DE19781101D2 - Gripping device for wafers - Google Patents

Gripping device for wafers

Info

Publication number
DE19781101D2
DE19781101D2 DE19781101T DE19781101T DE19781101D2 DE 19781101 D2 DE19781101 D2 DE 19781101D2 DE 19781101 T DE19781101 T DE 19781101T DE 19781101 T DE19781101 T DE 19781101T DE 19781101 D2 DE19781101 D2 DE 19781101D2
Authority
DE
Germany
Prior art keywords
wafers
gripping device
gripping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19781101T
Other languages
German (de)
Inventor
Christian Balg
Bernhard Strasser
Jakob Blattner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brooks CCS RS AG
Original Assignee
Staeubli AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH02458/96A external-priority patent/CH697146A5/en
Application filed by Staeubli AG filed Critical Staeubli AG
Application granted granted Critical
Publication of DE19781101D2 publication Critical patent/DE19781101D2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE19781101T 1996-10-09 1997-10-08 Gripping device for wafers Expired - Fee Related DE19781101D2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH02458/96A CH697146A5 (en) 1996-10-09 1996-10-09 Gripping device for handling wafers.
US08/889,150 US6092971A (en) 1996-10-09 1997-07-07 Wafer gripping device adapted to swivel wafers taken from a horizontal position in a storage container
PCT/CH1997/000383 WO1998015971A1 (en) 1996-10-09 1997-10-08 Wafer gripping device

Publications (1)

Publication Number Publication Date
DE19781101D2 true DE19781101D2 (en) 1999-12-02

Family

ID=25690499

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19781101T Expired - Fee Related DE19781101D2 (en) 1996-10-09 1997-10-08 Gripping device for wafers

Country Status (4)

Country Link
KR (1) KR100521725B1 (en)
AU (1) AU4449197A (en)
DE (1) DE19781101D2 (en)
WO (1) WO1998015971A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH693726A5 (en) * 1998-07-09 2003-12-31 Tec Sem Ag Apparatus and method for providing a full wafer stack.
KR100564544B1 (en) * 1999-01-14 2006-03-28 삼성전자주식회사 Wafer loading boat
KR102620419B1 (en) 2021-09-03 2024-01-02 이현오 Insulation gripper for transporting semiconductor wafers

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2656599B1 (en) * 1989-12-29 1992-03-27 Commissariat Energie Atomique DEVICE FOR STORING FLAT OBJECTS IN A CASSETTE WITH INTERMEDIATE SHELVES.
US5615988A (en) * 1995-07-07 1997-04-01 Pri Automation, Inc. Wafer transfer system having rotational capability

Also Published As

Publication number Publication date
KR100521725B1 (en) 2005-10-17
WO1998015971A1 (en) 1998-04-16
AU4449197A (en) 1998-05-05
KR20000048997A (en) 2000-07-25

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: TEC-SEM AG, TAEGERWILEN, CH

8110 Request for examination paragraph 44
R016 Response to examination communication
R016 Response to examination communication
R016 Response to examination communication
R016 Response to examination communication
R002 Refusal decision in examination/registration proceedings
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R006 Appeal filed
R008 Case pending at federal patent court
R011 All appeals rejected, refused or otherwise settled