 1992-10-13 | Olin Corporation | Aluminum alloy semiconductor packages |
US5205036A (en) * | 1988-10-17 | 1993-04-27 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device with selective coating on lead frame |
US5276351A (en) * | 1988-10-17 | 1994-01-04 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device and a manufacturing method for the same |
JP2647194B2 (ja) * | 1989-04-17 | 1997-08-27 | 住友電気工業株式会社 | 半導体用パッケージの封止方法 |
US5015803A (en) * | 1989-05-31 | 1991-05-14 | Olin Corporation | Thermal performance package for integrated circuit chip |
US5025114A (en) * | 1989-10-30 | 1991-06-18 | Olin Corporation | Multi-layer lead frames for integrated circuit packages |
US5073521A (en) * | 1989-11-15 | 1991-12-17 | Olin Corporation | Method for housing a tape-bonded electronic device and the package employed |
US5098864A (en) * | 1989-11-29 | 1992-03-24 | Olin Corporation | Process for manufacturing a metal pin grid array package |
US5278429A (en) * | 1989-12-19 | 1994-01-11 | Fujitsu Limited | Semiconductor device having improved adhesive structure and method of producing same |
JP3431139B2 (ja) * | 1990-05-31 | 2003-07-28 | 株式会社東芝 | リードフレームとその製造方法および半導体パッケージ |
US5043534A (en) * | 1990-07-02 | 1991-08-27 | Olin Corporation | Metal electronic package having improved resistance to electromagnetic interference |
GB9018764D0 (en) * | 1990-08-28 | 1990-10-10 | Lsi Logic Europ | Packaging of electronic devices |
US5122858A (en) * | 1990-09-10 | 1992-06-16 | Olin Corporation | Lead frame having polymer coated surface portions |
US5261157A (en) * | 1991-01-22 | 1993-11-16 | Olin Corporation | Assembly of electronic packages by vacuum lamination |
US5155579A (en) * | 1991-02-05 | 1992-10-13 | Advanced Micro Devices | Molded heat sink for integrated circuit package |
JPH04283953A (ja) * | 1991-03-12 | 1992-10-08 | Dainippon Printing Co Ltd | 半導体用リードフレーム材およびリードフレームの製造法 |
US5128008A (en) * | 1991-04-10 | 1992-07-07 | International Business Machines Corporation | Method of forming a microelectronic package having a copper substrate |
US5328870A (en) * | 1992-01-17 | 1994-07-12 | Amkor Electronics, Inc. | Method for forming plastic molded package with heat sink for integrated circuit devices |
US5343073A (en) * | 1992-01-17 | 1994-08-30 | Olin Corporation | Lead frames having a chromium and zinc alloy coating |
JPH06120374A (ja) * | 1992-03-31 | 1994-04-28 | Amkor Electron Inc | 半導体パッケージ構造、半導体パッケージ方法及び半導体パッケージ用放熱板 |
US5239131A (en) * | 1992-07-13 | 1993-08-24 | Olin Corporation | Electronic package having controlled epoxy flow |
US5367196A (en) * | 1992-09-17 | 1994-11-22 | Olin Corporation | Molded plastic semiconductor package including an aluminum alloy heat spreader |
TW238419B (es) * | 1992-08-21 | 1995-01-11 | Olin Corp | |
US5608267A (en) * | 1992-09-17 | 1997-03-04 | Olin Corporation | Molded plastic semiconductor package including heat spreader |
US5309321A (en) * | 1992-09-22 | 1994-05-03 | Microelectronics And Computer Technology Corporation | Thermally conductive screen mesh for encapsulated integrated circuit packages |
US5344795A (en) * | 1992-09-22 | 1994-09-06 | Microelectronics And Computer Technology Corporation | Method for encapsulating an integrated circuit using a removable heatsink support block |
US5265321A (en) * | 1992-09-22 | 1993-11-30 | Microelectronics And Computer Technology Corporation | Integrated circuit structure with heat exchanger elements secured thereto and method of making |
US5317107A (en) * | 1992-09-24 | 1994-05-31 | Motorola, Inc. | Shielded stripline configuration semiconductor device and method for making the same |
US5650592A (en) * | 1993-04-05 | 1997-07-22 | Olin Corporation | Graphite composites for electronic packaging |
US5880403A (en) | 1994-04-01 | 1999-03-09 | Space Electronics, Inc. | Radiation shielding of three dimensional multi-chip modules |
US6613978B2 (en) | 1993-06-18 | 2003-09-02 | Maxwell Technologies, Inc. | Radiation shielding of three dimensional multi-chip modules |
US5825042A (en) * | 1993-06-18 | 1998-10-20 | Space Electronics, Inc. | Radiation shielding of plastic integrated circuits |
US5580825A (en) * | 1993-09-20 | 1996-12-03 | International Technology Exchange Corp. | Process for making multilevel interconnections of electronic components |
US5540378A (en) * | 1993-09-27 | 1996-07-30 | Olin Corporation | Method for the assembly of an electronic package |
US5360942A (en) * | 1993-11-16 | 1994-11-01 | Olin Corporation | Multi-chip electronic package module utilizing an adhesive sheet |
US5728285A (en) * | 1993-12-27 | 1998-03-17 | National Semiconductor Corporation | Protective coating combination for lead frames |
US5578869A (en) * | 1994-03-29 | 1996-11-26 | Olin Corporation | Components for housing an integrated circuit device |
US6261508B1 (en) | 1994-04-01 | 2001-07-17 | Maxwell Electronic Components Group, Inc. | Method for making a shielding composition |
US6720493B1 (en) | 1994-04-01 | 2004-04-13 | Space Electronics, Inc. | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
US6455864B1 (en) | 1994-04-01 | 2002-09-24 | Maxwell Electronic Components Group, Inc. | Methods and compositions for ionizing radiation shielding |
AU2231795A (en) * | 1994-04-14 | 1995-11-10 | Olin Corporation | Electronic package having improved wire bonding capability |
US5701034A (en) * | 1994-05-03 | 1997-12-23 | Amkor Electronics, Inc. | Packaged semiconductor die including heat sink with locking feature |
US5969414A (en) * | 1994-05-25 | 1999-10-19 | Advanced Technology Interconnect Incorporated | Semiconductor package with molded plastic body |
US5436407A (en) * | 1994-06-13 | 1995-07-25 | Integrated Packaging Assembly Corporation | Metal semiconductor package with an external plastic seal |
US5454929A (en) * | 1994-06-16 | 1995-10-03 | National Semiconductor Corporation | Process for preparing solderable integrated circuit lead frames by plating with tin and palladium |
US5455387A (en) * | 1994-07-18 | 1995-10-03 | Olin Corporation | Semiconductor package with chip redistribution interposer |
JP3417079B2 (ja) * | 1994-08-31 | 2003-06-16 | ソニー株式会社 | 半導体装置の製造方法 |
US5573845A (en) * | 1994-12-09 | 1996-11-12 | Olin Corporation | Superficial coating layer having acicular structures for electrical conductors |
US5545850A (en) * | 1995-01-13 | 1996-08-13 | Olin Corporation | Guard ring for integrated circuit package |
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US5534356A (en) * | 1995-04-26 | 1996-07-09 | Olin Corporation | Anodized aluminum substrate having increased breakdown voltage |
JPH11509372A (ja) * | 1995-07-14 | 1999-08-17 | オリン コーポレイション | 金属ボール・グリッド電子パッケージ |
US5817544A (en) * | 1996-01-16 | 1998-10-06 | Olin Corporation | Enhanced wire-bondable leadframe |
US5805427A (en) * | 1996-02-14 | 1998-09-08 | Olin Corporation | Ball grid array electronic package standoff design |
DE19731424C1 (de) * | 1997-07-22 | 1998-08-13 | Daimler Benz Ag | Verfahren zum Einbetten von metallischen Leitern mikroelektronischer Bauelemente in eine Kunststoffmasse |
US5952083A (en) * | 1997-10-21 | 1999-09-14 | Advanced Technology Interconnect, Inc. | Aluminum alloys for electronic components |
JP2000003988A (ja) * | 1998-06-15 | 2000-01-07 | Sony Corp | リードフレームおよび半導体装置 |
FI106494B (fi) | 1998-11-05 | 2001-02-15 | Nokia Networks Oy | Kehystahdistusmekanismi |
US6369452B1 (en) * | 1999-07-27 | 2002-04-09 | International Business Machines Corporation | Cap attach surface modification for improved adhesion |
US6352935B1 (en) | 2000-01-18 | 2002-03-05 | Analog Devices, Inc. | Method of forming a cover cap for semiconductor wafer devices |
US6225684B1 (en) | 2000-02-29 | 2001-05-01 | Texas Instruments Tucson Corporation | Low temperature coefficient leadframe |
US6368899B1 (en) | 2000-03-08 | 2002-04-09 | Maxwell Electronic Components Group, Inc. | Electronic device packaging |
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US6876071B2 (en) * | 2001-06-30 | 2005-04-05 | Texas Instruments Incorporated | Masking layer in substrate cavity |
JP2003068965A (ja) * | 2001-08-30 | 2003-03-07 | Hitachi Ltd | 半導体装置 |
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JP3883543B2 (ja) * | 2003-04-16 | 2007-02-21 | 新光電気工業株式会社 | 導体基材及び半導体装置 |
JP3841768B2 (ja) * | 2003-05-22 | 2006-11-01 | 新光電気工業株式会社 | パッケージ部品及び半導体パッケージ |
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US7262491B2 (en) * | 2005-09-06 | 2007-08-28 | Advanced Interconnect Technologies Limited | Die pad for semiconductor packages and methods of making and using same |
JP2007287967A (ja) * | 2006-04-18 | 2007-11-01 | Shinko Electric Ind Co Ltd | 電子部品装置 |
CN101536180A (zh) * | 2006-11-15 | 2009-09-16 | 株式会社大真空 | 电子部件的封装体 |
US20090200359A1 (en) * | 2008-02-13 | 2009-08-13 | Gm Global Technology Operations, Inc. | Reducing sheet distortion in friction stir processing |
KR101466428B1 (ko) * | 2008-05-02 | 2014-11-28 | 히타치 긴조쿠 가부시키가이샤 | 기밀 봉지용 캡 |
WO2010085319A1 (en) | 2009-01-22 | 2010-07-29 | Aculon, Inc. | Lead frames with improved adhesion to plastic encapsulant |
US20100295160A1 (en) * | 2009-05-22 | 2010-11-25 | Advanced Semiconductor Engineering, Inc. | Quad flat package structure having exposed heat sink, electronic assembly and manufacturing methods thereof |
JP2011138968A (ja) * | 2009-12-28 | 2011-07-14 | Senju Metal Ind Co Ltd | 面実装部品のはんだ付け方法および面実装部品 |
TWM409527U (en) * | 2011-02-23 | 2011-08-11 | Azurewave Technologies Inc | Forming integrated circuit module |
US9111869B2 (en) * | 2011-07-29 | 2015-08-18 | Semtech Corporation | Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages |
US10636735B2 (en) * | 2011-10-14 | 2020-04-28 | Cyntec Co., Ltd. | Package structure and the method to fabricate thereof |
KR20130087249A (ko) * | 2012-01-27 | 2013-08-06 | 삼성전자주식회사 | 반도체 장치 및 이를 이용한 이미지 센서 패키지 |
JP2015056608A (ja) * | 2013-09-13 | 2015-03-23 | 株式会社東芝 | 半導体パッケージおよび半導体装置 |
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JP6852626B2 (ja) * | 2016-09-12 | 2021-03-31 | 株式会社デンソー | 半導体装置 |
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-
1988
- 1988-01-04 US US07/140,859 patent/US4888449A/en not_active Expired - Fee Related
- 1988-12-28 CA CA000587086A patent/CA1303251C/en not_active Expired - Fee Related
- 1988-12-30 MX MX14407A patent/MX163727B/es unknown
-
1989
- 1989-01-04 KR KR1019890701529A patent/KR900701038A/ko not_active Application Discontinuation
- 1989-01-04 WO PCT/US1989/000006 patent/WO1989006442A1/en not_active Application Discontinuation
- 1989-01-04 AU AU29267/89A patent/AU2926789A/en not_active Abandoned
- 1989-01-04 JP JP1501386A patent/JPH03502024A/ja active Pending
- 1989-01-04 EP EP19890901479 patent/EP0400023A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CA1303251C (en) | 1992-06-09 |
AU2926789A (en) | 1989-08-01 |
WO1989006442A1 (en) | 1989-07-13 |
EP0400023A4 (en) | 1993-06-09 |
JPH03502024A (ja) | 1991-05-09 |
KR900701038A (ko) | 1990-08-17 |
US4888449A (en) | 1989-12-19 |
EP0400023A1 (en) | 1990-12-05 |
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