KR970052862U - Wafer transfer device for semiconductor device manufacturing facilities - Google Patents

Wafer transfer device for semiconductor device manufacturing facilities

Info

Publication number
KR970052862U
KR970052862U KR2019960003694U KR19960003694U KR970052862U KR 970052862 U KR970052862 U KR 970052862U KR 2019960003694 U KR2019960003694 U KR 2019960003694U KR 19960003694 U KR19960003694 U KR 19960003694U KR 970052862 U KR970052862 U KR 970052862U
Authority
KR
South Korea
Prior art keywords
wafer transfer
manufacturing facilities
semiconductor device
transfer device
device manufacturing
Prior art date
Application number
KR2019960003694U
Other languages
Korean (ko)
Other versions
KR200141577Y1 (en
Inventor
정우현
김태영
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR2019960003694U priority Critical patent/KR200141577Y1/en
Publication of KR970052862U publication Critical patent/KR970052862U/en
Application granted granted Critical
Publication of KR200141577Y1 publication Critical patent/KR200141577Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR2019960003694U 1996-02-29 1996-02-29 Wafer transfer apparatus KR200141577Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960003694U KR200141577Y1 (en) 1996-02-29 1996-02-29 Wafer transfer apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960003694U KR200141577Y1 (en) 1996-02-29 1996-02-29 Wafer transfer apparatus

Publications (2)

Publication Number Publication Date
KR970052862U true KR970052862U (en) 1997-09-08
KR200141577Y1 KR200141577Y1 (en) 1999-04-15

Family

ID=19451309

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960003694U KR200141577Y1 (en) 1996-02-29 1996-02-29 Wafer transfer apparatus

Country Status (1)

Country Link
KR (1) KR200141577Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024096663A1 (en) * 2022-11-04 2024-05-10 주식회사 에이치피에스피 High-pressure substrate processing apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100811108B1 (en) 2007-04-27 2008-03-06 세메스 주식회사 Robot for transferring a substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024096663A1 (en) * 2022-11-04 2024-05-10 주식회사 에이치피에스피 High-pressure substrate processing apparatus

Also Published As

Publication number Publication date
KR200141577Y1 (en) 1999-04-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20061128

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee