KR960028747A - 전기장치 - Google Patents

전기장치 Download PDF

Info

Publication number
KR960028747A
KR960028747A KR1019950072134A KR19950072134A KR960028747A KR 960028747 A KR960028747 A KR 960028747A KR 1019950072134 A KR1019950072134 A KR 1019950072134A KR 19950072134 A KR19950072134 A KR 19950072134A KR 960028747 A KR960028747 A KR 960028747A
Authority
KR
South Korea
Prior art keywords
circuit boards
connection
electrical
electrical device
heat dissipation
Prior art date
Application number
KR1019950072134A
Other languages
English (en)
Korean (ko)
Inventor
슈프 칼
야레스 페터
칼 디터
하르쉬 마르쿠스
Original Assignee
랄프 흘거 베렌스; 만프레드 크네취
로베르트 보쉬 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 랄프 흘거 베렌스; 만프레드 크네취, 로베르트 보쉬 게엠베하 filed Critical 랄프 흘거 베렌스; 만프레드 크네취
Publication of KR960028747A publication Critical patent/KR960028747A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Control Of Electric Motors In General (AREA)
KR1019950072134A 1994-12-24 1995-12-21 전기장치 KR960028747A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4446594.7 1994-12-24
DE4446594A DE4446594A1 (de) 1994-12-24 1994-12-24 Elektrisches Gerät

Publications (1)

Publication Number Publication Date
KR960028747A true KR960028747A (ko) 1996-07-22

Family

ID=6537118

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950072134A KR960028747A (ko) 1994-12-24 1995-12-21 전기장치

Country Status (5)

Country Link
JP (1) JPH08236893A (it)
KR (1) KR960028747A (it)
DE (1) DE4446594A1 (it)
GB (1) GB2296604A (it)
IT (2) IT1282804B1 (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100441568B1 (ko) * 2001-11-16 2004-07-23 한스타 디스플레이 코퍼레이션 열소산 구조물

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2119276C1 (ru) * 1997-11-03 1998-09-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный гибкий электронный модуль
DE29819349U1 (de) * 1998-10-30 1999-12-09 Siemens Ag Halbleiter-Schaltungsanordnung, insbesondere Hochstromumrichter mit niedriger Zwischenkreisspannung
JP4556174B2 (ja) * 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法
TWI357802B (en) * 2008-08-07 2012-02-01 Arcadyan Technology Corp Fixing cooling unit and electronic device having f
EP2180774B1 (en) * 2008-10-21 2013-08-07 Moxa Inc. Heat-dissipating structure for expansion board architecture
JP5161192B2 (ja) * 2009-11-06 2013-03-13 三菱電機株式会社 パワー回路配線構造
JP5652453B2 (ja) * 2012-09-28 2015-01-14 株式会社村田製作所 複合モジュールおよびこれを備えた電子機器
JP5765357B2 (ja) * 2013-03-22 2015-08-19 カシオ計算機株式会社 回路基板構造、及び電子機器
JP7072387B2 (ja) * 2018-01-11 2022-05-20 長野日本無線株式会社 基板連結装置及び基板連結方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1081526A (en) * 1965-05-17 1967-08-31 Standard Telephones Cables Ltd Housing assembly for circuit boards
GB1604368A (en) * 1978-05-31 1981-12-09 Ard Tech Ass Eng Printed circuit board support system
GB2137422B (en) * 1983-03-30 1986-10-29 Ferranti Plc Printed circuit board
GB2192758B (en) * 1986-07-18 1990-03-28 Anamartic Ltd A modular high-density packaging scheme for wsi components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100441568B1 (ko) * 2001-11-16 2004-07-23 한스타 디스플레이 코퍼레이션 열소산 구조물

Also Published As

Publication number Publication date
ITMI952531A0 (it) 1995-12-01
GB9526253D0 (en) 1996-02-21
GB2296604A (en) 1996-07-03
ITMI952531A3 (it) 1996-06-24
ITMI950829V0 (it) 1995-12-01
ITMI952531A1 (it) 1997-06-01
DE4446594A1 (de) 1996-06-27
IT1282804B1 (it) 1998-03-31
JPH08236893A (ja) 1996-09-13
ITMI950829U3 (it) 1997-06-02

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Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid