KR950020786A - 내연기관용 점화장치 - Google Patents

내연기관용 점화장치 Download PDF

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Publication number
KR950020786A
KR950020786A KR1019940033023A KR19940033023A KR950020786A KR 950020786 A KR950020786 A KR 950020786A KR 1019940033023 A KR1019940033023 A KR 1019940033023A KR 19940033023 A KR19940033023 A KR 19940033023A KR 950020786 A KR950020786 A KR 950020786A
Authority
KR
South Korea
Prior art keywords
solder
combustion engine
internal combustion
ignition device
engine according
Prior art date
Application number
KR1019940033023A
Other languages
English (en)
Other versions
KR100322177B1 (ko
Inventor
히데또시 오오이시
노보루 스기우라
겐이찌 가따기시
Original Assignee
가나이 쯔도무
가부시끼 가이샤 히다찌 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가나이 쯔도무, 가부시끼 가이샤 히다찌 세이사꾸쇼 filed Critical 가나이 쯔도무
Publication of KR950020786A publication Critical patent/KR950020786A/ko
Application granted granted Critical
Publication of KR100322177B1 publication Critical patent/KR100322177B1/ko

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
    • F02P3/00—Other installations
    • F02P3/02—Other installations having inductive energy storage, e.g. arrangements of induction coils
    • F02P3/04—Layout of circuits
    • F02P3/055—Layout of circuits with protective means to prevent damage to the circuit, e.g. semiconductor devices or the ignition coil
    • F02P3/0552—Opening or closing the primary coil circuit with semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00—Fixed transformers not covered by group H01F19/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

본 발명은 땜납접합부의 신뢰성이 높은 내연기관용 점화장치를 제공하는 것을 목적으로 하고 있고, 그 특징은 몰드케이스에 일체로 성형되는 외부입출력용단자를 가지는 몰드케이스 및 스위칭용 반도체소자, 제어용회로기판 및 히트싱크로 이루어지고, 히트싱크상에 단수에서 복수의 스위칭용 반도체소자를 베릴리아를 전기절연판으로써 이용하는 적층구조를 가지도록한 것에 있다.

Description

내연기관용 점화장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일실시예를 나타내는 도,
제6도는 본 발명의 다른 실시예를 나타내는 도.

Claims (5)

  1. 외부입출력용 단자가 일체로 성형된 몰드케이스와, 상기 몰드케이스내에 설치되어 금속의 히트싱크상에 전기절연판을 거쳐 형성된 스위칭용 반도체소자를 구비한 내연기관용 점화장치에 있어서, 상기 전기절연판으로서 베릴리아를 이용하는 것과 함께 상기 반도체소자와 상기 전기절연판을 제1 땜납으로 접합하고, 상기 전기 절연판과 상기 히트싱크를 제2 땜납으로 접합한 것을 특징으로 하는 내연기관용 점화장치.
  2. 제1항에 있어서, 상기 제1 땜납은 상기 제2 땜납의 땜납보다 고융점의 땜납인 것을 특징으로 하는 내연기관용 점화장치.
  3. 제1항에 있어서, 상기 제1 땜납은 상기 제2 땜납의 땜납의 두께를 각각 0.05mm~0.2mm으로 한 것을 특징으로 하는 내연기관용 점화장치.
  4. 제1항에 있어서, 상기 제1 땜납에 Pb:Sn=90:10계열 땜납을 이용하고, 그 두께를 0.05mm 이상으로 한 것을 특징으로 하는 내연기관용 점화장치.
  5. 제1항에 있어서, 상기 입출력용단자와 상기 전기절연판상에 있어서의 상기 반도체소자와의 전기접속은 금속패드를 거쳐 행하는 것을 특징으로 하는 내연기관용 점화장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940033023A 1993-12-27 1994-12-07 내연기관용점화장치 KR100322177B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP93-331048 1993-12-27
JP33104893 1993-12-27

Publications (2)

Publication Number Publication Date
KR950020786A true KR950020786A (ko) 1995-07-24
KR100322177B1 KR100322177B1 (ko) 2002-05-13

Family

ID=18239266

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940033023A KR100322177B1 (ko) 1993-12-27 1994-12-07 내연기관용점화장치

Country Status (3)

Country Link
US (1) US6590774B2 (ko)
EP (1) EP0659998A3 (ko)
KR (1) KR100322177B1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005016830A1 (de) * 2004-04-14 2005-11-03 Denso Corp., Kariya Halbleitervorrichtung und Verfahren zu ihrer Herstellung
US6882259B1 (en) 2004-05-05 2005-04-19 Visteon Global Technologies, Inc. Using a circuit board for ignition coil internal connections
JP2006353067A (ja) * 2005-06-20 2006-12-28 Asmo Co Ltd モータの制御回路装置及びその製造方法、並びにモータの制御回路装置を備えたモータ
WO2009149153A2 (en) * 2008-06-03 2009-12-10 Reactive Nanotechnologies, Inc. Ignition of reactive multilayer foils in microelectronics assemblies
US8269248B2 (en) * 2009-03-02 2012-09-18 Thompson Joseph B Light emitting assemblies and portions thereof
CN105114230A (zh) * 2015-08-21 2015-12-02 海盐县爱建汽车电器有限责任公司 一种新型车用点火模块
US11319917B2 (en) * 2019-06-14 2022-05-03 Denso International America, Inc. Ignition coil and ignition system for a vehicle
JP7388912B2 (ja) * 2019-12-23 2023-11-29 ダイヤゼブラ電機株式会社 イグナイタ

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US3492545A (en) 1968-03-18 1970-01-27 Westinghouse Electric Corp Electrically and thermally conductive malleable layer embodying lead foil
DE2530157A1 (de) 1975-07-05 1977-02-03 Bosch Gmbh Robert Elektronisches steuergeraet
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JPS5893358A (ja) 1981-11-30 1983-06-03 Mitsubishi Electric Corp 半導体装置
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JP2777464B2 (ja) 1990-07-18 1998-07-16 株式会社日立製作所 電子装置と、これを用いたエンジンの点火装置
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Also Published As

Publication number Publication date
EP0659998A3 (en) 1996-05-15
EP0659998A2 (en) 1995-06-28
KR100322177B1 (ko) 2002-05-13
US6590774B2 (en) 2003-07-08
US20020012230A1 (en) 2002-01-31

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