KR970059825A - Fixing device for camera - Google Patents

Fixing device for camera Download PDF

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Publication number
KR970059825A
KR970059825A KR1019970002185A KR19970002185A KR970059825A KR 970059825 A KR970059825 A KR 970059825A KR 1019970002185 A KR1019970002185 A KR 1019970002185A KR 19970002185 A KR19970002185 A KR 19970002185A KR 970059825 A KR970059825 A KR 970059825A
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KR
South Korea
Prior art keywords
fixing
filter
groove
camera
guide
Prior art date
Application number
KR1019970002185A
Other languages
Korean (ko)
Inventor
안승균
Original Assignee
안승균
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Publication date
Application filed by 안승균 filed Critical 안승균
Priority to KR1019970002185A priority Critical patent/KR970059825A/en
Priority to JP9157222A priority patent/JPH1090753A/en
Publication of KR970059825A publication Critical patent/KR970059825A/en
Priority to AU41373/97A priority patent/AU4137397A/en
Priority to PCT/KR1997/000162 priority patent/WO1998010330A1/en
Priority to US08/921,912 priority patent/US5862428A/en
Priority to DE19802575A priority patent/DE19802575B4/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/006—Filter holders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B11/00—Filters or other obturators specially adapted for photographic purposes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structure And Mechanism Of Cameras (AREA)

Abstract

카메라의 액세서리 장착홈의 위치에 따라 선회 및 활주하며, 카메라의 액세서리 장착홈에 결합되는 고정판, 고정판에 활주 가능하게 결합되어 카메라의 렌즈의 길이의 변화에 따라 필터의 수평 위치를 조절하는 조정부, 그리고 조정부에 선회 가능하게 장착되어 필터를 수납하고 카메라 렌즈의 수직 위치에 따라 필터의 수직 위치를 조정하는 필터 고정부를 구비하는 카메라의 필터 고정 장치가 개시된다.Swivel and slide according to the position of the accessory mounting groove of the camera, the fixed plate coupled to the accessory mounting groove of the camera, coupled to the fixed plate slidably to adjust the horizontal position of the filter in accordance with the change in the lens length of the camera, and Disclosed is a filter fixing apparatus for a camera having a filter fixing portion rotatably mounted to an adjusting portion to receive a filter and to adjust the vertical position of the filter according to the vertical position of the camera lens.

카메라의 렌즈의 위치 및 액세서리 장착홈의 위치에 상관없이 필터를 이용하여 촬영할 수 있으며, 원형 필터는 물론이고 사각형 필터도 장착하여 사용할 수 있는 장점이 있다.Regardless of the position of the lens of the camera and the position of the accessory mounting groove can be photographed using the filter, there is an advantage that can be used by mounting a rectangular filter as well as a circular filter.

Description

카메라용 필터를 고정하는 장치Fixing device for camera

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제4도는 본 발명에 따른 카메라용 필터 고정 장치를 보여주는 사시도이고,4 is a perspective view showing a filter fixing device for a camera according to the present invention,

제5도는 제4도의 카메라의 필터 고정부와 고정부의 결합관계를 설명하기 위한 분해 사시도이며,FIG. 5 is an exploded perspective view for explaining a coupling relationship between the filter fixing part and the fixing part of the camera of FIG.

제6도는 제4도의 고정부와 조정부의 결합관계를 설명하기 위한 분해 사시도이며,6 is an exploded perspective view for explaining the coupling relationship between the fixing portion and the adjusting portion of FIG.

제7도는 액세서리 장착홈이 저면 일측에 형성되는 카메라에 본 발명의 실시예에 따른 카메라용 필터 고정 장치를 장착한 상태를 보여주는 사시도이며,7 is a perspective view showing a state in which a filter fixing device for a camera according to an embodiment of the present invention is mounted on a camera having an accessory mounting groove formed on one side of a bottom thereof,

제8도는 액세서리 장착홈이 전면 전방에 형성되는 카메라에 본 발명의 실시예에 따른 카메라용 필터 고정 장치를 장착한 상태를 보여주는8 is a view showing a state in which a filter fixing device for a camera according to an embodiment of the present invention is mounted on a camera in which an accessory mounting groove is formed at the front front.

Claims (6)

카메라 저면에 형성된 액세서리 장착홈에 장작되는 필터 고정장치에 있어서, 필터를 고정하며, 상기 필터의 위치를 상기 카메라의 렌즈의 수직 위치와 일치하도록 상기 필터의 수직 위치를 조정하는 필터 고정부; 상기 고정부가 선회 가능하게 연결되며, 카메라 저면에 형성된 액세서리 장착홈에 고정되는 고정부; 그리고 상기 고정부에 회전 및 활주 가능하게 장착되며 상기 카메라의 길이 및 상기 액세서리 장착홈의 위치에 따라 상기 고정부와 상기 필터 고정부의 위치를 조정하는 조정부를 포함하는 것을 특징으로 하는 카메라용 필터 고정 장치.A filter fixing device mounted to an accessory mounting groove formed on a bottom surface of a camera, the filter fixing device comprising: a filter fixing part which fixes a filter and adjusts the vertical position of the filter to match the vertical position of the lens of the camera; A fixing part rotatably connected to the fixing part and fixed to an accessory mounting groove formed on a bottom surface of the camera; And an adjusting part rotatably mounted and slidably mounted to the fixing part and adjusting the position of the fixing part and the filter fixing part according to the length of the camera and the position of the accessory mounting groove. Device. 제1항에 있어서, 상기 필터 고정부는 상기 고정부에 선회 가능하게 연결되며, 내측에 안내홈이 형성되고, 상기 안내홈 내벽에 래크가 형성되고 상기 안내홈 중심에 안내 돌기가 형성되는 선회 부재; 상기 안내 돌기가 삽입되는 안내 장공이 내측에 형성되며, 상기 래트와 결합되는 래치가 외별에 형성되는 안내 브라켓, 그리고 상기 안내 브라켓 상단에 연결되며 상기필터를 고정하는 고정 돌기가 형성되는 제1필터 고정 브라켓, 상기 제1필터 고정 브라켓과 저면에서 연결되며 상기 카메라 렌즈의 전면에 위치하는 환형형태의 제2필터 고정 브라켓을 구비하는 것을 특징으로 하는 카메라용 필터 고정 장치.According to claim 1, wherein the filter fixing portion is pivotally connected to the fixing portion, the guide groove is formed on the inside, the swing member is formed on the inner wall of the guide groove and the guide projection is formed in the center of the guide groove; A guide filter into which the guide protrusion is inserted is formed, and the first filter is fixed to a guide bracket having a latch coupled to the rat, and a fixing protrusion connected to an upper end of the guide bracket and fixing the filter. And a second filter fixing bracket having an annular shape, which is connected to the bracket and the bottom of the first filter fixing bracket and located in front of the camera lens. 제1항에 있어서, 상기 고정부는 상기 필터 고정부가 선회 가능하게 결합되는 힌지가 일측에 형성되며, 상면에 제1홈이 형성되고 내측에 제1장공이 형성되는 제1고정 부재; 상기 조정부에 의해 상기 제1고정 부재에 선회 및 회전가능하게 결합되며 내측에 제2장공이 형성되고 저면에 제2홈이 형성되고, 일측 상면에는 제3홈이 형성되며, 일측 저면에는 제4홈이 형성되며, 그리고 상기 제3 및 제4홈을 연결하는 관통공이 형성되는 제2고정부재; 그리고 상기 관통공에 회전가능하게 삽입되며 상기 제2고정 부재를 카메라에 장착시키는 고정 나사를 포함하는 것을 특징으로 하는 카메라용 필터 고정 장치.The method of claim 1, wherein the fixing unit is a hinge to which the filter fixing unit is pivotally coupled is formed on one side, the first fixing member is formed with a first groove in the upper surface and the first long hole in the inner side; The first fixing member is pivotally and rotatably coupled to the first fixing member, and a second long hole is formed on the inner side, a second groove is formed on the bottom surface, a third groove is formed on one side surface, and a fourth groove on one side surface. And a second fixing member having a through hole connecting the third and fourth grooves to be formed therein; And a fixing screw rotatably inserted into the through hole and for mounting the second fixing member to the camera. 제3항에 있어서, 상기 조정부는 상기 제1홈에 삽입되며 마찰 계수가 큰 재질로 제작되는 제1마찰부재; 상기 제2홈에 삽입되며 마찰 계수가 큰 재질로 제작되는 제2마찰 부재; 그리고 상기 제3홈에 삽입되며 마찰 계수가 큰 재질로 제작되는 제3마찰 부재를 추가로 포함하며, 상기 고정 나사가 상기 제4홈 내부로 상승할 때 상기 고정 나사의 저면의 높이는 상기 제1마칠 부재의 높이와 일치하며, 그리고 상기 제2고정 부재는 360°회전 가능한 것을 특징으로 하는 카메라용 필터 고정 장치.4. The apparatus of claim 3, wherein the adjusting part comprises: a first friction member inserted into the first groove and made of a material having a large friction coefficient; A second friction member inserted into the second groove and made of a material having a large friction coefficient; And a third friction member inserted into the third groove and made of a material having a large coefficient of friction, wherein the height of the bottom surface of the fixing screw is increased when the fixing screw rises into the fourth groove. And the second fixing member is rotatable 360 °. 제3항에 있어서, 상기 조정부는 상기 제1고정 부재의 상기 제1장공 및 상기 제2고정 부재의 상기 제2장공을 관통하여 결합되는 조정나사; 그리고 상기 제2고정 부재의 상면에 위치하며 상기 조정 나사와 결합되고, 상기 제2장공에 삽입되며 회전을 방지하는 멈춤 돌기가 저면 일측에 형성되는 조정 너트를 포함하는 것을 특징으로 하는 카메라용 필터 고정 장치.4. The screw of claim 3, wherein the adjustment unit comprises: an adjustment screw coupled through the first long hole of the first fixing member and the second long hole of the second fixing member; And an adjustment nut positioned on an upper surface of the second fixing member and coupled to the adjustment screw, and inserted into the second long hole, and a stop nut formed at one side of the bottom surface to prevent rotation. Device. 제5항에 있어서, 상기 조정너트는 상기 조정 나사의 하강을 방지하는 멈춤링을 추가로 구비하며, 상기 조정 너트는 마찰 계수가 큰 재질로 제작되는 제4마찰 부재가 삽입되는 제5홈에 상면에 형성되며 상기 제5홈에는 상기 멈춤링이 삽입되는 것을 특징으로 하는 카메라용 필터 고정 장치.According to claim 5, wherein the adjustment nut is further provided with a stop ring for preventing the falling of the adjustment screw, the adjustment nut is the upper surface in the fifth groove is inserted into the fourth friction member made of a material having a large coefficient of friction It is formed in the fifth groove is the filter filter device for a camera, characterized in that the stop ring is inserted. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019970002185A 1996-09-02 1997-01-25 Fixing device for camera KR970059825A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1019970002185A KR970059825A (en) 1997-01-25 1997-01-25 Fixing device for camera
JP9157222A JPH1090753A (en) 1996-09-02 1997-06-13 Device for attaching filter to camera
AU41373/97A AU4137397A (en) 1996-09-02 1997-09-01 Apparatus for detachably mounting a lens filter onto a camera
PCT/KR1997/000162 WO1998010330A1 (en) 1996-09-02 1997-09-01 Apparatus for detachably mounting a lens filter onto a camera
US08/921,912 US5862428A (en) 1996-09-02 1997-09-02 Apparatus for detachably mounting a lens filter onto a camera
DE19802575A DE19802575B4 (en) 1997-01-25 1998-01-23 A method of manufacturing a unit for a ball grid array semiconductor device and producing a ball grid array semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970002185A KR970059825A (en) 1997-01-25 1997-01-25 Fixing device for camera

