ATE230554T1 - Elektrisches bauteil und elektrischer schaltungsmodul mit verbundenen erdungsflächen - Google Patents

Elektrisches bauteil und elektrischer schaltungsmodul mit verbundenen erdungsflächen

Info

Publication number
ATE230554T1
ATE230554T1 AT99955900T AT99955900T ATE230554T1 AT E230554 T1 ATE230554 T1 AT E230554T1 AT 99955900 T AT99955900 T AT 99955900T AT 99955900 T AT99955900 T AT 99955900T AT E230554 T1 ATE230554 T1 AT E230554T1
Authority
AT
Austria
Prior art keywords
circuit module
ground plane
component
ground
projections
Prior art date
Application number
AT99955900T
Other languages
English (en)
Inventor
Walter Kodim
Frank Baeuerlein
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Application granted granted Critical
Publication of ATE230554T1 publication Critical patent/ATE230554T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Waveguide Aerials (AREA)
  • Structure Of Printed Boards (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Transmitters (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Microwave Amplifiers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Multi-Conductor Connections (AREA)
  • Details Of Aerials (AREA)
  • Combinations Of Printed Boards (AREA)
AT99955900T 1998-11-04 1999-10-28 Elektrisches bauteil und elektrischer schaltungsmodul mit verbundenen erdungsflächen ATE230554T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP98120664A EP0999728A1 (de) 1998-11-04 1998-11-04 Elektrisches Bauelement und elektrisches Schaltungsmodul mit verbundenen Erdungsflächen
PCT/EP1999/008199 WO2000027174A1 (en) 1998-11-04 1999-10-28 An electrical component and an electrical circuit module having connected ground planes

Publications (1)

Publication Number Publication Date
ATE230554T1 true ATE230554T1 (de) 2003-01-15

Family

ID=8232895

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99955900T ATE230554T1 (de) 1998-11-04 1999-10-28 Elektrisches bauteil und elektrischer schaltungsmodul mit verbundenen erdungsflächen

Country Status (13)

Country Link
US (1) US6281844B1 (de)
EP (2) EP0999728A1 (de)
JP (1) JP2002529920A (de)
KR (1) KR100609204B1 (de)
CN (1) CN1231104C (de)
AT (1) ATE230554T1 (de)
AU (1) AU755237B2 (de)
BR (1) BR9915089A (de)
DE (1) DE69904750T2 (de)
HK (1) HK1042200B (de)
IL (1) IL142511A (de)
PL (1) PL347504A1 (de)
WO (1) WO2000027174A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6369766B1 (en) * 1999-12-14 2002-04-09 Ems Technologies, Inc. Omnidirectional antenna utilizing an asymmetrical bicone as a passive feed for a radiating element
US6611237B2 (en) 2000-11-30 2003-08-26 The Regents Of The University Of California Fluidic self-assembly of active antenna
JP2003204209A (ja) * 2002-01-07 2003-07-18 Kyocera Corp 高周波用配線基板
JP2005109602A (ja) * 2003-09-29 2005-04-21 Mitsumi Electric Co Ltd アンテナ装置
US7193567B1 (en) * 2005-10-28 2007-03-20 The United States Of America As Represented By The Secretary Of The Navy TM microstrip antenna with GPS frequency coverage
US7333068B2 (en) * 2005-11-15 2008-02-19 Clearone Communications, Inc. Planar anti-reflective interference antennas with extra-planar element extensions
US7446714B2 (en) * 2005-11-15 2008-11-04 Clearone Communications, Inc. Anti-reflective interference antennas with radially-oriented elements
US7480502B2 (en) * 2005-11-15 2009-01-20 Clearone Communications, Inc. Wireless communications device with reflective interference immunity
US7741915B2 (en) * 2006-12-21 2010-06-22 Samsung Electronics Co., Ltd Power amplification apparatus in communication system
CN101435840B (zh) * 2007-11-12 2010-12-15 英业达股份有限公司 主机板测试装置
KR102032907B1 (ko) * 2013-04-22 2019-10-16 삼성전자주식회사 반도체 소자, 반도체 패키지 및 전자 시스템
CN203951677U (zh) * 2014-05-19 2014-11-19 京东方科技集团股份有限公司 一种散热焊盘及印刷电路板
JPWO2017006614A1 (ja) * 2015-07-08 2018-03-08 アルプス電気株式会社 高周波モジュール
TR201817965A2 (tr) * 2018-11-27 2019-02-21 Antenom Anten Teknolojileri A S Anten tasarım donanımı.
JP6888222B2 (ja) * 2019-02-08 2021-06-16 サムソン エレクトロ−メカニックス カンパニーリミテッド． チップアンテナモジュール
CN110099556B (zh) * 2019-03-11 2020-11-24 西安电子科技大学 一种宽带电磁屏蔽结构及其设计方法
CN114204378B (zh) * 2021-12-16 2023-12-12 中国人民解放军陆军工程大学 一种阶梯递减接地模块的制备及其验证方法
CN117656606A (zh) * 2024-01-30 2024-03-08 福建省晋江市泗农建材有限公司 一种耐性强防反射无辐射的陶瓷保温复合板及其生产工艺

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4450449A (en) * 1982-02-25 1984-05-22 Honeywell Inc. Patch array antenna
US4937585A (en) * 1987-09-09 1990-06-26 Phasar Corporation Microwave circuit module, such as an antenna, and method of making same
US4912481A (en) * 1989-01-03 1990-03-27 Westinghouse Electric Corp. Compact multi-frequency antenna array
GB8902421D0 (en) * 1989-02-03 1989-03-22 Secr Defence Antenna array
JPH04326606A (ja) * 1991-04-26 1992-11-16 Sumitomo Electric Ind Ltd 発振回路
EP0588465A1 (de) * 1992-09-11 1994-03-23 Ngk Insulators, Ltd. Keramisches Dielektrikum für Antennen
GB9220414D0 (en) * 1992-09-28 1992-11-11 Pilkington Plc Patch antenna assembly
JP3198661B2 (ja) * 1992-10-14 2001-08-13 株式会社村田製作所 誘電体共振器装置およびその実装構造
US5410449A (en) * 1993-05-24 1995-04-25 Delco Electronics Corp. Heatsink conductor solder pad
JP3196451B2 (ja) * 1993-10-28 2001-08-06 株式会社村田製作所 マイクロストリップアンテナ
US5517612A (en) 1993-11-12 1996-05-14 International Business Machines Corporation Device for scaling real-time image frames in multi-media workstations
JPH07183330A (ja) * 1993-12-22 1995-07-21 Oki Electric Ind Co Ltd 半導体素子の配線基板への接続方法
DE19520700B4 (de) * 1994-06-09 2004-09-09 Samsung Electronics Co., Ltd., Suwon Halbleiterbausteinanordnung
US5559521A (en) * 1994-12-08 1996-09-24 Lucent Technologies Inc. Antennas with means for blocking current in ground planes
JPH09321187A (ja) * 1996-05-27 1997-12-12 Mitsubishi Electric Corp 混成集積回路の製造方法およびその構造
JPH1093474A (ja) * 1996-09-11 1998-04-10 Oki Business:Kk 空中線共用器

Also Published As

Publication number Publication date
EP1127479B1 (de) 2003-01-02
HK1042200A1 (en) 2002-08-02
HK1042200B (zh) 2006-08-11
KR20010075680A (ko) 2001-08-09
DE69904750D1 (de) 2003-02-06
US6281844B1 (en) 2001-08-28
IL142511A0 (en) 2002-03-10
DE69904750T2 (de) 2003-10-16
IL142511A (en) 2005-05-17
CN1324558A (zh) 2001-11-28
EP1127479A1 (de) 2001-08-29
BR9915089A (pt) 2001-07-17
JP2002529920A (ja) 2002-09-10
EP0999728A1 (de) 2000-05-10
AU1267000A (en) 2000-05-22
PL347504A1 (en) 2002-04-08
KR100609204B1 (ko) 2006-08-02
AU755237B2 (en) 2002-12-05
WO2000027174A1 (en) 2000-05-11
CN1231104C (zh) 2005-12-07

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties