KR970063393A - 기판처리장치 - Google Patents

기판처리장치 Download PDF

Info

Publication number
KR970063393A
KR970063393A KR1019970006071A KR19970006071A KR970063393A KR 970063393 A KR970063393 A KR 970063393A KR 1019970006071 A KR1019970006071 A KR 1019970006071A KR 19970006071 A KR19970006071 A KR 19970006071A KR 970063393 A KR970063393 A KR 970063393A
Authority
KR
South Korea
Prior art keywords
substrate
liquid
main surface
gap
liquid storage
Prior art date
Application number
KR1019970006071A
Other languages
English (en)
Korean (ko)
Inventor
미츠아키 요시타니
Original Assignee
이시다 아키라
다이니폰 스크린 세이조우 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이시다 아키라, 다이니폰 스크린 세이조우 가부시키가이샤 filed Critical 이시다 아키라
Publication of KR970063393A publication Critical patent/KR970063393A/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1019970006071A 1996-02-26 1997-02-26 기판처리장치 KR970063393A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8038374A JPH09225420A (ja) 1996-02-26 1996-02-26 基板処理装置
JP96-38374 1996-02-26

Publications (1)

Publication Number Publication Date
KR970063393A true KR970063393A (ko) 1997-09-12

Family

ID=12523517

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970006071A KR970063393A (ko) 1996-02-26 1997-02-26 기판처리장치

Country Status (2)

Country Link
JP (1) JPH09225420A (ja)
KR (1) KR970063393A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284310A (ja) * 2000-03-31 2001-10-12 Shibaura Mechatronics Corp 基板の処理装置及び処理方法
KR100803686B1 (ko) * 2006-12-28 2008-02-20 세메스 주식회사 기판 처리 장치
JP5640533B2 (ja) * 2010-08-03 2014-12-17 新日鐵住金株式会社 ガスブロー装置
CN107258636B (zh) * 2017-05-01 2020-12-22 山东金瓢食品机械股份有限公司 一种养殖笼清除装置
TWI821799B (zh) * 2020-12-28 2023-11-11 日商芝浦機械電子裝置股份有限公司 基板處理裝置

Also Published As

Publication number Publication date
JPH09225420A (ja) 1997-09-02

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application