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KR970059825A true KR970059825A (en) 1997-08-12

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DE (1) DE19802575B4 (en)

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* Cited by examiner, † Cited by third party
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JPS61222151A (en) * 1985-03-27 1986-10-02 Ibiden Co Ltd Manufacture of printed wiring substrate for mounting semiconductor
JPH01128532A (en) * 1987-11-13 1989-05-22 Hitachi Ltd Manufacture of semiconductor device
JP2852155B2 (en) * 1992-02-28 1999-01-27 九州日本電気株式会社 Lead frame for semiconductor device
JPH06132441A (en) * 1992-10-19 1994-05-13 Sony Corp Resin-sealed semiconductor device and manufacture thereof
US5583378A (en) * 1994-05-16 1996-12-10 Amkor Electronics, Inc. Ball grid array integrated circuit package with thermal conductor
JPH0864635A (en) * 1994-08-19 1996-03-08 Mitsui High Tec Inc Semiconductor device
JP3103281B2 (en) * 1994-11-11 2000-10-30 株式会社三井ハイテック Resin-sealed semiconductor device
US5717252A (en) * 1994-07-25 1998-02-10 Mitsui High-Tec, Inc. Solder-ball connected semiconductor device with a recessed chip mounting area
JPH0837204A (en) * 1994-07-25 1996-02-06 Mitsui High Tec Inc Semiconductor device and method of manufacturing semiconductor device
JP3093960B2 (en) * 1995-07-06 2000-10-03 株式会社三井ハイテック Method for manufacturing semiconductor circuit element mounting substrate frame

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DE19802575A1 (en) 1998-07-30

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