KR950020786A - 내연기관용 점화장치 - Google Patents
내연기관용 점화장치 Download PDFInfo
- Publication number
- KR950020786A KR950020786A KR1019940033023A KR19940033023A KR950020786A KR 950020786 A KR950020786 A KR 950020786A KR 1019940033023 A KR1019940033023 A KR 1019940033023A KR 19940033023 A KR19940033023 A KR 19940033023A KR 950020786 A KR950020786 A KR 950020786A
- Authority
- KR
- South Korea
- Prior art keywords
- solder
- combustion engine
- internal combustion
- ignition device
- engine according
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
- F02P3/00—Other installations
- F02P3/02—Other installations having inductive energy storage, e.g. arrangements of induction coils
- F02P3/04—Layout of circuits
- F02P3/055—Layout of circuits with protective means to prevent damage to the circuit, e.g. semiconductor devices or the ignition coil
- F02P3/0552—Opening or closing the primary coil circuit with semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F30/00—Fixed transformers not covered by group H01F19/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Ignition Installations For Internal Combustion Engines (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
본 발명은 땜납접합부의 신뢰성이 높은 내연기관용 점화장치를 제공하는 것을 목적으로 하고 있고, 그 특징은 몰드케이스에 일체로 성형되는 외부입출력용단자를 가지는 몰드케이스 및 스위칭용 반도체소자, 제어용회로기판 및 히트싱크로 이루어지고, 히트싱크상에 단수에서 복수의 스위칭용 반도체소자를 베릴리아를 전기절연판으로써 이용하는 적층구조를 가지도록한 것에 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일실시예를 나타내는 도,
제6도는 본 발명의 다른 실시예를 나타내는 도.
Claims (5)
- 외부입출력용 단자가 일체로 성형된 몰드케이스와, 상기 몰드케이스내에 설치되어 금속의 히트싱크상에 전기절연판을 거쳐 형성된 스위칭용 반도체소자를 구비한 내연기관용 점화장치에 있어서, 상기 전기절연판으로서 베릴리아를 이용하는 것과 함께 상기 반도체소자와 상기 전기절연판을 제1 땜납으로 접합하고, 상기 전기 절연판과 상기 히트싱크를 제2 땜납으로 접합한 것을 특징으로 하는 내연기관용 점화장치.
- 제1항에 있어서, 상기 제1 땜납은 상기 제2 땜납의 땜납보다 고융점의 땜납인 것을 특징으로 하는 내연기관용 점화장치.
- 제1항에 있어서, 상기 제1 땜납은 상기 제2 땜납의 땜납의 두께를 각각 0.05mm~0.2mm으로 한 것을 특징으로 하는 내연기관용 점화장치.
- 제1항에 있어서, 상기 제1 땜납에 Pb:Sn=90:10계열 땜납을 이용하고, 그 두께를 0.05mm 이상으로 한 것을 특징으로 하는 내연기관용 점화장치.
- 제1항에 있어서, 상기 입출력용단자와 상기 전기절연판상에 있어서의 상기 반도체소자와의 전기접속은 금속패드를 거쳐 행하는 것을 특징으로 하는 내연기관용 점화장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP93-331048 | 1993-12-27 | ||
JP33104893 | 1993-12-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950020786A true KR950020786A (ko) | 1995-07-24 |
KR100322177B1 KR100322177B1 (ko) | 2002-05-13 |
Family
ID=18239266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940033023A KR100322177B1 (ko) | 1993-12-27 | 1994-12-07 | 내연기관용점화장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6590774B2 (ko) |
EP (1) | EP0659998A3 (ko) |
KR (1) | KR100322177B1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005016830A1 (de) * | 2004-04-14 | 2005-11-03 | Denso Corp., Kariya | Halbleitervorrichtung und Verfahren zu ihrer Herstellung |
US6882259B1 (en) | 2004-05-05 | 2005-04-19 | Visteon Global Technologies, Inc. | Using a circuit board for ignition coil internal connections |
JP2006353067A (ja) * | 2005-06-20 | 2006-12-28 | Asmo Co Ltd | モータの制御回路装置及びその製造方法、並びにモータの制御回路装置を備えたモータ |
WO2009149153A2 (en) * | 2008-06-03 | 2009-12-10 | Reactive Nanotechnologies, Inc. | Ignition of reactive multilayer foils in microelectronics assemblies |
US8269248B2 (en) * | 2009-03-02 | 2012-09-18 | Thompson Joseph B | Light emitting assemblies and portions thereof |
CN105114230A (zh) * | 2015-08-21 | 2015-12-02 | 海盐县爱建汽车电器有限责任公司 | 一种新型车用点火模块 |
US11319917B2 (en) * | 2019-06-14 | 2022-05-03 | Denso International America, Inc. | Ignition coil and ignition system for a vehicle |
JP7388912B2 (ja) * | 2019-12-23 | 2023-11-29 | ダイヤゼブラ電機株式会社 | イグナイタ |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3492545A (en) | 1968-03-18 | 1970-01-27 | Westinghouse Electric Corp | Electrically and thermally conductive malleable layer embodying lead foil |
DE2530157A1 (de) | 1975-07-05 | 1977-02-03 | Bosch Gmbh Robert | Elektronisches steuergeraet |
US4034468A (en) | 1976-09-03 | 1977-07-12 | Ibm Corporation | Method for making conduction-cooled circuit package |
US4278990A (en) | 1979-03-19 | 1981-07-14 | General Electric Company | Low thermal resistance, low stress semiconductor package |
JPS5787139A (en) | 1980-11-19 | 1982-05-31 | Hitachi Ltd | Semiconductor device |
JPS5893358A (ja) | 1981-11-30 | 1983-06-03 | Mitsubishi Electric Corp | 半導体装置 |
US4554575A (en) * | 1983-05-12 | 1985-11-19 | Westinghouse Electric Corp. | Low stress leadless chip carrier and method of assembly |
US4557225A (en) | 1984-01-18 | 1985-12-10 | Mikuni Kogyo Kabushiki Kaisha | Combined housing and heat sink for electronic engine control system components |
DE3837975A1 (de) | 1988-11-09 | 1990-05-10 | Telefunken Electronic Gmbh | Elektronisches steuergeraet |
JP2609724B2 (ja) * | 1989-06-28 | 1997-05-14 | 株式会社日立製作所 | 半導体装置 |
US5182628A (en) * | 1989-06-28 | 1993-01-26 | Hitachi, Ltd. | Semiconductor device having particular solder interconnection arrangement |
JP2777464B2 (ja) | 1990-07-18 | 1998-07-16 | 株式会社日立製作所 | 電子装置と、これを用いたエンジンの点火装置 |
US5075965A (en) | 1990-11-05 | 1991-12-31 | International Business Machines | Low temperature controlled collapse chip attach process |
US5272375A (en) | 1991-12-26 | 1993-12-21 | E. I. Du Pont De Nemours And Company | Electronic assembly with optimum heat dissipation |
KR940023325A (ko) * | 1993-03-11 | 1994-10-22 | 토모마쯔 켕고 | 땜납층을 프리코팅해서 사용되는 회로기판 및 땜납층이 프리코팅된 회로기판 |
JP2912991B2 (ja) * | 1993-08-13 | 1999-06-28 | 株式会社日立製作所 | 電子配電式点火装置及びその製造方法 |
-
1994
- 1994-12-07 KR KR1019940033023A patent/KR100322177B1/ko not_active IP Right Cessation
- 1994-12-21 EP EP94120264A patent/EP0659998A3/en not_active Withdrawn
-
1999
- 1999-11-10 US US09/437,662 patent/US6590774B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0659998A3 (en) | 1996-05-15 |
EP0659998A2 (en) | 1995-06-28 |
KR100322177B1 (ko) | 2002-05-13 |
US6590774B2 (en) | 2003-07-08 |
US20020012230A1 (en) | 2002-01-31 |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20090105 Year of fee payment: 8 |
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LAPS | Lapse due to unpaid annual fee |